ROME, NY -- The ESD Association seeks abstracts for technical papers covering the effects of electrostatic discharge, electrical overstress and static electricity for its 38th Annual EOS/ESD Symposium next September.

The trade group said papers for the Sept. 8-16, 2016, symposium should deal with work in the following areas: advanced CMOS (analog/digital) EOS/ESD and latchup; ESD protection in bipolar, RF, high voltage and BCD technologies; numerical modeling and simulation for on-chip ESD protection; EOS/ESD failure analysis, troubleshooting and case studies; device testing: testers, methods and correlation issues; system-level EOS/ESD/EMC, HMM, EOS/ESD factory level, control and materials technology; chip/module/package EOS/ESD electronic design automation.

Paper submissions should include data and analysis that advance state-of-the-art knowledge, enhance or review general knowledge, or address new topics. The technical program committee especially encourages new areas and fields relevant to EOS and ESD.

Submissions must include a 50-word abstract and a four-page (maximum) summary of the work. The deadline for submission of abstracts and paper summaries is Feb. 26. Late submissions will not be accepted. The final submission deadline for the finished paper is June 3, 2016. Final papers will be limited to a maximum of 10 pages.

The event takes place in Garden Grove (Anaheim), CA.

For more information, click here.

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