MINNEAPOLIS, MN – SMTA requests abstracts for the 10th Annual International Conference on Soldering and Reliability. The conference will take place May 9-11, 2016, in Toronto.

The deadline to submit abstracts is January 15.

Suggested topics include lead-free assembly processes, including test; solder joint reliability under temp cycling, mechanical shock/drop, after aging; harsh environment; tin whiskers; electromigration; thermal dissipation; environmental compliance/regulations; conformal coating; nano-interconnects; package on package; manufacturing process; mechatronics; corrosion; halogen-free laminates; high-density interconnects; thermal interface materials; chip and board level underfills, including solder joint encapsulants; printed electronics; lead-free die attach soldering; nano-scale soldering materials and processes; new solder paste technologies; flex circuits soldering and assembly; wearables; entertainment systems; UPL; LED; robots/drones; alternative interconnects; E surface, and IMAX.

Submit 200- to 300-word abstracts to www.smta.org/icsr/abstracts. Include a title, author name and contact information.

Authors will be notified of acceptance by February 15. Technical papers and presentations are due March 21.

For more information, visit http://www.smta.org/icsr.  

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