HONG KONG – ASM Pacific Technology and Siliconware Precision Industries will establish a joint venture to develop and manufacture molded interconnect substrates for advanced semiconductor chips, the firms announced.

The new JV will include equipment and assets, intellectual property rights and know-how of Interconnect Tech Pte., a Singapore-based MIS developer, which the firms will acquire.

The JV will be called ASM Advanced Packaging Materials. Through its subsidiary, ASMPT will hold a majority of the shares of AAPM, and will also be responsible for managing the business and operations of AAPM.

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