INDIANAPOLIS – ACE Component Services Group and Divisys International will co-host a solderability testing and component lead tinning workshop here Mar. 8.

Attendees will learn the new J-STD-001F requirements and its impacts; differences between solderability testing and component retinning; dip, look and wetting balance solderability test methods, and the motivation behind the need to hot solder dip components.

Topics include tin whisker mitigation; gold embrittlement and removal of gold plating; RoHS and tin-lead component supply chain trends; solderability testing protocols; MIL-STD-883 and J-STD-002 standards; SMT and through-hole component retinning; legacy component refurbishing and RoHS to tin-lead conversion; ANSI/GEIA-STD-0006 component re-tinning requirements, and coplanarity and solder thickness.

Also described will be the removal of gold plating, replacing RoHS component finish with tin-lead, refurbishing of legacy components and tin whisker mitigation as the main drivers behind the increasing awareness of component re-tinning using the hot solder dip method. Recommendations on retinning processes using dual dynamic solder pots, controlled flux application and defined process control in accordance with ANSI/GEIA-STD-0006 to enhance component solderability will be discussed.

The workshop will include a classroom process training session, followed by a Q&A session, as well as one-on-one discussion after the workshop.

For more information, contact Tammie Fish at tammie.fish@divsys.com.

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