SMTA Announces International Conference on Soldering and Reliability Program
MINNEAPOLIS -- The SMTA today announced Michael Osterman, Ph.D., will keynote its annual International Conference on Soldering and Reliability in May in Toronto.
Osterman, a researcher at CALCE/University of Maryland, will discuss remaining issues with Pb-free electronics during the May 9-11 event.
The technical conference features presentations on topics including bismuth-containing solders, micro solder technologies, production assembly processes, soldering processes, polymeric materials, reliability, and conformal coating. Speakers represent companies including BAE Systems, Celestica, Honeywell, IBM, and Rockwell Collins, and schools including Binghamton University, University of Maryland-CALCE-EPSC, University of Seoul, University of Toronto, and University of Waterloo.
The event includes workshops on LED technology, LGA and QFN component manufacturing and solder joint reliability; and designing in reliability by assessing contamination at the component interface.
The SMTA Toronto Expo and Tech Forum will run in conjunction with the ICSR program on May 10. Conference participants may attend the expo for no charge. Complimentary technical presentations will be offered. Check online for more details and the agenda.
Early bird registration deadline is Apr. 8. For more information or to register visit smta.org/icsr.
The event is colocated with the SMTA Toronto Expo.
