ROSEMONT, IL – The program for SMTA International is finalized and registration is open.

The conference will take place here Sept. 25 - 29, featuring 20 workshops and 130 technical papers.

Technical tracks will cover advanced packaging technology; manufacturing excellence - process and assembly; substrate (PCB) issues; flux, solder and adhesives; and inspection technologies.

Three symposia are the Evolving Technologies Summit, Harsh Environments Symposium, and Lead-Free Soldering Technology Symposium.

Workshops include eight new courses on DfX, cleaning, PoP reliability, inspection, surface finishes, and process troubleshooting.

Daniel Kuhl, vice president of engineering at Seagate Technology, will keynote the conference with a presentation on the memory storage explosion and factors influencing global design and architecture, technology progression and infrastructure for manufacturing and validation.

Over 180 exhibiting companies will display equipment, materials, and services Sept. 27 - 28.

For details and to register, visit http://www.smta.org/smtai.

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