Circuits Assembly Online Magazine - News

News

WASHINGTON, DC – Comments on Korea's RoHS-like regulation via the ‘technical barriers to trade’ process are due July 21.

CHANGCHUN, CHINA – EMS firm Surface Mount Technology (Holdings) Ltd. will invest more than $13 million over the next two years in its newest facility, in Changchun. The 108,000 sq. ft. facility, SMT’s fourth, began operation June 28 and will operate under the name Surface Mount Technology (Changchun) Ltd.

SAN JOSE, CA – North American-based manufacturers of semiconductor equipment posted $1.65 billion in orders in June and a book-to-bill ratio of 0.94, according to SEMI.

The three-month average of worldwide bookings was $1.65 billion. The bookings figure is relatively flat with the final May level of $1.64 billion, and about 7% less year-over-year.

The three-month average of worldwide billings was $1.75 billion. The figure is about 5% greater than May, and about 13% greater than June of 2006.

"North American bookings and billings are trending up slightly, and are at their highest levels of the year," said Stanley T. Myers, president and CEO of SEMI. "Based on SEMI midyear consensus forecast data, we expect the semiconductor equipment market to experience strong sales in 2007 of over $40 billion, driven by investments in 300 mm technology and 45 nm tools."

MILPITAS, CA – Lead-Free Soldering, a hardback book from Solectron Corp., offers a collection of practical techniques for lead-free soldering design and manufacture.

The book includes the latest information on proposed changes to lead-free standards, and up-to-date analysis of government and legislative activities and regulations in North America, Europe and Asia.

Written by recognized experts in both academia and industry, Lead-Free Soldering is a guide for practicing engineers interested in the latest developments surrounding areas such as lead-free alloy properties, reflow, wave, rework, solder joint reliability, PCB laminates and surface finishes, and backward and forward compatibility.

To purchase the text for $129, email orders-ny@springer.com.

EL SEGUNDO, CA – Total semiconductor shipments in Greater China—consisting of Mainland China, Hong Kong and Taiwan—totaled $66.3 billion in 2006, up 11.8% from 2005, according to iSuppli Corp.

WASHINGTON, DC – U.S. high-tech goods exports increased by 10% to $220 billion, while imports rose by 9% to $322 billion between 2005 and 2006, according to AeA's first edition of “Trade in the Cyberstates 2007.”

ROME, NY – The ESDA’s annual EOS/ESD symposium will take place at the Disneyland Hotel in Anaheim, CA, Sept. 16 – 21.

This year’s featured plenary speaker, Allan Johnston, principal engineer at the Jet Propulsion Laboratory, will present Space Radiation in Advanced Semiconductor Devices on Sept. 18.

More than 30 tutorials will include topics such as ESD basics for program manager, ESD on-chip protection in advanced and RF technologies, air ionization, EOS/ESD failure models and mechanisms, in-plant ESD survey and evaluation measurements, CDM design and characterization, and more. Also offered is the two-day S20.20 seminar on developing and implementing an ESD control program.

New tutorials include ESD Circuits, ESD Ignition & Fires, Methodologies for Determining the Impact of Static Control Methods, Perfect ESD Storm, Advanced Topics in TLP Testing, Electrical Fields – Practical Considerations for the Factory, Electrostatic Attraction, Automated Handling Processes, and Advanced ESD/EMI/EOS Auditing Techniques.

More than 50 technical sessions from international authors will address such issues as device testing, ESD-RF design considerations, factory/materials, system-level testing, and more.

Ten workshops will be offered, including ESD Control and Design for Extremely Sensitive Devices, Cleanrooms ESD Ionization Guidelines and Considerations, Future of ESD Standards and System Test, and Protecting High Frequency Circuits.

Credit can be earned during tutorials for ESD Certified Professional-Device/Design and ESD Certified Professional-Program Manager; these tests will be offered during the symposium. Visit www.esda.org/certification.html for more information.

The symposium includes an exhibition, a welcome reception, an awards breakfast, a professional and technical women’s reception, an attendee lunch, and the ESD Association annual meeting and luncheon.

The deadline for early registration is July 27. For symposium registration information and to download a complete symposium program, visit www.esda.org/symposia.html.

TAIPEI – Hon Hai, Taiwan's top electronic parts maker, is likely to buy part of the stake Philips wants to sell in South Korea's LG.Philips LCD, local newspapers reported.

Economic Daily News said the move could help Innolux Display, a screen maker that assembles LCD monitors under the Hon Hai group, secure more panels.

Hon Hai officials were not available for comment.

Dutch company Philips Electronics owns about a one-third stake in LG.Philips LCD, the world's No.2 LCD maker, worth about $5.4 billion at current market prices, according to Reuters data.

Philips has said it plans to sell at least part of its stake in LG.Philips once its ownership lockup expires this month.

Japan's Matsushita and Toshiba have also been mentioned as possible candidates to buy Philips' shares.

Earlier this week, the head of LG.Philips LCD said Philips is unlikely to sell its stake in the market, although such a transaction could not be ruled out.

SEOUL – Samsung Electronics’ second-quarter net profit fell 5% year-over-year, says its quarterly report. And profits were down 11% from the first quarter, driven in part by DRAM price decline.

FRANKLIN, MA – Speedline Technologies will present a Webcast on reduction/elimination of two common SMT defects: tombstoning and mid-chip solder balls. The one-hour presentation takes place Aug. 16 at 11 a.m. EDT.

The Webinar will review some of the studies and experiments conducted to determine and eliminate the causes of tombstoning. Specific areas of analysis will include solderability, paste volume, placement issues, and pad surface area/design criteria.

Topics to be reviewed in discussing mid-chip solder ball elimination will include stencil design, board design, reflow profile development, component placement accuracy, and solder paste printing.

To register, visit www.speedlinetech.com/seminars.

MINNEAPOLIS, MN – The 2007 Charles Hutchins Grant Award, cosponsored by Circuits Assembly and SMTA, has been given to Gayatri Cuddalorepatta for her project, Cyclic Plasticity vs. Cyclic Creep Fatigue of SnAgCu (SAC) Solder: A Micromechanics Approach.

SCOTTSDALE, AZ – IC Insights believes Asia-Pacific will continue to gain marketshare and represent almost one-third (32%) of worldwide IC sales in 2011.

Asia-Pacific companies have grown from holding only 2% of the IC market in 1985 to 26% in 2006, says IC Insights. The Asia-Pacific supplier segment is primarily composed of Taiwanese, South Korean, and Chinese companies.

After reaching a high of 51% in 1988, Japanese IC suppliers have displayed a steady decline in marketshare; in 2006, the Japan-headquartered companies' share dropped to only 17% of the IC market. IC Insights believes Japanese companies will continue to lose IC marketshare during the next five years, to a 14% share in 2011.

In 2006, IC companies headquartered in the Americas region held almost half of the worldwide IC sales marketshare, says the firm.

Since 1982, European companies have always held 8-10% of the worldwide IC market. IC Insights believes European companies will stay in this range through 2011.