News
Elk Grove Village, IL-- Sonoscan Inc., a developer and manufacturer of acoustic microscope systems, has been issued a patent (U.S. #6,890,302) that gives engineers a new tool for diagnosing packaging defects. It is one of several patents issued to the company in the past year.
Acoustic microscope echoes are typically time-gated on a depth of interest, and echoes from other depths are ignored. This method, known as time domain imaging, has been the standard for many years. If a 230 MHz transducer is being used, the frequency content of the return echoes at an x-y coordinate will range from about 170 to about 260 MHz or more, and the frequency content characteristic typically varies from one pixel to the next.
A new technique, Frequency Domain Imaging (FDI), separates the various return echoes at each x-y coordinate into their individual frequencies. The result is not a single acoustic image, but typically 20 to 40 different acoustic images, each image made from echoes of a single frequency, and each image having its own contrast and resolution.
Engineers often solve problems involving internal interfaces by comparing the various FDI images. The results for any particular sample depend on the sample and on the materials involved, but typically some FDI images have high resolution, and are useful for performing diagnoses of critical interfaces, such as those in flip chips. In some cases, FDI images display features that are not visible in the time-domain images.
Acoustic microscope echoes are typically time-gated on a depth of interest, and echoes from other depths are ignored. This method, known as time domain imaging, has been the standard for many years. If a 230 MHz transducer is being used, the frequency content of the return echoes at an x-y coordinate will range from about 170 to about 260 MHz or more, and the frequency content characteristic typically varies from one pixel to the next.
A new technique, Frequency Domain Imaging (FDI), separates the various return echoes at each x-y coordinate into their individual frequencies. The result is not a single acoustic image, but typically 20 to 40 different acoustic images, each image made from echoes of a single frequency, and each image having its own contrast and resolution.
Engineers often solve problems involving internal interfaces by comparing the various FDI images. The results for any particular sample depend on the sample and on the materials involved, but typically some FDI images have high resolution, and are useful for performing diagnoses of critical interfaces, such as those in flip chips. In some cases, FDI images display features that are not visible in the time-domain images.
Shenzhen – Exhibitors are lining up to showcase electronics goods at Nepcon/EMT South China 2006, which will be held at the Shenzhen Convention and Exhibition Centre from Aug. 29 to Sept. 1. The four-day expo is expected to bring 18,000 domestic and international visitors, making it the largest in South China.
Nepcon South China allows professional visitors to troubleshoot with esteemed technicians and work out complete SMT solutions. Two highlights of the show are the SMT Zone and the Soldering Zone. EMT South China will feature Test & Measurement, Component Manufacturing and Electronics Manufacturing Services.
Exhibiting companies include Assembleon, Cookson Electronics, Dage, Hitachi, HIWIN, Omron, Panasonic, Samsung, Speedline, Suneast, 3M, Universal, WKK and Yamazen. The show will open up an arena for local industry players to glean knowledge about the industry from international heavyweights and hear about the latest electronics manufacturing products.
Booming market conditions in South China have set the stage for a large turnout at the show. Economic forecasters predict the annual revenue of China’s electronics market to hit $60 billion in 2006, growing 15 to 20% annually. Guangdong’s year on year growth has outstripped all regions throughout China at 12.5%, and it already accounts for 37% of China’s electronics production. In coming years, the province will allocate 53 billion yuan to develop 25 key electronics, bio-medicine, software and IC projects.
Plant managers, proprietors, technical engineers, test and inspection officers and quality control officials are just some of the industry professionals that visit the show to catch up on industry trends and gain crucial market information.
Nepcon South China allows professional visitors to troubleshoot with esteemed technicians and work out complete SMT solutions. Two highlights of the show are the SMT Zone and the Soldering Zone. EMT South China will feature Test & Measurement, Component Manufacturing and Electronics Manufacturing Services.
Exhibiting companies include Assembleon, Cookson Electronics, Dage, Hitachi, HIWIN, Omron, Panasonic, Samsung, Speedline, Suneast, 3M, Universal, WKK and Yamazen. The show will open up an arena for local industry players to glean knowledge about the industry from international heavyweights and hear about the latest electronics manufacturing products.
Booming market conditions in South China have set the stage for a large turnout at the show. Economic forecasters predict the annual revenue of China’s electronics market to hit $60 billion in 2006, growing 15 to 20% annually. Guangdong’s year on year growth has outstripped all regions throughout China at 12.5%, and it already accounts for 37% of China’s electronics production. In coming years, the province will allocate 53 billion yuan to develop 25 key electronics, bio-medicine, software and IC projects.
Plant managers, proprietors, technical engineers, test and inspection officers and quality control officials are just some of the industry professionals that visit the show to catch up on industry trends and gain crucial market information.
Pomona, CA – Everett Charles Technologies will consolidate two of its Capital Equipment Group’s wholly owned German business units, atg Test Systems and Luther Maelzer Gmbh. The reorganization is anticipated to be complete by year-end. Till then, both existing operations will continue to service their respective customers. The units manufacture electrical test systems and related products for the bare PCB industry.
Pat Flynn, ECT president and CEO, said in a statement, “This move will leverage the considerable engineering and software talents of each company to the benefit of their respective customer bases and the market in general.”
Pat Flynn, ECT president and CEO, said in a statement, “This move will leverage the considerable engineering and software talents of each company to the benefit of their respective customer bases and the market in general.”
The consolidated unit will be headed by atg’s managing director, Uwe Rothaug. Hans Higgen, L&M’s managing director, will assume responsibility for the R&D engineering team while atg’s Viktor Romanov will manage the flying probe systems R&D effort.
SIOUX FALLS, SD -- EMS provider Electronic Systems Inc. has been certified to the ISO13485:2003 Medical Device Quality Management Systems Standard by the British Standards Institute (BSI).
"We've worked with our registrar, BSI, for nearly 10 years to assure continued compliance to the ISO 9000 standards so the addition of internal systems to comply with the ISO 13485 has been a straightforward sequence from gap analysis through final implementation," said Jim Subart, quality manager.
"As our company has grown and expanded into the medical device area we have sought to improve and add to our QMS expertise by designing and adding the necessary systems to comply with ISO 13485:2003 as well as ISO 9001:2001", said Gary Larson, president. "The medical device industry continues to be an integral part of our long term growth plan."
"We've worked with our registrar, BSI, for nearly 10 years to assure continued compliance to the ISO 9000 standards so the addition of internal systems to comply with the ISO 13485 has been a straightforward sequence from gap analysis through final implementation," said Jim Subart, quality manager.
"As our company has grown and expanded into the medical device area we have sought to improve and add to our QMS expertise by designing and adding the necessary systems to comply with ISO 13485:2003 as well as ISO 9001:2001", said Gary Larson, president. "The medical device industry continues to be an integral part of our long term growth plan."
Austin, TX -- Increased demand in 2005 resulted in longer delivery times and price increases for laminate flip chip build-up substrates, according to market research firm TechSearch International. While several companies have since added capacity, the situation is expected to remain much the same through the end of this year.
Installed capacity requires time for qualification before substrates can be shipped for production. Approximately 25 weeks are needed to complete incoming engineering evaluation (2 weeks), engineering build (8 weeks) and actual qualification testing (15 weeks).
However, TechSearch notes that the situation should improve in 2007 and 2008 as additional capacity is installed and qualified.
For its analysis, the firm interviewed two dozen laminate substrate suppliers to determine production capacity for build-up FC-PBGA, wire bond PBGA, and laminate CSP substrates.
Installed capacity requires time for qualification before substrates can be shipped for production. Approximately 25 weeks are needed to complete incoming engineering evaluation (2 weeks), engineering build (8 weeks) and actual qualification testing (15 weeks).
However, TechSearch notes that the situation should improve in 2007 and 2008 as additional capacity is installed and qualified.
For its analysis, the firm interviewed two dozen laminate substrate suppliers to determine production capacity for build-up FC-PBGA, wire bond PBGA, and laminate CSP substrates.
SAN JOSE – Worldwide revenue of EMS companies reached $190 billion in 2005, up 14% over 2004, according to a report issued today by Electronic Trend Publications.
According to ETP, the EMS industry was responsible for 23% of the total worldwide electronics assembly, valued at $810 billion. The $190 billion includes all the work done by the EMS companies for OEM customers, explained spokesman Steve Berry.
According to ETP, the EMS industry was responsible for 23% of the total worldwide electronics assembly, valued at $810 billion. The $190 billion includes all the work done by the EMS companies for OEM customers, explained spokesman Steve Berry.
SHENZHEN -- Foxconn has admitted to working employees more than twice China's legal limits.
As reported by Circuits Assembly on June 14, the contract assembler was alleged to have been directing its hourly staff to work as much as 80 extra hours each month.
China labor law permits employees to work no more than 36 hours of overtime per month.
As reported by Circuits Assembly on June 14, the contract assembler was alleged to have been directing its hourly staff to work as much as 80 extra hours each month.
China labor law permits employees to work no more than 36 hours of overtime per month.
Jersey City, NJ – Cookson Electronics Assembly Materials had 23 applications engineers trained and certified as IPC Specialists in May.
“At Cookson Electronics, we are focused on helping our customers meet their electronic assembly objectives by providing them with innovative assembly products and the highest possible level of technical assistance,” said Steve Brown, director – Global Applications Technology. “We train and certify our field applications engineers to the IPC Standards which are used globally by our customers. This is especially important as they transition to lead-free processes in response to the RoHS requirements.
The standards covered during the training session were IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610D Acceptability of Electronic Assemblies.
“At Cookson Electronics, we are focused on helping our customers meet their electronic assembly objectives by providing them with innovative assembly products and the highest possible level of technical assistance,” said Steve Brown, director – Global Applications Technology. “We train and certify our field applications engineers to the IPC Standards which are used globally by our customers. This is especially important as they transition to lead-free processes in response to the RoHS requirements.
The standards covered during the training session were IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610D Acceptability of Electronic Assemblies.
Minneapolis, MN -- The SMTA is again co-locating SMTA International with the Assembly Tech Expo this September in Rosemont, IL. The program will consist of over 100 technical papers, 26 tutorials and special symposiums on Contract Manufacturing, Staying Competitive and Lead-Free Soldering Technology, as well as various free events.
The technical sessions are organized into tracks on Manufacturing and Assembly, Advanced Packaging, Substrates, RoHS, and Process Control.
Full- and half-day educational courses will focus on Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, Test/Inspection/Quality, and Process Control.
The Emerging Technologies Summit will feature sessions on Packaging Space: Nano to Outer, Wireless Technology and Using RFID to Add Value to Your Products and Services. It will conclude with an Emerging Technologies Panel.
The Contract Manufacturing Symposium will consist of two paper sessions: Exploring the Dollars and Sense of EMS and EMS Program Management. The Lead-free Symposium will feature paper sessions on the Joint Council on Aging Aircraft/ Joint Group on Pollution Prevention Lead-Free Solder Project, Lead-Free Manufacturing Experiences and Lead-Free Industry Standards, Lead-Free Fatigue, and Accelerated Life Testing for Lead-Free Solder Joints.
A new Symposium on Staying Competitive in the Global Market will address how to improve your competitive position in your market. The emphasis is on North American issues related to cost, productivity, automation, finance and quality.
Free events include:
The Opening session: What’s Next? Global RoHS and Emerging Technologies
Future Directions for Packaging
NPI and Rapid Setup Aid time to Market
iNEMI Roadmaps
Standards Update
Emerging Technologies
Selecting the Right Lead-Free Cleaning Process
Problem Solving and Reliability Modeling
The conference will include a full day workshop, “Beyond RoHS and WEEE: Preparing for the Energy-Using Products (EuP) Directive & Design for Environment,” co-sponsored by the SMTA, Technology Forecasters and The GoodBye Chain Group.
The technical sessions are organized into tracks on Manufacturing and Assembly, Advanced Packaging, Substrates, RoHS, and Process Control.
Full- and half-day educational courses will focus on Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, Test/Inspection/Quality, and Process Control.
The Emerging Technologies Summit will feature sessions on Packaging Space: Nano to Outer, Wireless Technology and Using RFID to Add Value to Your Products and Services. It will conclude with an Emerging Technologies Panel.
The Contract Manufacturing Symposium will consist of two paper sessions: Exploring the Dollars and Sense of EMS and EMS Program Management. The Lead-free Symposium will feature paper sessions on the Joint Council on Aging Aircraft/ Joint Group on Pollution Prevention Lead-Free Solder Project, Lead-Free Manufacturing Experiences and Lead-Free Industry Standards, Lead-Free Fatigue, and Accelerated Life Testing for Lead-Free Solder Joints.
A new Symposium on Staying Competitive in the Global Market will address how to improve your competitive position in your market. The emphasis is on North American issues related to cost, productivity, automation, finance and quality.
Free events include:
The Opening session: What’s Next? Global RoHS and Emerging Technologies
Future Directions for Packaging
NPI and Rapid Setup Aid time to Market
iNEMI Roadmaps
Standards Update
Emerging Technologies
Selecting the Right Lead-Free Cleaning Process
Problem Solving and Reliability Modeling
The conference will include a full day workshop, “Beyond RoHS and WEEE: Preparing for the Energy-Using Products (EuP) Directive & Design for Environment,” co-sponsored by the SMTA, Technology Forecasters and The GoodBye Chain Group.
For details and to register, visit www.smta.org/smtai .
HERNDON, VA — iNEMI’s High-Reliability RoHS Task Force has published process and reliability guidelines for high-reliability electronics that may include both SnPb and Pb-free parts. Reliability concerns arise due to the differences in processing temperatures and materials.
RoHS5 modules (5 of 6 RoHS materials) are products that are RoHS-compliant, but contain Pb (under an applicable RoHS exemption). RoHS6 modules (6 of 6 RoHS materials) are soldered with Pb-free solder and are fully RoHS-compliant and Pb-free.
With current RoHS exemptions for high-reliability electronics, it is possible for assemblies to contain Pb and still be RoHS-compliant. Manufacturers taking the Pb exemption will continue to require SnPb-compatible components for their products, and may also use subassemblies, such as hard disk drives and power modules, that may or may not be Pb-free.
Thilo Sack, principal engineer, corporate technology, for Celestica and co-chair of the iNEMI High-Reliability RoHS Task Force, noted, “If RoHS6 subassemblies are to be used in RoHS5 products, the subassemblies should be thoroughly qualified to ensure that they will meet the higher reliability requirements of the RoHS5 products. Furthermore, in some cases solders and processes should not be mixed. For example, only BGAs with SnPb solder balls should be used in a SnPb assembly process, and only SAC solder balls in a SAC process.”
The task force recommends that Pb-free Sn finishes on leaded and discrete components only be used when these finishes (1) include suitable tin whisker mitigation practices, per IPC/JEDEC JP002, and (2) have passed Class 2 level tin whisker acceptance testing requirements, per JESD-201. For subassembly modules meeting RoHS5 or RoHS6 requirements, plated leads or pins that will be attached to the PCB should be backward compatible with SnPb assembly processes.
The complete guidelines can be downloaded here:
http://thor.inemi.org/webdownload/projects/ese/High-Reliability_RoHS/High_Rel_position_061206.pdf
The task force consists of OEMs and EMS providers with long service life products and high-reliability requirements, including:
Agilent Technologies, Alcatel, Cisco Systems, Celestica, Delphi Electronics & Safety, HP, Intel, Jabil, Lucent, Plexus, Sanmina-SCI and Sun Microsystems.
RoHS5 modules (5 of 6 RoHS materials) are products that are RoHS-compliant, but contain Pb (under an applicable RoHS exemption). RoHS6 modules (6 of 6 RoHS materials) are soldered with Pb-free solder and are fully RoHS-compliant and Pb-free.
With current RoHS exemptions for high-reliability electronics, it is possible for assemblies to contain Pb and still be RoHS-compliant. Manufacturers taking the Pb exemption will continue to require SnPb-compatible components for their products, and may also use subassemblies, such as hard disk drives and power modules, that may or may not be Pb-free.
Thilo Sack, principal engineer, corporate technology, for Celestica and co-chair of the iNEMI High-Reliability RoHS Task Force, noted, “If RoHS6 subassemblies are to be used in RoHS5 products, the subassemblies should be thoroughly qualified to ensure that they will meet the higher reliability requirements of the RoHS5 products. Furthermore, in some cases solders and processes should not be mixed. For example, only BGAs with SnPb solder balls should be used in a SnPb assembly process, and only SAC solder balls in a SAC process.”
The task force recommends that Pb-free Sn finishes on leaded and discrete components only be used when these finishes (1) include suitable tin whisker mitigation practices, per IPC/JEDEC JP002, and (2) have passed Class 2 level tin whisker acceptance testing requirements, per JESD-201. For subassembly modules meeting RoHS5 or RoHS6 requirements, plated leads or pins that will be attached to the PCB should be backward compatible with SnPb assembly processes.
The complete guidelines can be downloaded here:
http://thor.inemi.org/webdownload/projects/ese/High-Reliability_RoHS/High_Rel_position_061206.pdf
The task force consists of OEMs and EMS providers with long service life products and high-reliability requirements, including:
Agilent Technologies, Alcatel, Cisco Systems, Celestica, Delphi Electronics & Safety, HP, Intel, Jabil, Lucent, Plexus, Sanmina-SCI and Sun Microsystems.
FOSTER CITY, CA -- Arena Solutions, a provider of product lifecycle management software, and components distributor Avnet Electronics Marketing have signed a joint sales and marketing deal that covers both firm's tools and services.
Arena and Avnet will provide a complete, integrated on-demand PLM and component line that includes the latter's extensive component database -- said to number more than 19 million parts.
Avnet will make available purchasing data, and parametric and analytical data, along with documentation from IHS. The combined content database consists of rich data for over 19 million unique electronic components. and includes RoHS and environmental regulation information, product change notifications and part specification data.
Avnet content now can be imported directly into the Arena PLM tool.
Ed.: An earlier version of this story reported that IHS Parts Management would also be involved as a reseller. While Avnet Electronics and IHS have a partnership under which Avnet resell's IHS's content, Arena does not have a reseller agreement with IHS.
Arena and Avnet will provide a complete, integrated on-demand PLM and component line that includes the latter's extensive component database -- said to number more than 19 million parts.
Avnet will make available purchasing data, and parametric and analytical data, along with documentation from IHS. The combined content database consists of rich data for over 19 million unique electronic components. and includes RoHS and environmental regulation information, product change notifications and part specification data.
Avnet content now can be imported directly into the Arena PLM tool.
Ed.: An earlier version of this story reported that IHS Parts Management would also be involved as a reseller. While Avnet Electronics and IHS have a partnership under which Avnet resell's IHS's content, Arena does not have a reseller agreement with IHS.
MILPITAS, CA -- Solectron Corp. last night reported third-quarter net earnings of $42.4 million on sales of $2.7 billion.
The numbers reversed a loss of $66.7 million on $2.6 billion in revenue a year ago.
The numbers reversed a loss of $66.7 million on $2.6 billion in revenue a year ago.
Press Releases
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- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri