News
SAN FRANCISCO – Fabrinet, a leading EMS provider, has received TL 9000QMS certification for manufacturing of electronic assemblies and optical devices.
Fabrinet gained certification for its campuses near Bangkok, where Fabrinet has over 500,000 sq. ft. of manufacturing space and over 4500 employees.
“Receiving TL9000 certification represents a culmination of our efforts to make Fabrinet a world-class manufacturing outsourcing destination for companies throughout the telecommunications spectrum, from component vendors to system vendors,” said Tom Mitchell, chairman and CEO of Fabrinet.
“Being TL 9000 certified means that Fabrinet can now meet the quality requirements of the worldwide telecommunications industry.”
TL 9000 defines quality system requirements for design, development, production, delivery, installation, and maintenance of telecom products and services.
Fabrinet gained certification for its campuses near Bangkok, where Fabrinet has over 500,000 sq. ft. of manufacturing space and over 4500 employees.
“Receiving TL9000 certification represents a culmination of our efforts to make Fabrinet a world-class manufacturing outsourcing destination for companies throughout the telecommunications spectrum, from component vendors to system vendors,” said Tom Mitchell, chairman and CEO of Fabrinet.
“Being TL 9000 certified means that Fabrinet can now meet the quality requirements of the worldwide telecommunications industry.”
TL 9000 defines quality system requirements for design, development, production, delivery, installation, and maintenance of telecom products and services.
MANKATO, MN -- EMS provider Winland Electronics Inc. has signed a new three-year agreement with Select Comfort Corp.
Winland will manufacture about half of the electronics assemblies for Select Comfort's Sleep Number adjustable-firmness bed. Winland will also remain the exclusive supplier of all products it manufactures for Plymouth-based Select Comfort through at least June 30.
The new agreement replaces a previous agreement that was set to expire in August. Winland has revised its prices and will see a lower margin as a result.
ST. PETERSBURG, FL -- Jabil Circuit Inc. on Wednesday reported a 50% jump in profit for its fiscal second quarter.
For quarter ended Feb. 28, the EMS provider reported profits of $69 million on a 35% spike in revenue, to $2.3 billion.
For quarter ended Feb. 28, the EMS provider reported profits of $69 million on a 35% spike in revenue, to $2.3 billion.
SEATTLE -- Microsoft will increase supplies of its Xbox
360 games console to retailers by two to three times, beginning this
week.
The company, which due to component shortages has struggled with production of the popular device, has lowered its target to 4.5 million to 5.5 million units to be shipped by June.
The component situation has been resolved, the company said.
Microsoft outsources production of the consoles to Wistron, Flextronics and Celestica.
SAN JOSE -- Verigy Pte. Ltd., the ATE branch of Agilent which is on track to be spun off, will outsource its manufacturing to Flextronics beginning later this year.
The plan was detailed in a S-1 filing required as part of Verigy's proposed initial public offering.
The plan was detailed in a S-1 filing required as part of Verigy's proposed initial public offering.
NEW YORK -- IBM has signed a long-term contract with Solectron Corp. to manage billions of dollars in indirect procurement services across 17 countries. Other terms of the contract were not disclosed.
Under the contract, IBM will manage more than $1.2 billion per year of indirect spend for temporary contract services, office equipment, utilities and telecommunications. IBM will integrate its procurement software with Solectron's internal systems and controls.
IBM will enable Web-based requisitioning as well as efficient procurement and supplier payment.
"The savings we expect from this contract with IBM will contribute to both operational and process innovation and simplification, which improves services to our customers and suppliers," says Perry Mulligan, chief procurement officer, Solectron, in a prepared statement.
IBM will supply commodity experts, a global contact center and an accounts payable processing center supporting Solectron suppliers and employees around the globe. Solectron will also have access to a full range of transformation and maintenance services from IBM.
Under the contract, IBM will manage more than $1.2 billion per year of indirect spend for temporary contract services, office equipment, utilities and telecommunications. IBM will integrate its procurement software with Solectron's internal systems and controls.
IBM will enable Web-based requisitioning as well as efficient procurement and supplier payment.
"The savings we expect from this contract with IBM will contribute to both operational and process innovation and simplification, which improves services to our customers and suppliers," says Perry Mulligan, chief procurement officer, Solectron, in a prepared statement.
IBM will supply commodity experts, a global contact center and an accounts payable processing center supporting Solectron suppliers and employees around the globe. Solectron will also have access to a full range of transformation and maintenance services from IBM.
SAN JOSE -- The Semiconductor Industry Association today launched a new website on America’s competitiveness. The site is the latest in a series of activities designed to focus attention on steps to take to ensure American leadership in innovation and technology.
The site, located at www.choosetocompete.org, details the industry’s importance to the everyday life of Americans and the need for public policies that foster a competitive economic environment for Information Technology industries.
“For more than 50 years, America has been the world leader in innovation and technology,” said SIA president George Scalise. “Leadership in innovation and technology has been essential to continuous improvements in the U.S. standard of living, increased productivity and higher wages for American workers, and ensuring national security. Today other nations are working very hard to replicate our model for success. This Website presents a series of broadly supported public policy initiatives designed to meet the new global competitive challenge and secure America’s leadership in technology and innovation.”
The site includes information showing the importance of increased federal support for basic research at U.S. universities, updated education and immigration policies that will allow American companies to maintain employment within its borders, and economic policies that enhance the climate for investment in high-tech facilities for manufacturing, research and development, and product design.
Other areas of the site provide information on critical applications of chip technology – from agriculture to medical science and national defense. The site also features news updates on the growing momentum for action on bipartisan proposals on American competitiveness, information on proposed legislation and links to partner Websites.
In April SIA will add an interactive tool outlining the key points in the modern technology timeline, illustrating the critical role of semiconductors in a broad range of applications, and presenting the challenges now faced by America’s technology sector.
The site, located at www.choosetocompete.org, details the industry’s importance to the everyday life of Americans and the need for public policies that foster a competitive economic environment for Information Technology industries.
“For more than 50 years, America has been the world leader in innovation and technology,” said SIA president George Scalise. “Leadership in innovation and technology has been essential to continuous improvements in the U.S. standard of living, increased productivity and higher wages for American workers, and ensuring national security. Today other nations are working very hard to replicate our model for success. This Website presents a series of broadly supported public policy initiatives designed to meet the new global competitive challenge and secure America’s leadership in technology and innovation.”
The site includes information showing the importance of increased federal support for basic research at U.S. universities, updated education and immigration policies that will allow American companies to maintain employment within its borders, and economic policies that enhance the climate for investment in high-tech facilities for manufacturing, research and development, and product design.
Other areas of the site provide information on critical applications of chip technology – from agriculture to medical science and national defense. The site also features news updates on the growing momentum for action on bipartisan proposals on American competitiveness, information on proposed legislation and links to partner Websites.
In April SIA will add an interactive tool outlining the key points in the modern technology timeline, illustrating the critical role of semiconductors in a broad range of applications, and presenting the challenges now faced by America’s technology sector.
Rome, NY – The ESD Association has scheduled an ESD Device/Design Seminar to be held at its Rome headquarters May 1-2. Developed by the ESDA’s Professional Education Committee, the technical seminar will cover on-chip ESD protection designs.
The seminar will focus on: ESD in the industrial semiconductor IC context; ESD models and ESD testing; ESD device operation; ESD circuit operation; technology impact on ESD design choices; special circuit requirements, including RF, and their impact on ESD; CDM ESD protection; and design examples and case studies.
The course is required for ESD Certified Professional-Device/Design certification.
Instructors are Charvaka Duvvury, Ph.D., Texas Instruments, and James W. Miller, Freescale.
For more information, visit esda.org/documents/DeviceDesignSeminar-2006_Rome.pdf
The seminar will focus on: ESD in the industrial semiconductor IC context; ESD models and ESD testing; ESD device operation; ESD circuit operation; technology impact on ESD design choices; special circuit requirements, including RF, and their impact on ESD; CDM ESD protection; and design examples and case studies.
The course is required for ESD Certified Professional-Device/Design certification.
Instructors are Charvaka Duvvury, Ph.D., Texas Instruments, and James W. Miller, Freescale.
For more information, visit esda.org/documents/DeviceDesignSeminar-2006_Rome.pdf
SEATTLE -- Microsoft has delayed -- again -- the launch of its Windows Vista operating system, pushing out the next generation software for PC consumers to January 2007. Business customers will get in the door a couple months earlier, in November.
Analysts are mixed on whether the delay will impact overall PC sales, but the consensus is that buyers will wait the extra few months for the new OS. Thus, fourth quarter shipments might not be as robust as previously forecast.
Analysts are mixed on whether the delay will impact overall PC sales, but the consensus is that buyers will wait the extra few months for the new OS. Thus, fourth quarter shipments might not be as robust as previously forecast.
HERNDON, VA — Registrations for iNEMI’s April 5 roadmap workshop are due March 28, the consortium said today.
The full-day meeting, co-sponsored by Fraunhofer IZM, IEEE’s CPMT (Components, Packaging and Manufacturing Technology) Society and IMAPS Europe, takes place at the ICM Congress Hall at Munich Messe.
It coincides with SemiCon Europa, also in Munich.
The workshop will give attendees an advance review of draft chapters of the 2007 iNEMI Roadmap, including two key market segments and eight of the 19 technology and infrastructure areas covered:
Product sectors include automotive products and consumer/portable products. Technology areas include Packaging, board assembly, organic substrates, ceramic substrates, sensors, test, inspection and measurement, final assembly and environmentally conscious electronics.
Attendees' input be be incorporated in the 2007 Roadmap.
The registration fee is $200 and includes a copy of the 2007 iNEMI Roadmap CD. Registration deadline is March 28. For information click here.
For information about SemiCon Europa, click here.
Every two years iNEMI updates its compendium of future manufacturing technology needs of the global electronics industry. The roadmap has become recognized as an important tool for defining the state of the art in electronics as well as identifying emerging and disruptive technologies.
SIOUX FALLS, SD – Electronic Systems Inc. recently shared lessons learned from its RoHS compliant processes at a workshop for executives and engineers.
About 70 persons from two dozen electronics companies attended the in Bloomington, MN, seminar to hear the EMS company, which has RoHS compliant products in production and pilot stages, describe everything from solder materials and profiles to supply chain management.
ESI said the seminar was meant to be a jump start for those who’ve not yet committed to a RoHS strategy. The first deadline for compliance is July 1, 2006.
According to company vice chairman Leo Reynolds, the seminar was not for “answer(ing) the unanswerable questions but rather to make our customers aware of the impending deadline and jog them into the realization that they need to be very aware of what may or may not have to do with their products and processes.”
Questions revolved around tin whiskering, preferred PWB finishes and soldering temperatures, he told Circuits Assembly. There were “a lot of questions on component availability and compliance [and] on verifying compliance, how can the EMS company ensure that every component is in fact lead-free compliant.”
“Obviously, there are as many unanswerable questions as there are solid ones in this whole RoHS issue.”
Speakers included Tony Hilvers, vice president of industry programs at IPC, who reviewed RoHS requirements and discussed issues related to managing the supply chain, processes and verification. Dave Paluck, ESI manufacturing engineering supervisor, gave an overview of the company’s soldering and assembly processes, while director of program management Steve Hillesheim explained the logistics and planning needed for an OEM to move product into compliance.
About 70 persons from two dozen electronics companies attended the in Bloomington, MN, seminar to hear the EMS company, which has RoHS compliant products in production and pilot stages, describe everything from solder materials and profiles to supply chain management.
ESI said the seminar was meant to be a jump start for those who’ve not yet committed to a RoHS strategy. The first deadline for compliance is July 1, 2006.
According to company vice chairman Leo Reynolds, the seminar was not for “answer(ing) the unanswerable questions but rather to make our customers aware of the impending deadline and jog them into the realization that they need to be very aware of what may or may not have to do with their products and processes.”
Questions revolved around tin whiskering, preferred PWB finishes and soldering temperatures, he told Circuits Assembly. There were “a lot of questions on component availability and compliance [and] on verifying compliance, how can the EMS company ensure that every component is in fact lead-free compliant.”
“Obviously, there are as many unanswerable questions as there are solid ones in this whole RoHS issue.”
Speakers included Tony Hilvers, vice president of industry programs at IPC, who reviewed RoHS requirements and discussed issues related to managing the supply chain, processes and verification. Dave Paluck, ESI manufacturing engineering supervisor, gave an overview of the company’s soldering and assembly processes, while director of program management Steve Hillesheim explained the logistics and planning needed for an OEM to move product into compliance.
The U.S. Supreme Court is hearing arguments in a case that attorneys say stretches the boundaries of what should be patentable, Circuits Assembly's Mike Buetow reports in today's blog.
http://circuitsassembly.com/blog/
http://circuitsassembly.com/blog/
Press Releases
- Surf-Tech Manufacturing Corp. Ensures World-Class Quality with Advanced Conformal Coating Services
- Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics
- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri