News
MINNEAPOLIS -- CyberOptics reported fourth-quarter sales of $12.1 million, up 17% sequentially and 7.9% year-over-year. For the period ended Dec. 31, net income was $5.2 million, including non-cash income of $3.7 million, up from $626,000 or in the third quarter and $794,000 last year.
Revenue and earnings exceeded company guidance.
Revenue and earnings exceeded company guidance.
Clinton, NY – Assembly materials supplier Indium Corp. offers an Electronics Assembly Reliability Program to meet the performance challenges facing electronics assemblers. The program combines products, service and technologies to optimize finished goods reliability.
Products featured in the reliability program include:
Indium5.1 Pb-Free, No-Clean Solder Paste -Addresses via-in-pad voiding, CSP printing for SMT Reliability.
Wave Solder Products (WF7742, PIP+ Preforms) -Addresses incomplete barrel fill with Pb-Free alloys for PTH Reliability.
No-Flow Underfills (NF220, NF260) -Addresses joint cracking due to brittle Pb-Free alloys and reduced-size joints for CSP Reliability.
Thermal Interface Materials (solder TIM) -Addresses thermal performance issues caused by increased power and reduced component size for Thermal Reliability.
The program also offers customers new process and application concepts as well as the industry’s largest SMTA-certified engineering staff, an online interactive technology knowledgebase and online Pb-free readiness assessment software.
For more info, visit indium.com/reliability .
Products featured in the reliability program include:
Indium5.1 Pb-Free, No-Clean Solder Paste -Addresses via-in-pad voiding, CSP printing for SMT Reliability.
Wave Solder Products (WF7742, PIP+ Preforms) -Addresses incomplete barrel fill with Pb-Free alloys for PTH Reliability.
No-Flow Underfills (NF220, NF260) -Addresses joint cracking due to brittle Pb-Free alloys and reduced-size joints for CSP Reliability.
Thermal Interface Materials (solder TIM) -Addresses thermal performance issues caused by increased power and reduced component size for Thermal Reliability.
The program also offers customers new process and application concepts as well as the industry’s largest SMTA-certified engineering staff, an online interactive technology knowledgebase and online Pb-free readiness assessment software.
For more info, visit indium.com/reliability .
Edina, MN --The SMTA is seeking papers for its third annual International Wafer-Level Packaging Conference and Exhibition. The event will take place on Nov. 2-3 in San Jose, CA, and will track IC packaging and test technologies with emphasis on 3-D stacked packaging.
Submit 200-word abstracts by e-mail to Melissa Serres (melissa@smta.org) by April 1.
Dr. Ken Gilleo, ET-Trends LLC, Circuits Assembly columnist and SMTA VP of Technical Programs, and Terry Thompson of Chip Scale Review will co-chair the technical program.
Submit 200-word abstracts by e-mail to Melissa Serres (melissa@smta.org) by April 1.
Dr. Ken Gilleo, ET-Trends LLC, Circuits Assembly columnist and SMTA VP of Technical Programs, and Terry Thompson of Chip Scale Review will co-chair the technical program.
Edina, MN -- The SMTA and Auburn University are organizing a Harsh Environment Electronics Workshop to be held July 19-20 in Indianapolis, IN. The workshop on automotive, space, military and avionics-type harsh environments is soliciting abstracts that provide new, timely information to attendees on the latest developments.
The deadline for abstracts is March 1.
Specific subject areas include,:
· Issues and Opportunities- Automotive Harsh Environment
· Activities in Semiconductor Technology for Harsh Environment Electronics
· Issues with Harsh Vehicle Systems
· Substrate Advancements for Harsh Environment Electronics
· Next Generation Harsh Automotive Systems
· Connectors and Interconnect Technology
· Lead-Free Implementation for Harsh Environment Electronics
· Advancements in Materials for Harsh Environment Electronics
Send a 200-300 word abstract to Melissa Serres (melissa@smta.org), and include: Name, Company, Mailing Address, Telephone Number, Fax Number, E-Mail Address and Presentation Title.
For more info, visit smta.org/education/symposia/symposia.cfm#harsh
Pittsburgh, PA – DesignAdvance Systems, Inc., an electronic design automation (EDA) and computer aided design (CAD) software developer, has completed a $3 million second round of funding.
Randy Eager, CEO, noted that the additional funds will be used to “add the necessary sales, support and marketing staff to hit our sales targets for 2006 and beyond.”
The company has also graduated from The Technology Collaborative Jumpstart program. The economic development organization supports the growth of
Pennsylvania’s digital technologies, robotics and cyber-security industries.
“The resources and infrastructure of The Technology Collaborative gave us many advantages we needed to start and run our business,” continued Eager. “They provided us with initial contacts to potential customers; rent free office space next to Carnegie Mellon University, our technology licensor; and a sounding board for new ideas.”
Randy Eager, CEO, noted that the additional funds will be used to “add the necessary sales, support and marketing staff to hit our sales targets for 2006 and beyond.”
The company has also graduated from The Technology Collaborative Jumpstart program. The economic development organization supports the growth of
Pennsylvania’s digital technologies, robotics and cyber-security industries.
“The resources and infrastructure of The Technology Collaborative gave us many advantages we needed to start and run our business,” continued Eager. “They provided us with initial contacts to potential customers; rent free office space next to Carnegie Mellon University, our technology licensor; and a sounding board for new ideas.”
DesignAdvance has debuted its first product, CircuitSpace, and has strategic partnering agreements with Cadence Design Systems, Mentor Graphics and Valor Computerized Systems.
Breda, Holland -- One issue facing manufacturers transitioning to Pb-free soldering is the threat of cross-contamination between Pb-bearing and Pb-free materials. To help, materials supplier Cobar BV has instituted a simple, recognizable color coding standard for its solder paste products to distinguish Pb-bearing from Pb-free.
Pb-free solder pastes will now be packaged in green containers, while Pb-bearing pastes will continue to ship in white containers. There is no difference in the quality of the packaging material.
Cobar is the latest to join the ranks of solder vendors using color-coded packaging to aid in distinguishing lead and lead-free materials. Indium and Kester, among others, also package solder in similar fashion.
Pb-free solder pastes will now be packaged in green containers, while Pb-bearing pastes will continue to ship in white containers. There is no difference in the quality of the packaging material.
Cobar is the latest to join the ranks of solder vendors using color-coded packaging to aid in distinguishing lead and lead-free materials. Indium and Kester, among others, also package solder in similar fashion.
ANAHEIM, CA — Another Apex has come and gone, and what have we learned?
That the industry is busier today than it was a year ago.
That most -- but not all -- companies expect another solid year in 2006.
That the industry is busier today than it was a year ago.
That most -- but not all -- companies expect another solid year in 2006.
ATLANTA -- Industry analyst Walt Custer will present his take on the global economic situation in a free presentation over the Internet later this month.
The live two-hour Webinar takes place Feb. 28, at 2 pm EST. To register, go to www.pbrseminars.com.
The live two-hour Webinar takes place Feb. 28, at 2 pm EST. To register, go to www.pbrseminars.com.
SARATOGA, CA – Revenues and unit sales of
ICs worldwide are expected to be in the double digits, says a leading research firm.
Revenues and unit sales grew 7.8% and 10.6%, respectively, in 2005, Advanced Forecasting said.
Revenues and unit sales grew 7.8% and 10.6%, respectively, in 2005, Advanced Forecasting said.
SAN JOSE -- IBM Technology Group director Tim Collopy will keynote the IEEE International
Reliability Physics Symposium this year’.
IRPS will be held March 26 to 30, in San Jose.
Collopy’ will address adaptating reliability methodologies to market expectations and technology roadmaps. He asserts that fundamental reliability models and qualification methods have not changed in decades. In order to accommodate unique customer requirements (e.g., foundry) or industry standards, Collopy suggests enhanced quality processes and the stress, analysis and repair of new fail modes uncovered during new technology development.
The addition of feedback from the full spectrum of users to verify these models and methods allows for continuous improvement of quality processes, just as customers demand of microelectronic products and technologies.
Collopy joined IBM in 1974 and has served in his current position since 2001. He graduated the University of Missouri – Rolla with bachelor's degrees in mathematics and electrical engineering, and a master's in operations research, and has an MBA in plans and controls from Union College.
He has previously held management positions in process engineering, diagnostics and characterization, manufacturing engineering, reliability engineering and analytical services at IBM's East Fishkill, NY ,semiconductor facility.
Visit the IRPS Website at irps.org.
IRPS will be held March 26 to 30, in San Jose.
Collopy’ will address adaptating reliability methodologies to market expectations and technology roadmaps. He asserts that fundamental reliability models and qualification methods have not changed in decades. In order to accommodate unique customer requirements (e.g., foundry) or industry standards, Collopy suggests enhanced quality processes and the stress, analysis and repair of new fail modes uncovered during new technology development.
The addition of feedback from the full spectrum of users to verify these models and methods allows for continuous improvement of quality processes, just as customers demand of microelectronic products and technologies.
Collopy joined IBM in 1974 and has served in his current position since 2001. He graduated the University of Missouri – Rolla with bachelor's degrees in mathematics and electrical engineering, and a master's in operations research, and has an MBA in plans and controls from Union College.
He has previously held management positions in process engineering, diagnostics and characterization, manufacturing engineering, reliability engineering and analytical services at IBM's East Fishkill, NY ,semiconductor facility.
Visit the IRPS Website at irps.org.
HAUPPAUGE, NY -- Jaco Electronics Inc. today reported second-quarter net sales of $48.1 million, down from $52 million last year, for the period ended Dec. 31.
The distributor of electronic components reported an operating loss of $180,000, down from $1.7 million a year ago. The net loss widened, however, to $7.4 million from $1.5 million last year.
During the quarter, gross profit margin and SG&A expenses improved. Gross profit margin improved to 13.9%, while SG&A expenses as a percentage of net sales declined to 14.3% from 16% in the prior year.
In a statement, Jaco chairman and chief executive Joel Girsky said, "Early in fiscal Q3, we announced another multi-million dollar electronic voting machine manufacturing order. The new contract was for 5,000 flat panel touchscreen machines." Other recent orders were for gaming machines, military and medical applications, he said.
The distributor of electronic components reported an operating loss of $180,000, down from $1.7 million a year ago. The net loss widened, however, to $7.4 million from $1.5 million last year.
During the quarter, gross profit margin and SG&A expenses improved. Gross profit margin improved to 13.9%, while SG&A expenses as a percentage of net sales declined to 14.3% from 16% in the prior year.
In a statement, Jaco chairman and chief executive Joel Girsky said, "Early in fiscal Q3, we announced another multi-million dollar electronic voting machine manufacturing order. The new contract was for 5,000 flat panel touchscreen machines." Other recent orders were for gaming machines, military and medical applications, he said.
ATLANTA – Circuits Assembly today announced the winners of its 2006 Service Excellence Awards for EMS providers and electronics assembly equipment, materials and software suppliers.
Circuits Assembly recognized the companies that received the highest customer service ratings, as judged by their own customers, during a ceremony last night at the Apex trade show in Anaheim, CA.
Circuits Assembly recognized the companies that received the highest customer service ratings, as judged by their own customers, during a ceremony last night at the Apex trade show in Anaheim, CA.
Press Releases
- Surf-Tech Manufacturing Corp. Ensures World-Class Quality with Advanced Conformal Coating Services
- Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics
- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri