News
MILPITAS, CA -- Solectron
Corp. today named Dr. Linda Capuano senior vice president
of design and engineering, a new position, responsible for services and collaborative
engineering.
WASHINGTON -- With Congressional action
to mark up DTV legislation approaching rapidly, 31 CEOs and corporate
presidents of leading U.S. high-tech companies are calling on the House
and Senate Commerce Committees to enact a "hard date" now for the
successful conclusion of the transition from analog to digital
television.
Among those who signed the letter are Alcatel North America President and CEO Hubert de Pesquidoux, Aloha Partners President and CEO Charles Townsend, AT&T Chairman and CEO David Dorman, Cisco Systems President and CEO John Chambers, Dell President and CEO Kevin Rollins, Intel Corporation Chairman Craig R. Barrett, Microsoft Chairman Bill Gates, QUALCOMM CEO Paul E. Jacobs, Texas Instruments President and CEO Richard K. Templeton, and T-Mobile USA President and CEO Robert Dotson.
Among those who signed the letter are Alcatel North America President and CEO Hubert de Pesquidoux, Aloha Partners President and CEO Charles Townsend, AT&T Chairman and CEO David Dorman, Cisco Systems President and CEO John Chambers, Dell President and CEO Kevin Rollins, Intel Corporation Chairman Craig R. Barrett, Microsoft Chairman Bill Gates, QUALCOMM CEO Paul E. Jacobs, Texas Instruments President and CEO Richard K. Templeton, and T-Mobile USA President and CEO Robert Dotson.
GLEN COVE, NY -- Photocircuits Corp., once the largest
independent manufacturer of
printed circuit boards in North America, has filed for Chapter 11
bankruptcy. The filing involves only the company’s U.S. operations
and does not affect its Costa Rica or Philippine operations.
The company is seeking a new long-term equity investor.
FRANKLIN, MA – Speedline Technologies has been granted a patent for an analysis technique
used to quantify the amount and geometry of solder paste between printed deposits.
US Patent 6,891,967 describes a technique that uses the texture of solder paste to identify its position relative to the pad and soldermask.
US Patent 6,891,967 describes a technique that uses the texture of solder paste to identify its position relative to the pad and soldermask.
DES PLAINES, IL — Kester will hike prices on many of its fluxes, thinners and other chemical products in response to rising costs for raw
materials used in chemical products.
The move is effective Oct. 15.
The move is effective Oct. 15.
New Tripoli, PA – High demand for digital consumer and mobile applications is driving demand for high-density packages, according a recent report by The Information Network. The group projects total HDP market growth of 32% in 2005, reaching 1.5 billion units.
“High-density packages result in a smaller overall package when compared to packaged components performing the same function,” said Dr. Robert N. Castellano, president. “They are ideal for small portable devices such as cellphones, digital audio and Bluetooth-enabled products.”
The report projects 21% growth in 2006, to 1.8 billion units.
The HDP was dominated by the Communications sector in 2003, which held a 82.9% share, followed by the Consumer sector with an 11% share. These sectors are predicted to rise 76.4% and 18%, respectively, by 2008.
System-in Package (SiPs) represented 61.1% of the MCM-L market in 2003 but will grow to a 72.9% share in 2008.
“From a technical perspective there is indeed a difference between MCM, MCP and SiP in the incorporation of passive components,” added Dr. Castellano. “From a market analysis perspective, there really is no differentiation among these three terms due to the commonality of advantages, namely: small size, lower cost of ownership, enhanced electrical performance and reduced time to market.”
“High-density packages result in a smaller overall package when compared to packaged components performing the same function,” said Dr. Robert N. Castellano, president. “They are ideal for small portable devices such as cellphones, digital audio and Bluetooth-enabled products.”
The report projects 21% growth in 2006, to 1.8 billion units.
The HDP was dominated by the Communications sector in 2003, which held a 82.9% share, followed by the Consumer sector with an 11% share. These sectors are predicted to rise 76.4% and 18%, respectively, by 2008.
System-in Package (SiPs) represented 61.1% of the MCM-L market in 2003 but will grow to a 72.9% share in 2008.
“From a technical perspective there is indeed a difference between MCM, MCP and SiP in the incorporation of passive components,” added Dr. Castellano. “From a market analysis perspective, there really is no differentiation among these three terms due to the commonality of advantages, namely: small size, lower cost of ownership, enhanced electrical performance and reduced time to market.”
FRANKLIN, MA –Speedline Technologies’ recent award of seven new U.S. patents lifts the company’s total above 400, 150 of which are active. The company has another 90 patents pending.
The recently awarded patents involve:
* "Apparatus for Calibrating a Dispensing System"
* “Filtration of Flux Contaminants"
* "Needle Cleaning System"
* "Reflow Soldering Apparatus and Method for Selective Infrared Heating"
* "Selective Gas Knife for Wave Soldering"
* "System and Method for Controlling a Conveyor System Configuration to
Accommodate Different Size Substrates"
* "System and Method for Detecting Defects in Printed Solder Paste"
“At Speedline Technologies, ‘process knowledge leader’ is more than a positioning statement – it is our vision and passion,” said Dr. Gerald Pham-Van-Diep, director of advanced development. “But even more importantly, our commitment extends past the R&D process – through implementation.”
Patented Speedline innovations include: Look up and down vision probe technology; Parallel processing within the printer; Inspection techniques within printers and dispensers; Pressurized printing technologies; Accurate dispensing technologies; Reflow and flux management techniques; and Debridging techniques in wave soldering machines.
Speedline Technologies, speedlinetech.com
The recently awarded patents involve:
* "Apparatus for Calibrating a Dispensing System"
* “Filtration of Flux Contaminants"
* "Needle Cleaning System"
* "Reflow Soldering Apparatus and Method for Selective Infrared Heating"
* "Selective Gas Knife for Wave Soldering"
* "System and Method for Controlling a Conveyor System Configuration to
Accommodate Different Size Substrates"
* "System and Method for Detecting Defects in Printed Solder Paste"
“At Speedline Technologies, ‘process knowledge leader’ is more than a positioning statement – it is our vision and passion,” said Dr. Gerald Pham-Van-Diep, director of advanced development. “But even more importantly, our commitment extends past the R&D process – through implementation.”
Patented Speedline innovations include: Look up and down vision probe technology; Parallel processing within the printer; Inspection techniques within printers and dispensers; Pressurized printing technologies; Accurate dispensing technologies; Reflow and flux management techniques; and Debridging techniques in wave soldering machines.
Speedline Technologies, speedlinetech.com
CAMBRIDGE, MA, and CHICAGO- Electronics distributor Newark InOne has launched a Punchout/Roundtrip site for its eProcurement customers, offering access to more than 2.1 million electronic products and improved capabilities such as parametric search, advanced search, navigation by attributes and a BOM upload.
The new search capabilities, powered by Endeca (endeca.com), produce results that can be compared and sorted by desirable dimensions, attributes or criteria. Presented in a familiar parametric search interface, the search engine allows design engineers and buyers to find products and avoid the pitfalls of traditional parametric solutions.
The solution is part of Endeca’s recently launched Manufacturing & Distribution Search Solutions, a combination of information retrieval applications and services expertise tailored for manufacturing and supplier environments.
The new search capabilities, powered by Endeca (endeca.com), produce results that can be compared and sorted by desirable dimensions, attributes or criteria. Presented in a familiar parametric search interface, the search engine allows design engineers and buyers to find products and avoid the pitfalls of traditional parametric solutions.
The solution is part of Endeca’s recently launched Manufacturing & Distribution Search Solutions, a combination of information retrieval applications and services expertise tailored for manufacturing and supplier environments.
Simi Valley, CA – View Engineering has acquired the assets of privately held Micro-Metric,
hoping to strengthen its core capabilities in electronic assembly and
data storage, and extending the company’s offerings into
nanometerology.
No changes in management or staffing of either company are planned. Micro-Metric will continue to operate from its headquarters in San Jose.
No changes in management or staffing of either company are planned. Micro-Metric will continue to operate from its headquarters in San Jose.
TROY, MI -- Months after posting staggering first-half net losses of $741 million, Delphi Corp., the
largest maker of auto parts in North America, filed for Chapter 11
bankruptcy on Saturday. The company plans to slash manufacturing
operations in the U.S.
BINGHAMTON, NY – Universal Instruments Corp. will cut 30 staff from its
Binghamton headquarters and move nearly 20 software engineering jobs
from Bangalore to Binghamton as part of a company-wide restructuring.
The moves are due to lower than expected business volumes, the company
said in a press release today.
Minneapolis, MN -- The SMTA has added four new board members to serve three-year terms. New to the board are: Dr. Dan Baldwin, Engent; Dr. Denis Barbini, Vitronics-Soltec; Jim Kuehn, Tyco Electronics Automation Group; and Dr. Ning-Cheng Lee, Indium Corp. of America.
They will join these existing members: president David Raby, STI Electronics; VP technical programs Dr. Ken Gilleo, ET-Trends; VP communications Steve Greathous, Intel Corp.; secretary Irene Sterian, Celestica; Planning Committee chairperson Bill Barthel, Plexus Corp.; and Planning
Committee members Dick Russell, Phoenix Designs; Emmanuel "Manno" Siméus, Raytheon Missile Systems; and Dr. Laura Turbini, University of Toronto.
They will join these existing members: president David Raby, STI Electronics; VP technical programs Dr. Ken Gilleo, ET-Trends; VP communications Steve Greathous, Intel Corp.; secretary Irene Sterian, Celestica; Planning Committee chairperson Bill Barthel, Plexus Corp.; and Planning
Committee members Dick Russell, Phoenix Designs; Emmanuel "Manno" Siméus, Raytheon Missile Systems; and Dr. Laura Turbini, University of Toronto.
Press Releases
- Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics
- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri
- ROCKA Solutions Continues Expansion in Brazil with New Location in Manaus