News
FRANKLIN, MA -- Speedline Technologies will tackle the SMT industry's most pressing manufacturing challenges in a new
series of free, monthly webinars.
Designed for OEM and CEM process engineers, each of the monthly 60-minute Internet-based seminars will focus on challenges specific to a major surface mount manufacturing process.
Speedline staff will host the online workshops. The webinars will include an educational presentation, discussion of new technologies and techniques, practical how-to advice and a Q&A opportunity.
The 2006 schedule is:
Jan. 19 -- Lead-Free Printing Process
Feb. 16 -- 0201 and 01005 Component Assembly Process
March 16 -- Lead-Free Reflow Soldering
April 13 -- Adhesive Printing
May 18 -- Pin in Paste (Intrusive Reflow)
June 15 -- Lead-Free Wave Soldering
July 13 -- Challenges of High Speed Underfill
Aug. 17 -- Lead-Free Printing Process
Sept. 14 -- Practical DOE and SPC for Electronics Assembly
Oct. 19 -- Cleaning Lead-Free Residues
Nov. 16 -- MicroDot Dispensing
Dec. 14 -- 0201 and 01005 Component Assembly Process
All Webcasts are free and will begin at 11 am., U.S. Eastern time.
For more information or to register, go to http://www.speedlinetech.com/seminars or call 508-541-4749.
Designed for OEM and CEM process engineers, each of the monthly 60-minute Internet-based seminars will focus on challenges specific to a major surface mount manufacturing process.
Speedline staff will host the online workshops. The webinars will include an educational presentation, discussion of new technologies and techniques, practical how-to advice and a Q&A opportunity.
The 2006 schedule is:
Jan. 19 -- Lead-Free Printing Process
Feb. 16 -- 0201 and 01005 Component Assembly Process
March 16 -- Lead-Free Reflow Soldering
April 13 -- Adhesive Printing
May 18 -- Pin in Paste (Intrusive Reflow)
June 15 -- Lead-Free Wave Soldering
July 13 -- Challenges of High Speed Underfill
Aug. 17 -- Lead-Free Printing Process
Sept. 14 -- Practical DOE and SPC for Electronics Assembly
Oct. 19 -- Cleaning Lead-Free Residues
Nov. 16 -- MicroDot Dispensing
Dec. 14 -- 0201 and 01005 Component Assembly Process
All Webcasts are free and will begin at 11 am., U.S. Eastern time.
For more information or to register, go to http://www.speedlinetech.com/seminars or call 508-541-4749.
WASHINGTON -- The U.S. Congress, led by Senators John Ensign (R-NV) and Joe Lieberman (D-CT),
yesterday unveiled a proposal calling for a boost in R&D funding for basic
and advanced science, in an effort to spearhead nationwide attention toward developing
domestic engineering talent and ideas.
In a letter to colleagues, the senators said the bill “aims to make the necessary improvements in research, education of science and technology talent and innovation infrastructure to allow the United States to maintain the global leadership it achieved in the last century.” The bill responds to the recommendations made in the National Innovation Initiative report, “Innovate America,” issued late last year by the Council on Competitiveness.
In a letter to colleagues, the senators said the bill “aims to make the necessary improvements in research, education of science and technology talent and innovation infrastructure to allow the United States to maintain the global leadership it achieved in the last century.” The bill responds to the recommendations made in the National Innovation Initiative report, “Innovate America,” issued late last year by the Council on Competitiveness.
ELK GROVE VILLAGE, IL -- SigmaTron International today reported revenues 41.3% to $34.9 million yet earnings fell 7.6% to $1.2 million for its second quarter ended Oct. 31.
A year ago the an
electronics manufacturing services company reported net revenues of $24.7 million
and net income of $1.3
million.
LONDON -- The U.K.'s top energy official today suggested that the deadline for implementation of the Waste Electrical and Electronic Equipment directive would be pushed back.
In a statement, Energy Minister Malcolm Wicks said progress on the implementation of WEEE is to be reviewed immediately. "We have listened to the concerns expressed by both the business community and other stakeholders over the implementation process and have decided that more time is needed to get the implementation right. Although any further delay is regrettable, this will ultimately deliver far greater environmental benefits."
In a statement, Energy Minister Malcolm Wicks said progress on the implementation of WEEE is to be reviewed immediately. "We have listened to the concerns expressed by both the business community and other stakeholders over the implementation process and have decided that more time is needed to get the implementation right. Although any further delay is regrettable, this will ultimately deliver far greater environmental benefits."
LONDON – Isola Group is set to buy Polyclad Laminates from Cookson Group (the parent company of Cookson Electronics) for $91 million. The deal is expected to close in February.
Combined, the companies would be neck-and-neck with Nanya as the second largest supplier of laminate materials, behind Matsushita. Polyclad had sales of $171 million through the third quarter of 2005, while Isola said its revenues will top $400 million this year.
Combined, the companies would be neck-and-neck with Nanya as the second largest supplier of laminate materials, behind Matsushita. Polyclad had sales of $171 million through the third quarter of 2005, while Isola said its revenues will top $400 million this year.
Jena, Germany – GÖPEL electronic will partner with PTS (Production Test Systems Ltd), headquarted in Shenzhen. PTS becomes the 11th Center of Expertise (COE) in GÖPEL’s electronic Alliance Partner Network (created to support JTAG/Boundary Scan applications).
PTS will offer customers in China, Taiwan, Singapore, the Philippines and Malaysia services,such as Design for Testability (DFT), test program generation development and generation, as well as turnkey solutions and complete system integration based on the recently introduced Scanflex platform.
PTS will offer customers in China, Taiwan, Singapore, the Philippines and Malaysia services,such as Design for Testability (DFT), test program generation development and generation, as well as turnkey solutions and complete system integration based on the recently introduced Scanflex platform.
Minneapolis, MN -- The SMTA International Technical Committee is asking for abstracts for the 2006 conference. Short course descriptions are also being solicited. The deadline for abstracts is Feb. 24, 2006; the SMTA International show is set for Sept. 24-28 in Rosemont, IL.
Sumit abstracts online here: smta.org/smtai/call_for_papers.cfm.
Paper are being solicited in emerging technologies, components, assembly, PCB technology, process control and business issues. Visit the Website for further specifics.
BANNOCKBURN, IL – A group of leading solder vendors today issued a statement asserting “no evidence” exists demonstrating voiding has “any significant impact” on solder joint reliability.
In a statement, Karl Seelig, chair of the subcommittee that issued the report, stressed its findings on Pb- free voids. “Based on the comparison of the number and size of solder joint voids to thermal cycle interconnection failure date, there is no evidence that solder joint voiding has any significant impact on solder joint reliability."
San Francisco, CA - Design Chain Associates and EPTAC Corp. will continue its one-day seminar series, "Thriving in a RoHS/WEEE Environment," throughout the U.S. in 2006.
The seminar will cover the EU directives and add all new information on this continuously evolving issue, including insights into new alloys, explanations of China RoHS, supplier updates, reliability updates and more.
This seminar is designed for OEMs, distributors, contract manufacturers and outsource design and manufacturing firms. It is geared toward executive management that needs to determine strategic direction as well as anyone involved in the implementation and execution of the required changes to conform and thrive. Teams are urged to attend since environmental compliance impacts many groups.
The course will provide information in seven fundamental areas impacted by the environmental laws, including EU's Thematic Strategies to Japan's new legislation; business environment; resources; business processes; DfE; manufacturing processes; and equipment.
Future dates include:
San Diego February 14
San Jose February 16
Boston March 7
Atlanta March 9
Austin April 11
Dallas April 13
Minneapolis May 4
Chicago June 8
The seminar will cover the EU directives and add all new information on this continuously evolving issue, including insights into new alloys, explanations of China RoHS, supplier updates, reliability updates and more.
This seminar is designed for OEMs, distributors, contract manufacturers and outsource design and manufacturing firms. It is geared toward executive management that needs to determine strategic direction as well as anyone involved in the implementation and execution of the required changes to conform and thrive. Teams are urged to attend since environmental compliance impacts many groups.
The course will provide information in seven fundamental areas impacted by the environmental laws, including EU's Thematic Strategies to Japan's new legislation; business environment; resources; business processes; DfE; manufacturing processes; and equipment.
Future dates include:
San Diego February 14
San Jose February 16
Boston March 7
Atlanta March 9
Austin April 11
Dallas April 13
Minneapolis May 4
Chicago June 8
Bolton, MA -- DownStream Technologies opened its new corporate headquarters in Marlborough, MA. Located in region’s high-tech corridor along Rte. 495, the facility will house the company’s financial, marketing, sales and R&D operations.
“With the introduction of our newest product, BluePrint for PCBs and the increase in sales of our industry-standard CAM350, it became apparent that we needed to expand in order to accommodate the growth of the company,” said Rick Almeida, founder of DownStream. “Our new facility is optimally equipped to help us respond to the needs of our customers, as well being ideally located so we can continue to attract the best talent in the high-tech industry.”
The new facility allows the company to add engineering and support personnel.
The new address is:
DownStream Technologies, LLC
225 Cedar Hill Street, Suite 33
Marlborough, MA 01752
(508) 970-0670
“With the introduction of our newest product, BluePrint for PCBs and the increase in sales of our industry-standard CAM350, it became apparent that we needed to expand in order to accommodate the growth of the company,” said Rick Almeida, founder of DownStream. “Our new facility is optimally equipped to help us respond to the needs of our customers, as well being ideally located so we can continue to attract the best talent in the high-tech industry.”
The new facility allows the company to add engineering and support personnel.
The new address is:
DownStream Technologies, LLC
225 Cedar Hill Street, Suite 33
Marlborough, MA 01752
(508) 970-0670
PALO ALTO -- SiliconPipe received the Frost & Sullivan 2005 Excellence in Technology Award in the field of system-level interconnect solutions for its Novias technology. The technology is based on the removal of performance-limiting and expensive plated vias from the interconnection channel.
The technology was developed to create stair step interconnections among IC packages, interconnection substrates and connectors. Prototypes have already been introduced and it will soon be incorporated in products.
"SiliconPipe interconnection technologies enable product and system designers to use simple I/O buffers to send signals well beyond 2 Gbps," says F & S research analyst Sivakumar Muthuramalingam. "The company's innovations in interconnect technologies cover the entire spectrum of electronic assembly from their simple, cost-effective Stair Step Packaging (SSP) for ICs to low cost, high performance, backplane connectors used in PCBs."
"SiliconPipe's unique and novel solutions leverage existing manufacturing infrastructure and cost reductions and performance gains are achievable with relatively simple modifications to current design and manufacturing practices," notes Muthuramalingam. "Since these interconnection channels will operate at frequencies that are well beyond today's requirements, current products that incorporate these 'clean' interconnections could offer advantages of lower power consumption and better scalability."
The technology was developed to create stair step interconnections among IC packages, interconnection substrates and connectors. Prototypes have already been introduced and it will soon be incorporated in products.
"SiliconPipe interconnection technologies enable product and system designers to use simple I/O buffers to send signals well beyond 2 Gbps," says F & S research analyst Sivakumar Muthuramalingam. "The company's innovations in interconnect technologies cover the entire spectrum of electronic assembly from their simple, cost-effective Stair Step Packaging (SSP) for ICs to low cost, high performance, backplane connectors used in PCBs."
"SiliconPipe's unique and novel solutions leverage existing manufacturing infrastructure and cost reductions and performance gains are achievable with relatively simple modifications to current design and manufacturing practices," notes Muthuramalingam. "Since these interconnection channels will operate at frequencies that are well beyond today's requirements, current products that incorporate these 'clean' interconnections could offer advantages of lower power consumption and better scalability."
The award is presented yearly to the company that has pioneered the development and introduction of an innovative technology into the market; a technology that has either impacted or has the potential to impact several market sectors.
AUSTIN, TX – 3M Electronics’ advanced laminate, 3M Embedded Capacitor Material, is RoHS compliant.
It can be made with a dielectric thickness down to 8 microns and a capacitance density over 10 nanofarads/sq.in., which makes it among the thinnest and highest capacitance density materials available for embedding planar capacitance in circuit boards. When used as “power” and “ground” layers in a multilayer PCB, it becomes a shared decoupling capacitor inside the board, allowing for the elimination of many discrete surface-mount capacitors and their associated vias.
The material is compatible with rigid and flex PCB processing, including laser drilling.
It can be made with a dielectric thickness down to 8 microns and a capacitance density over 10 nanofarads/sq.in., which makes it among the thinnest and highest capacitance density materials available for embedding planar capacitance in circuit boards. When used as “power” and “ground” layers in a multilayer PCB, it becomes a shared decoupling capacitor inside the board, allowing for the elimination of many discrete surface-mount capacitors and their associated vias.
The material is compatible with rigid and flex PCB processing, including laser drilling.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association