AUSTIN, TX – 3M Electronics’ advanced laminate, 3M Embedded Capacitor Material, is RoHS compliant.
 
It can be made with a dielectric thickness down to 8 microns and a capacitance density over 10 nanofarads/sq.in., which makes it among the thinnest and highest capacitance density materials available for embedding planar capacitance in circuit boards. When used as “power” and “ground” layers in a multilayer PCB, it becomes a shared decoupling capacitor inside the board, allowing for the elimination of many discrete surface-mount capacitors and their associated vias.
 
The material is compatible with rigid and flex PCB processing, including laser drilling.   

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