News
The EMS provider reversed a net loss of $1.15 million for the same quarter a year ago. Revenue fell sharply for the period ended July 1, from $6.2 million last year.
W. Barry Gilbert, chairman and CEO, said, "Rebuilding our sales base and developing a steady stream of top line growth is our top priority. Our new prospect portfolio continues to stay strong and our manufacturing representatives continue to present us with excellent opportunities. Operationally we continue to gain strength. We have ample working capital, an unused credit facility to support our new customer activities
Long-term debt is less than $800,000, down from over $20 million three years ago.
For the quarter, IEC took $65,000 in restructuring costs due to severance of 14 employees, a move expected to save the company $380,000 annually.
IEC's five largest customers accounted for 72% of sales for the nine months ended July 1, down from 81% of sales in the comparable period in 2004.
NEENAH, WI -- Plexus Corp. announced record revenues of $313.7 million for its third fiscal quarter ended July 2, up 14.2% over last year. The EMS provider's pro-forma net income was $7 million; its net loss of $21.5 million included previously announced restructuring costs of $27.6 million.
The document is said to provide a set of critical guidelines for capabilities definitions, as well as evaluation, implementation and operation use of AOI.
WILLOW GROVE, PA -- Kulicke & Soffa Industries and Microbonds Inc. (a private Canadian corporation) will align the technological roadmaps of Microbonds' new insulated gold wire bonding products and processes -- called X-Wire Technology -- with the Maxum series wire bonders from K&S.
X-Wire technology addresses interconnect challenges arising from the increasingly complex single and stacked die packaging designs of ICs.
Christian Rheault, K&S VP of ball bonders, said, "The potential to shrink package size, increase performance, reduce costs and enhance reliability using Microbonds' X-Wire Technology within the established wire bonding assembly environment is a very intriguing development that we are delighted to support for the benefit of our customers and the industry."
According to a press release, preliminary testing at K&S' R&D facilities using the insulated bond wire with the wire bonders have produced successful results with some yield improvements.
Craig Geier, president and CEO of Microbonds, said, "As traditional packaging technologies have inherent limitations, our customers are seeking new solutions to address their interconnect challenges. The integration of our X-Wire Technology with the leading advanced K&S platform of wire bonding technologies will provide customers new flexibility in the development of high performance-to-cost packaged ICs."
Sherbrooke, Quebec, Canada -- C-MAC MicroTechnology’s North American hybrid circuit manufacturing facility, C-MAC Microcircuits, ULC, has achieved ISO 13485 Certification for medical devices.
ISO 13485 is a medical device quality systems standard that supplements ISO 9001. Some of the additional requirements relate to design controls, process controls (including environmental controls), special processes, traceability, record retention and regulatory actions, which are more critical for the medical device industry.
"C-MAC activity in the medical market clearly required the ISO 13485 certification. The certification of a quality management system specifically for medical devices proves advantageous, and in many cases essential, for C-MAC to continue to grow our business in the global market," said John Tran, North America sales manager, C-MAC MicroSystems Solutions Division.
C-MAC Microcircuits produces a wide range of functional modules for use in the telecommunication, industrial, medical, military and automotive systems. The technology encompasses multiplayer thick-film interconnect substrates, surface-mount hybrid circuits along with direct-attach flip-chip and chip & wire assemblies.
SAN JOSE -- Flextronics, the world's largest contract electronics manufacturer, last night reported first-quarter net sales of $3.9 billion, up $17 million over last year.
For the quarter ended June 30, Flextronics' pro-forma net income rose 27% to $99.6 million. GAAP net income slid $15.6 million to $58.7 million year-over-year.
SAN JOSE -- Revenues of EMS provider Sanmina-SCI fell 8% to $2.83 billion and the company was hit with a quarterly loss of $202,000 due to restructuring charges taken in its fiscal third quarter.
Sanmina-SCI recorded a profit of $11.4 million last year. For the June quarter, the pro-forma profit was $24.4 million, down from $34.4 million a year ago.
MYRTLE BEACH, SC -- AVX Corp. reported net sales of $319.8 million for its fiscal first quarter ended June 30, down 7% year-on-year but up 4.5% sequentially. Net income was $10.2 million, down 55% year-on-year.
John Gilbertson, president and chief executive, said, "The sales increases in the last two quarters indicate that end market growth is continuing, and this is a positive sign for AVX and the industry."
Sequentially, profit from operations improved to $10.1 million. Profit from operations was $30.7 million last year.
Cash and short and long-term investments in securities increased $5.4 million to $725.9 million during the quarter.
Redmond, WA -- Datalight and Data I/O Corp. announced a joint technology effort aimed to ease the task of bringing NAND Flash products to market.
As market demand for increased memory in electronic products has surged, designers of new products increasingly use NAND Flash memories in new designs to capture a cost advantage. The challenge is that NAND memories require bad-blocks to be detected and managed while writing to the device. The joint effort hopes to enable NAND flash users to leverage performance capabilities, shortening the development cycle and ensuring accurate handling of bad blocks.
Datalight specializes in system software to help OEMs add value to embedded devices. Data I/O is a provider of manual and automated device programming systems for programmable flash technologies.
Mansfield, TX – Mouser Electronics will be the first catalog distributor to market Oki Semiconductor’s advanced integrated circuits to the industry.
Oki manufactures a line of ICs for the telecommunications, automotive, computer, medical and consumer markets. Its portfolio of products includes microcontroller, ASIC, memory, speech synthesis and RF devices.
Mouser’s customer base of over 100,000 business accounts focuses primarily on the design-in and prototyping stage of the design cycle and are comprised of a range of companies, universities and engineering consultants who recommend, specify and purchase board level components for product designs.
GREENVILLE, SC -- Kemet Corp. today June quarter net income of $3 million on net sales of $114.1 million. The company's net loss before special items was $300,000, with the difference made up by a one-time tax benefit of $3.3 million.
Sales at the maker of passive chips were down 6.8% from last year and up 12.5% sequentially.
BOSTON -- Revenues of Europe-based electronics manufacturing services firms are in recovery, according to a recent research report.
Reed Electronics Research says the European EMS market will reach €47.1 billion by 2009, up 139% from €19.7billion in 2003. Reed estimates the market grew 20.3% in 2004, to €23.7 billion.
One big factor: Eastern Europe. The cost savings gained by moving manufacturing to the emerging region is driving the rest of the continent. Eastern Europe's EMS sales will reach €11billion by 2009, up from an estimated €4 billion this year, Reed reports. Eastern Europe is already the third largest EMS market in Europe, with a 16.8% share.
Germany is the market share leader, at 23%, followed by the U.K. (18.1%) and France (13%).
As of last year, the 10 largest companies made up an estimated 64% of total EMS sales, Reed says.
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