News
Clinton, NY -- Indium Corp. (indium.com) has released the results of a series of cleaning solvent compatibility evaluations. After extensive testing and analysis, the company found a high degree of effectiveness using a range of cleaning solvents from Zestron and Kyzen for the Indium's solder pastes, including lead-free.
The data are available by contacting abrown@indium.com.
Indium is a supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, lead-free solder alloys, underfill materials and die-attach materials.
Net income was $8.6 million, vs. $5.1 million last quarter and $1.2 million last year.
First-half revenues were up 33% to $144.7 million and net income rose 491% to $13.6 million.
PCB equipment sales were $29.4 million, up from $23.2 million sequentially and $18.5 million last year. Sales of assembly equipment were $8.8 million, up from $6.6 million in the first quarter and $6.1 million a year ago.
Cash and equivalents increased $14 million to $166 million during the quarter.
"Our confidence in the long-term growth prospects of these
industries continues to be high," said CEO Yochai Richter in a press
statement.
Wang's talk will focus on enabling technologies and processes for higher quality and lower costs in a lead-free environment. Also on tap: overviews of press fit and pin insertion technology, and selective soldering .
The one-hour presentation takes place Sept. 1 at 2 p.m.
Contrary to published reports, Nepcon Shenzhen will take place at the China Hi-Tech Fair Exhibition Centre in Shenzhen, not Beijing. For more information click here (www.nepconchina.com).
Ruwel AG and Fuba Printed Circuits, which have joint sales of 270 million euros (about $325 million), say their combined buying power has the potential for "considerable savings" on raw materials. The companies also plan to coordinate sales and production efforts, in order to reverse downward pricing pressure and benefit from economies of scale.
Ruwell operates plants in Goch, Wetter, Grassau, Pfullingen, Nykøbing and and two in Geldern.
Fuba has plants in Gittelde, Dresden, and has JVs in Tunisia and India. The capacity of the Tunisia factory was recently increased by 80,000 m², to 200,000 m² per annum. Additional expansion will take it to 320,000 m² by year-end.
Montreal, Aug. 3 -- Coreco Inc. posted its highest quarterly revenues in three years as second-quarter sales rose 27% to $6.2 million.
Net income almost doubled vs. a year ago, to $552,849. Sales were up 17% sequentially.
Gross margins increased to 61.1% of sales from 58.7% last year and 60.7% last quarter.
Coreco, which makes frame grabbers and other products and software for machine vision equipment, said all major geographic markets saw higher sales, with Asia up 46%, the U.S. up 28% and Europe up 13%. Asia accounted for 30% of total sales, North America for 45% and Europe for 25%.
"Our second quarter continued the surge in results that we reported in the first quarter," said Keith Reuben, CEO, in a press statement. "We are pleased by the renewed strength in all our geographic markets as well as among our core OEM customers in the semiconductor and electronics industries.
"The machine vision market is currently in an expansion phase, particularly in Asia," he said.
During the quarter Coreco opened a sales support office in Japan, its first outside North America.
Indianapolis, IN, Aug. 3 -- Specialty Coating Systems' (scscookson.com) new 1,700 sq. ft. cleanroom in Indianapolis is now operational. The design features ISO Class 7 and Class 6 areas, and an ISO Class 5 area for component fixturing and examination.
The addition allows the SCS Indianapolis coating center to manage products -- including receiving, cleaning, coating, inspecting and repackaging products for shipment -- within an environmentally controlled area. Laminar air flow, gowning and masking, and HEPA filtering control the bioburden, minimizing the sterilization dosage required prior to a medical device's use.
The controlled environment incorporates the company's new deposition system, which was specifically designed for fully automated coating in a cleanroom environment. The deposition system allows for device loading and unloading in the Class 6 room, while the coating system resides in the Class 7 service chase. The coating chamber is optimized for production level quantities of critical items such as medical device components and implantables, semiconductors and other devices.
In the second quarter communications saw the greatest inventory build, while IT hardware inventory levels are stable, wrote Deutsche Bank in a research note. The increases are helping EMS firms, said a DB analyst.
In an Aug. 2 note, DB analyst Chris Whitmore wrote, "We believe this build at communications OEMs is benefiting reported revenue for both component manufacturers and EMS vendors. In fact, EMS production of communications gear has increased by more than 15% since the seasonally strong Nov./Dec. quarter (normally flat to down 10%).
"While OEMs' inventory levels are not excessive, we do expect production rates in the communications equipment supply chain to decelerate as some of this build is worked down in ensuing quarters," Whitemore said.
Whitemore believes Cisco's inventory levels will come under scrutiny when the networking OEM reports earnings next week.
For the quarter, Valor reported revenues of about $7.5 million, tying a company record, up from $6.3 million a year ago. Cash flow improved by $1 million during the quarter.
First-half revenues were up 17.3% to $14.6 million while net was $301,000, reversing a loss of $539,000.
President and CEO Ofer Shofman said in a press statement, "I am delighted with these results. [W]e expect to maintain our growth rate in the second half.
Flemington, NJ-- DEK (dek.com) has licensed its VectorGuard stencil technology to Christian Koenen GmbH. The Munich, Germany-based company will provide DEK customers with a second source for the stencils in Germany, Austria and Switzerland.
The companies signed the supply and licensing agreement in June at SMT 2004 in Nuremberg. Christian Koenen will manufacture the stencils from foil blanks supplied by DEK, and will supply its customers with the corresponding stencil frames.
The VectorGuard system was introduced last year to enhance user-friendliness, handling, storage and turnaround time for frame-mount stencils users. Extruded aluminium safety edges and plastic corner pieces make the stencils easy to remove for recycling and easy to mount and dismount from the new frame without special equipment.
To wit: A recent announcement by a major office equipment retail chain and a leading PC OEM to recycle old computers for free. Two weeks ago, Office Depot and H-P announced programs to takeback outdated machines at no charge to consumers. Currently, less than 10% of electronics are recycled, according to the Silicon Valley Toxics Coalition.
Vijay Wakharkar of Intel drove the point home during a special invite-only session on packaging trends during Semicon West. In a four-hour session at the Marriott Hotel cosponsored by SEMI's International Electronics Manufacturing Technology Symposium and Henkel Technologies, several experts spoke on coming challenges in packaging.
With package costs beginning to exceed even the semiconductor die, more attention will be paid to these critical interfaces between the brains -- the chip -- and the boards. Wakharkar called attention to particular "green" trends, saying, "I think customers will ask about chemicals in packages."
Wakharkar described several other trends, including the convergence of computing and communications. The result, he says, will be packages that are more complex, with higher I/O counts, and die stacking and pinning. For example, Intel is working on stacking six to eight dice in a single package. In turn, materials suppliers will have to come up with combinations that withstand or "smooth" the heat spread from chip to package.
Furthermore, gains will continue to come in tighter densities. By next year, he says, manufacturers can expect BGA pitches to decrease to 0.3 mm for CSPs, and 0.6 mm for what he calls "cost-performance" packages.
Further evidence of green's gains: lead-free solder bumps. According to Jan Vardaman of TechSearch International, "some increase in the next year or so" should be expected for lead-free bumps. Fujitsu, she notes, uses lead-free bumps in all products for internal use.
Vardaman also noted a shift in packages for memory devices. Such applications are shifting to FBGA and wafer-level packaging from TSOPs, she says. Her forecasts call for the number of 200-mm wafers shipped in WLPs to grow from 750,000 wafers this year to 2.1 million next year and 4 million in 2006.
Other presentations covered low k devices and copper interconnects, lead-free material sets and high speed dispensing. Speakers included Mike Steidel of Amkor Technology, Kishor Desai of LSI Logic, Dev Malladi of Sun Microsystems, Steve Adamson of Asymtek and Henkel's Gordon Fisher, Jim Huneke and Michael Todd.
"The goal was to educate attendees about the power of partnering with industry leaders and illustrate how these partnerships can yield solutions to some of the biggest challenges in semiconductor packaging," says Bhavesh Muni, business manager of semiconductor packaging materials at Henkel, in a press statement. Muni said the turnout -- 120 persons -- and positive returns would lead to another symposium at Semicon West next year.
For copies of the proceedings, call 626-968-6511.
Minneapolis, MN, July 29 -- Brian McAdams from Lehigh University (Lehigh.edu) in Bethlehem, PA, will receive the SMTA's 2004 Charles Hutchins Educational Grant (smta.org/hutchins) for his project, "Sub-critical Initiation of Delaminations at the Underfill/Passivation Interface in Flip Chip Assemblies."
McAdams is a materials science and engineering graduate student who has recently conducted studies of cure kinetics of developmental epoxy systems. He has examined the mechanics of adhesion for the initiation and propagation of cracks at the underfill/passivation interface in flip chip packaging and looked at the role of deformation mechanisms in determining interfacial adhesion and the potential correlation to chemical interactions across the interface.
McAdams hopes to work in electronics assembly and packaging and to continue efforts on materials characterization, failure analysis, or research and development of flip chip assemblies.
The award includes $5,000 and travel expenses to SMTA International, where McAdams will be presented the award during the SMTA Annual Meeting.
Co-sponsored by SMTA and Circuits Assembly, the grant was established in memory of past SMTA president and industry colleague Charles Hutchins. Circuits Assembly donated $5,000 to the fund in February through the proceeds of the Service Excellence Awards.
NORTHBROOK, IL, July 28 -- Orders for rigid boards lagged in June, while demand for flex circuits remained strong, according to the latest three-month moving average of North American manufacturers.
For all board types, shipments rose 31.3% and bookings were up 13% vs. a year ago, said IPC, which administers the monthly poll. The figures may include some sales of products built offshore and brokered by the surveyed companies.
For the first time, data for flex circuits and rigid boards were broken out. In a statement, IPC said, "Due to divergent growth trends in the rigid PCB and flexible circuit segments of the industry, IPC will report separate monthly statistics for the two segments." The move seems to acknowledge calls by the media, including the publishers of Circuits Assembly, for better explanation of the data.
The June book-to-bill was 0.95 for rigid and 1.57 for flex. "[R]igid and flex shipments are rebounding and showing strong growth, but flex is growing at a faster rate," IPC said.
The book-to-bill ratio for all board types dropped to 1.06, down 0.05 points.
The ratio is calculated by averaging the number of orders booked over the past three months and dividing by the average sales billed during the same period. A ratio of 1.06 means that for every $100 in shipments, $106 worth of PCBs were booked. An increasing ratio is generally considered a sign of a market poised to rise.
Shipments are up 35.4% year-to-date, bookings 43.1%. Combined June shipments were up 5% sequentially, while bookings fell 19%.
June rigid shipments were up 28.4% and bookings 16.3% over last year. Year-to-date, rigid shipments are up 26.7% and bookings are up 23.6%. Among those surveyed, rigid shipments rose 6.4% sequentially and bookings rose 14.2%.
June flex shipments were up 76.9% but bookings were down 14.9% vs. last year. Year-to-date, flex shipments are up 79.1% and bookings 147%. Sequentially, flex shipments fell 1.4% and bookings dropped 69.7%.
Flex sales, which include some value-added services, make up about 17% of total PCB sales in the IPC poll.
The data come from a sample of North American rigid and flexible PCB manufacturers.
IPC did not publish June shipment or booking indices.
Press Releases
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- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association