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News

The Metcal (Menlo Park, CA) division of OK International has developed a flexible optical inspection system for use with large boards measuring up to 36 x 36 in. The VPI-1000-XL system is the latest addition to the company's range of optical inspection systems for inspection of array packages and surface-mount devices.

The system meets all inspection requirements on larger boards, which are becoming increasingly common in applications such as cellular base stations, data communications and network servers. It features four adjustable supports to hold round, rectangular, square or l-shaped printed circuit boards (PCBs) and has an articulating arm capable of spanning up to 24in., allowing it to cover a 36 x 36 in. board without requiring a lens change.

Metcal's NovaScope lens design is capable of moving through 90° left/right and 20° up/down, so operators can inspect under array packages with standoff heights as low as 0.002 in. (0.05 mm) and clearances of just 0.043 in. (1.1 mm) between components. The optical design is sharper and clearer - using 2/3 fewer optical elements to send a direct image to the high-resolution CCD camera.

The integrated optical design is a departure that moves beyond typical endoscopic systems and gradient lenses. While conventional designs relay an internal image repeated throughout the length of the endoscope, an approach requiring multiple sets of complex optical elements to perform the task, NovaScope has only one image: the image in front of the eyepiece.

In operation, the system floods the underside of a component with bright white metal halide light that replicates natural daylight, enhances the color rendering and produces images on the system's color LCD monitor. The lens looks underneath array packages to inspect each ball and its top and bottom connections. With a quick turn of the lens adjustment ring, operators can move through the underside of the device to check for defects such as bridging, cold solder joints, open circuits, excess flux, contamination and other process-related failures.

The unit can also be used for inspecting surface-mount devices and any other board feature without changing lenses. Apertures on stencils can also be inspected with ease.

A software tool completes the package, allowing users to measure, record, annotate, analyze and communicate component information. Images are displayed in real-time for a visual inspection of the soldering process, and they can be captured and stored for future reference or reports. Documents can also be emailed or archived for use in training, research and development or quality insurance.

www.metcal.com

The monthly order index compiled by the Electronic Components, Assemblies & Materials Association (ECA, Arlington, VA) continued its slow upward movement in March, creating hopes that profits will follow.

"We're continuing to see a gentle increase that is consistent with our conversations with manufacturing executives," said Bob Willis, ECA president. "The prevailing hope from manufacturers is that average selling price (ASP) will begin to rise in concert with sales."

According to Willis, manufacturers are reporting some isolated supply shortages, which could spur demand and raise ASPs. Recently, UBS Securities reported that multi-layer chip capacitor (MLCC) supply is expected to fall short of demand in the second half of 2004, which could create a 5 to 15% price increase. In other areas, however, even substantial growth will not ease price pressures. Market researcher IDC predicts a compound annual growth rate of 15% for LCD panels between 2003 and 2007, with 56% growth in 2004 alone. But, IDC predicts the market will be oversaturated during that period, leading to price erosion.

The ECA represents manufacturers and producers of passive and active electronic components, component arrays and assemblies, and materials and support services. It is a sector of the Electronic Industries Alliance (EIA), comprising more than 2,100 members that reportedly represent 80% of the $430 billion U.S. electronics industry.

www.ec-central.org

Self-laminating labels (SB) from Tyco Electronics (Harrisburg, PA), a business segment of Tyco International Ltd., can mark and identify wires and cables used in most
applications. The labels use thermal transfer technology for marking, employing a translucent vinyl film substrate with a permanent acrylic adhesive. The labels are supplied with a white printable area that is over-laminated upon application with the translucent portion of the label. The labels are used in a range of electrical and electronic application, as well as in factory automation and communications equipment.

The self-lamination of the labels protects the printed area from exposure to oil, solvents, water and abrasion. The labels conform to round, irregular or flexible surface and are suitable for use in applications where the cable or wire is flexed repeatedly. For added application flexibility, labels can be flagged around a wire compared to traditional wrapping.

SB self-laminating labels have a typical shelf life of two years and a service temperature of -40 to 82°C. The minimum application temperature is 10°C. These labels can be imprinted with the T308S or T312M thermal printers. Thermal transfer ribbons from Tyco Electronics are recommended.

www.tycoelectronics.com

The RO06plus oven from ESSEMTEC (Glassboro, NJ) offers the new possibility to run test cycles with a duration of up to 18 hours. This function is mainly used in the area of
component or material testing, for special curing applications or for
burn-in in temperature ranges up to 300° C.

The oven also offers the possiblity to solder printed circuit boards (PCBs) with standard or lead-free pastes. The integrated full convection chamber ensures low delta-t values and narrow process windows. The compact design allows oven use even in narrow locations like development or testing laboratories.

The motorized drawer moves the parts or PCBs automatically into the heating chamber as soon as the programmed base temperature is reached. After finishing the temperature cylces, the automatic drawer system moves the pieces out into an integrated cooling zone.

An additional N2 connection with integrated flow meter allows oven operation with an inert atmosphere.

Software records temperature profiles of the parts/PCBs, as well as the oven temperature itself, in real time. Protocols from the software can be saved, printed and compared with original profiles.

www.essemtec.com

Viscom, Inc. (Norcross, GA) recently announced the addition of Frank Marangell as the company's new vice president of sales. In this role Frank will manage the business in the Americas.

Marangell brings 14 years of experience in the automated optical inspection (AOI) business, and he has an engineering degree and MBA.

Currently living in Boston, MA, Marangell will be relocating to the company's U.S. headquarters in Atlanta, GA.

www.viscomusa.com

Agilent Technologies Inc. (Palo Alto, CA) and Digi-Key Corp. (Thief River Falls, MN), an electronic component distributor, recently announced that they have signed a distribution agreement. The agreement allows Agilent's Semiconductor Products Group (SPG) to make an array of its products accessible to designers via Digi-Key's distribution channel and real-time online service and support site.

Digi-Key's inventory of Agilent products includes a full range of LEDs and displays, optocouplers, motion control encoders, radio frequency (RF) and microwave devices and infrared and optical transceivers. These products are used in applications that span industrial, office automation, consumer electronics, home appliances, signs and signals, wireless, networking and automotive markets.

"The addition of Digi-Key to our global distribution network will help us reach more engineers in the critical early stages of their designs," said Frank Robertazzi, vice president of worldwide distribution for Agilent's SPG. "Digi-Key's catalog distribution channel provides another avenue for our customers to purchase samples and order literature and early production quantities online at any time."

www.digikey.com

Kester (Des Plaines, IL) recently announced that chief technology officer Dennis Bernier was honored by IPC—Association Connecting Electronics (Northbrook, IL) with a Distinguished Committee Service Award. The award was presented at the IPC APEX/Expo held in late February in Anaheim, CA.

Bernier was honored as one of 12 members for their leadership and significant contributions in the development of IPC J-STD-004A, Requirement for Soldering Fluxes.

This award is given to IPC committee members who have made an exceptional contribution to a specific standard, guideline, round robin test program or other IPC program.

www.kester.com

API Electronics Group, Inc. (Hauppauge, NY) announced recently that it has purchased all of the assets of Islip Transformer & Metal Co. Inc. (Westbury, NY), a private company that supplies critical systems and components to the U.S Department of Defense (DoD). The acquisition will strengthen API's position in the defense sector, bringing additional engineering expertise and complementary product lines to the business.

Under the terms of the all cash deal, API purchased Islip's contracts, workforce, test/production equipment, product rights and trade name. Islip has current contracts totaling $882,955 and projected revenues in excess of US$1.5 million for the 2004 calendar year.

"The acquisition of the business of Islip Transformer & Metal enables API to further augment its in-demand catalogue of components and systems for both government and corporate clients," said Tom Mills, president & COO for API Electronics. "The Islip business will be integrated into our API Electronics Inc. subsidiary, and we expect to have operations moved into our technology and manufacturing center in Hauppauge, NY, by the end of April. Revenues generated from the Islip acquisition through May 31st will be reflected in API's fiscal 2004 financials, and we expect this deal to have a positive impact on our results. We further expect that Islip will bring API increased revenue on a long-term basis."

In business for over 50 years, Islip supplies the U.S. government with a wide range of electronic components and systems. Among its contracts with the DoD, Islip has supplied various types of build-to-print electronic modules, multilayer printed circuit board assemblies, flexible cables, I/O boards, radio frequency (RF) and connection cables with multiple wire strands and RF modules, and chassis assemblies. Islip components have been utilized in a variety of defense systems, including military generators, night scopes and missile systems.

Islip also manufactures and supplies the exciter component that works in conjunction with the Deck Status Light System manufactured by API's subsidiary TM Systems. This system provides helicopter pilots and flight deck crew with information about the status of landing areas.

In addition to manufacturing its own line of electronic components and systems, Islip has worked in all phases of contract manufacturing—from supplier chain control, incoming inspection and production to final assembly and testing. Contract services provided by the company include custom design, material procurement, electronic circuit board assembly, electromechanical assemblies, cable harness assemblies, and electrical and environmental testing.

www.apielectronics.com

While consumption of integrated circuits (ICs) in China should be very healthy between 2002-2005, it will be a mixed blessing for equipment manufacturers, according to the report, Mainland China's Semiconductor and Equipment Markets: A Complete Analysis of the Technical, Economic, and Political Issues, recently published by The Information Network (New Tripoli, PA).

China's IC industry is expanding rapidly. In 2003, the country produced 12.4 billion chips, which accounted for just 20% of domestic demand. Most high-end products used in computers and mobile phones had to be imported. Domestic semiconductor companies also had to import designs from overseas companies. Unit production will nearly double to 22 billion units in 2005, but domestic production will grow to meet only 22% of domestic demand.

"The equipment market in China is not what it's cracked out to be," stated Dr. Robert Castellano, president of The Information Network. "IC production is limited to 0.18 microns on 200 mm wafers. Much of the production equipment used in fab expansion are tools transferred from older lines from Japanese and eventually Taiwanese IC manufacturers. Non-Chinese IC manufacturers will buy state-of-the-art 90 nm tools for 300 mm production for their existing facilities and transfer outdated tools to China. In addition, the used equipment market will be huge. Second- and third-tier new equipment vendors will also benefit, as top-tier players have focused on the latest technology."

In 2003, the front-end equipment market saw 18% growth to $1.25 billion on the strength of sales to SMIC, according to the report.

"The Chinese government is investing $10 billion in the semiconductor industry in the next two years to increase production," added Dr. Castellano. "That effort, among others, will encourage additional construction of 300 mm fabs by SMIC and others, resulting in a front-end semiconductor equipment market of $4.2 billion in 2005."

The 340-page report analyzes Mainland China's semiconductor and equipment industries, examining the technical, economic and political issues that are shaping the industry. Markets are forecast from 2001 to 2006.

www.theinformationnet.com

Endicott Interconnect Technologies (EI, Endicott, NY), a global supplier of organic semiconductor chip packaging, printed circuit boards (PCBs), board/system assembly and electromechanical equipment, has recently named Michael Arp as VP and CFO. The company also announced that Jay Desai has joined the company as VP of sales.

Arp joins the company with 31 years of financial management experience in several industries. Most recently, he served as VP of finance for NFI Interactive, a private transportation and logistics company. Arp has also held senior financial positions in the telecom and aerospace industries. In addition, he was the cofounder and CEO of American Turf Manufacturing Inc, now known as Worldwide Golf Resources. Arp is a graduate of the University of West Florida and Angelo State University.

Desai brings 20 years of experience in the electronic interconnect business. He has held positions in both engineering and sales, supporting PCBs, flex and rigid flex products for a variety of companies. In his most recent position as VP of sales and marketing for ISU Pentasys, Desai built a sales team and strategy that introduced the ISU business model in North America. He has experience in building strategic partnerships and long-term agreements with customers, and he has also managed development programs, certifications, cost reduction and process improvement efforts in his engineering roles. Desai holds a bachelor's of technology in mechanical engineering from MS University in Baroda, India, and an MS in mechanical engineering from Georgia Institute of Technology.

www.endicottinterconnect.com

TT electronics Prestwick Circuits (Irvine, Scotland), a subsidiary of global electronics manufacturing company TT electronics plc, is celebrating 35 years of manufacturing printed circuit boards (PCBs) in April 2004.

The company was originally founded in April 1969 with the objective of creating a precision manufacturing facility for high quality PCBs to supply the Scottish electronics industry. Prestwick now exports over 85% of products manufactured, up from just 11% 20 years ago.

Prestwick currently has customers in the automotive, telecommunications, consumer and defence industries. The automotive sector is Prestwick's largest market, with over 80% of PCBs manufactured by the Irvine plant being supplied to Tier 1 automotive suppliers. Compared to a figure of 1% in 1984, this demonstrates the huge growth in automotive technology and how dramatically the demand for electronics has increased as vehicle manufacturers become more advanced.

Derek Mansfield, managing director, TT electronics Prestwick Circuits, said, "Prestwick is one of today's largest manufacturers of printed circuit boards in Europe and, with 35 years' manufacturing experience, Prestwick has proved that it can endure and overcome the cyclical nature of our business and meet customers ever increasing demands. I would like to take this opportunity, on behalf of Prestwick, to thank our valued customer base, loyal staff and suppliers, for their continued support."

www.prestwick.co.uk

Speedline Technologies Inc. (Franklin, MA) reported that sales during the first quarter of 2004 were up more than 42% over the same period last year. Bookings levels have also increased dramatically with a growth of 55% over the first quarter of 2003.

"We're seeing an upturn in worldwide electronics manufacturing that is driving higher capital equipment purchasing," said Pierre de Villemejane, president, Speedline Technologies. "Europe and the Americas are recovering and Asia continues to grow."

De Villemejane said most traditional sectors of the electronics industry are participating in the recovery, including mobile phones, consumer electronics and computers. "Manufacturers are replacing obsolete equipment as well as expanding their facilities," he said. "However, Speedline is also witnessing a significant surge in special niche applications and new processes."

Speedline experienced rebounding sales across its entire portfolio, including CAMALOT dispensers; ELECTROVERT reflow, wave and cleaning products; and MPM printers.

"These sales increases are coming from our customer base, market share gains and new market penetration," said de Villemejane. "In particular, the trend toward lead-free printed circuit board processing is boosting sales of our wave soldering and reflow oven products."

According to the company, the recent sales growth also is attributable to Speedline's success in defining and developing new challenging applications and processes with a number of key customers. These achievements include new advances in underfill and medical dispensing, fine-feature printing with traditional and lead-free pastes, and efficient manufacturing configurations for lead-free wave soldering and reflow, fuel cell manufacturing and glue printing.

www.speedlinetech.com