News
The impact of lead-free solders on printed circuit board (PCB) design will be the cornerstone of the keynote address at PCB Design Conference East 2004 in Manchester, NH. In his keynote on October 5, Joe Fjelstad will cover materials, feature design and finishes likely to be impacted by the switch to lead-free boards
Fjelstad is the well-known cofounder of SiliconPipe, a Silicon Valley IP firm dedicated to extending the limits of copper-based circuit technology.
"While some PCB designers believe the move to lead-free will have no effect on the way they design boards, others predict that lead-free will affect the designer's job at every level," said Fjelstad. "As a concerned designer, what can you do to ensure that your designs will be sufficiently robust to survive lead-free assembly and the operational environment for which the design was intended?"
Fjelstad has more than 30 years of international experience in electronic interconnection and packaging technology. Before founding SiliconPipe, Fjelstad was the first fellow of Tessera, the chip packaging firm. He is author or editor of several books and numerous articles on electronics manufacturing. Fjelstad is also a prodigious inventor, with more than 150 U.S. patents issued or pending.
"We are thrilled that Joe Fjelstad will deliver the keynote address at PCB East 2004," said UP Media Group (Atlanta, GA) president Pete Waddell. "His experience and knowledge make him the perfect person to deliver a keynote that complements this year's conference theme: ‘Education for Your Most Pressing PCB Design Challenges, Including Lead-Free, Embedded Components, High Speed and PCB Design Fundamentals.' "
A number of conference courses also focus on lead-free, currently the hottest issue in PCB design, manufacture and assembly.
The keynote address is free for all conference and exhibition-only registrants; however, space is limited. Interested parties are urged to register for the keynote online at www.pcbeast.com.
Copyright 2004, UP Media Group. All rights reserved.
The Surface Mount Technology Association (SMTA, Minneapolis, MN) has announced the program for the International Wafer Level Packaging Congress on Oct. 10-12 in San Jose, CA. The program is now available live on the SMTA Web site.
The exhibition will track leading-edge IC packaging and test technologies with special emphasis on 3-D stacked packaging. It includes a three-day technical program and two days of exhibits presented by leading suppliers to the semiconductor packaging and testing industry.
Full details on the courses, technical sessions and special events can be found at: http://www.smta.org/iwlpc/.
Copyright 2004, UP Media Group. All rights reserved.
Valor Computerized Systems (Yavne, Israel), a provider of manufacturing productivity solutions to the electronics industry, announced that IPC (Northbrook, IL) has recognized the company with its Special Recognition Award. This award, presented on behalf of the printed circuit board (PCB) and electronics manufacturing services (EMS) industry, their suppliers and customers, is in appreciation of Valor's commitment in developing IPC-2581, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, and its donation of the ODB++ (X) format.
"By generously donating their ODB++ format to the IPC committee working on IPC-2581 and by providing volunteer committee support from their development group in Israel, Valor made tremendous contributions to the development of this new standard and notably displayed its dedication to the industry," said David Bergman, IPC's vice president of standards and technology. "The time and travel commitment to the two-year standard was significant on Valor's behalf, and IPC would like to recognize Valor's efforts to and support of the industry."
The standard is the result of three years of a collaborative industry initiative, initially started by the National Electronic Manufacturing Initiative (NEMI) and followed by IPC's standardization effort. The standard is in XML schema and was built on Valor's ODB++ format, with added data concepts from IPC's GenCAM standard (IPC-2511B).
Copyright 2004, UP Media Group. All rights reserved.
IPC (Northbrook, IL) recently presented Mateusz Czerw, Eric Li and Edwin Moy with $500 scholarships from the IPC Electronics Assembly Scholarship Fund, an endowment the association established to support the electronics program of Curie Metropolitan High School in Chicago, IL. IPC also donated $1,000 to the school for additional educational materials and equipment for Curie's electronics program.
In addition to maintaining a 3.0 GPA in electronics, sustaining a 90% attendance record and establishing a history of achievement in electronics at the school, the students were selected by Curie's electronics instructor, technical department counselor and education-to-careers coordinator for submitting exemplary written essays that described their post-secondary educational plans and future career goals.
"IPC has always valued education and we will continue to support efforts that grant students an opportunity to further their training in the electronics field," said IPC president Denny McGuirk.
In 2003, Circuits Assembly magazine and Technology Forecasters financed the $10,000 fund through a portion of entry fees from past Service Excellence Awards programs. IPC donates $2,500 each year to the career academy that includes a magnet school for the arts, a vocational/technical program and an international baccalaureate program.
IPC selected Curie Metropolitan High School as the sole beneficiary because of the school's three-year industrial electronics course that gives students work-oriented, hands-on experience using the latest advancements in business and technology. Curie is one of the only high schools in the U.S. to use IPC-A-610C, Acceptability of Electronic Assemblies, as a standard in its industrial electronics curriculum.
Copyright 2004, UP Media Group. All rights reserved.
Cognex Corp. (Natick, MA), a supplier of machine vision systems and vision sensors, will host a new series of free machine vision seminars in major North American cities this fall. The Understanding and Applying Machine Vision Sensors half-day events show how vision sensors can perform automated inspection tasks in the automotive, medical, pharmaceutical, food and beverage, consumer products and electronics industries.
Designed as an introduction for factory automation professionals responsible for production efficiency and product quality, each seminar combines a machine vision basics tutorial with live demonstrations of the new industrial grade In-Sight 5000 Series vision sensors and ID readers. The tutorial covers how vision sensors work in manufacturing applications to accurately gauge, guide, identify and inspect products to reduce scrap costs and inventory problems and achieve a high level of product quality.
In addition to walking away with an understanding of the fundamentals of implementing a successful vision solution, participants will receive free In-Sight Explorer trial software on a CD, which provides hands-on experience developing vision applications from start to finish. The CD also includes application examples, preliminary design considerations, a multi-media tutorial on building vision applications, lighting and optics videos and a utility package that helps determine the field of view and resolution requirements of vision applications.
The seminars will run from August through December in major cities across the U.S., Canada, Mexico and Puerto Rico. Register online at www.cognex.com/seminar or call (800) 677-2646.
Copyright 2004, UP Media Group. All rights reserved.
Eleven Cookson Electronics employees representing offices around the globe have been awarded the Presidents Award for their work in 2003. The awards were officially presented at a ceremony at the Castle Hill Inn and Resort, Newport, RI, in May, with 65 employees and guests in attendance.
Doreen Agnew, Robert Wallace, Gary Klimala, Robert Cahill, Wim van Ravenswaay, Rich Caron, Rick Correia, Stephen Whitehead, John Tremblay, Mark Foster and Axel Fuhrmann were presented awards for specific achievements that have gone above and beyond their day-to-day responsibilities with direct impact on the business.
"This is a very prestigious honor that recognizes the highest level of performance within our organization," said Allan MacDonald, vice president of human resources. "These employees should be very proud of their accomplishments."
The ceremony included an opening video and introductions of each recipient, along with a description of his or her accomplishment by the individuals who nominated them for the recognition award.
Cookson Electronics is a supplier of assembly materials, semiconductor packaging and specialty chemicals and coatings used in the electronics assembly and surface finishing industries.
Copyright 2004, UP Media Group. All rights reserved.
Cookson Electronics Assembly Materials (Jersey City, NJ) will implement a tin surcharge covering the dramatic increase in the cost of tin on all invoices for ALPHA solder paste when the London Metal Exchange price exceeds $9,500/metric ton. The surcharge calculation is based on official LME pricing (www.lme.co.uk) which confirmed that tin prices more than doubled in the last six months over the previous two-year average.
In May, the price of tin broached the $10,000/per metric ton psychological level. Adding to the upward price pressure on tin, some analysts and research groups suggest that the production of tin for 2004 will be approximately 6% less than the demand. Prices for other metals over the same period have also risen sharply with copper up 91%, lead up 128%, nickel up 146% and silver up 95%. The surcharge does not address the cost increases for these metals.
"This year-long run up in the cost of tin has hit us particularly hard," said David Zerfoss, president of Cookson EAM. "An example of its impact is that 63% of 90% of the solder paste we ship worldwide is tin...Given this severe cost increase situation and the importance of tin in the assembly process, we are forced to ask our customers to share the burden with us. As soon as tin prices drop below $9,500/metric ton, I will rescind the surcharge."
Copyright 2004, UP Media Group. All rights reserved.
FEINFOCUS (Stamford, CT), a supplier of x-ray inspection systems and tube technology, announces two new additions to the application engineering staff: Dr. Guido Rademaker and Thomas Pukall. With the addition of Dr. Rademaker and Pukall, the company has substantially increased its applications staff.
Under the leadership of newly appointed director of technology development, Dr. Udo E. Frank, the application staff is responsible for identifying future market demands in the global electronics industry and tailoring an x-ray solution to fit each requirement.
The company also announced that Dr. Frank will be the keynote speaker for FEINFOCUS' global technical seminar series on x-ray inspection technology. The company is sponsoring this program in an effort to educate customers on the most recent advances in x-ray inspection technology.
Copyright 2004, UP Media Group. All rights reserved.
The new Universal Instruments (Binghamton, NY) AdVantis AFC-42 placement machine is designed to reduce the cost of entry for manufacturers needing high mix capability, increased speed and greater accuracy. The machine leverages Universal's platform concept to deliver a low priced but scalable solution ideal for low-margin assembly applications. The machine also has a smaller footprint to occupy less shop floor space.
Like its predecessor, the new machine features a single-beam positioning system. However, it employs dual-drive lead screws as well as 1um linear encoders for accuracy close to that of the GSMxs linear motor based platform.
"All of the capability and functionality of high-end assembly has been transferred to the AFC-42, including high magnification cameras, flip chip algorithms, low force capability, heated spindles, fluxing, several feeder types and dispensing," said Richard Boulanger, vice president of the advanced semiconductor assembly division.
The company believes the placer will be attractive to high-mix and high-volume manufacturers whose markets demand the utmost cost-per-placement efficiency in order to sustain narrow margins.
Copyright 2004, UP Media Group. All rights reserved.
The National Physical Laboratory (www.npl.co.uk) has announced the launch of a new report, "Susceptibility of Glass-Reinforced Epoxy Laminate to Conductive Anodic Filamentation," written by Alan Brewin, Ling Zou and Christopher Hunt.
Conductive anodic filamentation (CAF) is a subsurface failure mode for woven glass-reinforced laminate (FR4) materials, in which a copper salt filament grows and results in a consequential electrical short between plated through hole walls or adjacent copper planes. In the study, FR4 laminates in the form of high PTH density multi-layer test circuits were exposed to different manufacturing conditions and studied for resistance to CAF initiation and growth.
CAF performance was assessed using high temperature and humidity conditions to promote failures, with a voltage applied across adjacent vias. By applying a range of voltages and via geometries, the basis for a performance map for laminates was obtained for use in materials comparison. The changes due to exposure of laminates to lead-free temperatures and other processing steps were then examined using the technique and a number of important recommendations were made to minimize the possibility of CAF initiation and growth.
All reports released by the Electronics Group at NPL can be searched and downloaded free from: www.npl.co.uk/ei/publications.
Copyright 2004, UP Media Group. All rights reserved.
Sanmina-SCI Corp. (San Jose, CA), a global electronics manufacturing services (EMS) company, and Agilent Technologies Inc. (Palo Alto, CA), have announced a new technique for rapidly generating high-resolution, sub-surface 3-D scans of complex multilayer backplane and printed circuit board assemblies (PCBAs).
Using Agilent's 5DX Series 5000 automated x-ray system, the new method verifies how well press-fit connectors with compliant pins are positioned within plated-through-hole (PTH) conduits.
Featuring multilayer construction that can exceed 48 layers, Sanmina-SCI's backplanes deploy high-density, press-fit connectors into PTH conduits with diameters that often measure 0.022 in. and smaller.
Kent Dinkel, Agilent's Imaging marketing manager, Automated Test Group, said, "Our 5DX system was designed to be a powerful x-ray tester always looking for new problems to solve. We salute Sanmina-SCI for galvanizing an application that has enabled the industry's first sub-surface 3-D scans of complex backplanes in production environments."
Dinkel also noted that press-fit connectors having compliant pins are becoming more widely used in a number of PCBA markets.
Sanmina-SCI noted that when multiple component types, including surface-mount devices, populate a backplane or PCBA, the new inspection method can scan the entire backplane—both surface and sub-surface simultaneously—to check solder contacts of components as well as press-fit connector contact integrity.
Copyright 2004, UP Media Group. All rights reserved
GE Commercial Finance, Global Electronic Solutions (GES, San Diego, CA), an equipment lifecycle management supplier, has appointed Roger Innes as president and CEO. In this position, Innes will be responsible for overseeing and directing all of GES on a global basis and ensuring continued GES growth. Under his leadership, GES will continue to add staff worldwide and develop new products and services.
Previously, Innes was managing director of capital markets and business expansion for GES. Building upon his experience in the technology equipment leasing and finance industries, Innes will continue to promote GES' platform—equipment acquisition, optimization and disposition—to customers worldwide.
"Roger's 20+ years of technological experience in the equipment leasing and finance industries, coupled with being one of the founders of creating the platform for managing the lifecycle of semiconductor equipment, truly makes him the most appropriate person to continue growing GES on a global scale," said Paul Bossidy, CEO of GE Commercial Finance, Commercial Equipment Financing.
Innes was cofounder and president of Comdisco Electronics, whose portfolio was acquired by GE in April 2002. Prior to joining GES, Innes served in various leadership positions in both sales and general management with Comdisco, GE Capital and Equitable Life Leasing companies.
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