ST. PETERSBURG, FL – Jabil reported fiscal third quarter net revenue of $7.2 billion, an increase of 13.9% year-over-year.
SCOTTSDALE, AZ – IC Insights raised its 2021 worldwide IC market forecast to growth of 24%. The global IC market is expected to exceed $500 billion for the first time.
ARLINGTON, VA – The JEDEC Solid State Technology Association established JEP181, a neutral file, XML-based standard for electronics cooling simulation for the microelectronics industry.
KUALA LUMPUR – VS Industry Berhad reported fiscal third quarter revenue of RM 1.07 billion (US$260.9 million), up 112.6% year-over-year.
STAMFORD, CT – After a steep decline in 2020, global smartphone sales to end users grew 26% in the first quarter of 2021, according to Gartner. Overall, worldwide mobile phone sales to end users grew 22% year-over-year.
ATLANTA – CIRCUITS ASSEMBLY today announced free registration is open for its annual Service Excellence Awards (SEAs) for electronics manufacturing services (EMS) providers.
STAMFORD, CT – The worldwide semiconductor shortage will last through this year and not recover to normal levels until the second quarter of 2022, according to Gartner. Substrate capacity constraints could extend to the fourth quarter of next year.
AMHERST, MA – A research team from the University of Massachusetts Amherst has developed an electronic microsystem that can intelligently, autonomously respond to information inputs without external energy.
SIEVI, FINLAND – Due to strong customer demand, Scanfil is revising upward its revenue and adjusted operating profit outlook for 2021. The company now estimates revenue for the year will be €630 million to €680 million and adjusted operating profit of €41 million to €46 million.
NEW YORK – Electronic and electrical equipment sales were down 30% in low- and middle-income countries in the first three quarters of last year as a result of Covid-19, according to a new UN report. In high-income countries, sales were down 5% in the same period.
COHOES, NY – PVA received a patent for its optical bonding software in Europe. The patent is for the UK, France, Italy, Germany, Hungary, Portugal and Spain.