PEACHTREE CITY, GA – The Printed Circuit Engineering Association (PCEA) today announced Stephan Schmidt as recipient of the third annual PCEA Membership Award.

PEACHTREE CITY, GA – The Printed Circuit Engineering Association (PCEA) today announced Susy Webb as recipient of the third annual PCEA Leadership Award.

TAIPEI – Foxconn announced NT$1.85 trillion ($57.3 billion) in revenue for the third quarter, a 20.2% increase and the highest revenue the company has ever reported for the quarter.

ATLANTA – The electronic component sales sentiment fell to 98.8 in September, marking a decrease of nearly 10 points from August and ending a two-month trend of positive sentiment, ECIA reported in its monthly Electronic Component Sales Trend survey results.

MILPITAS, CA – PCB and multi-chip module design software revenue grew 8.2% in the second quarter, totaling $399.2 million, according to the Electronic System Design Alliance's latest Electronic Design Market Data report.

HYDERABAD, INDIA – Indian electronics manufacturer Cyient DLM has announced the acquisition of US-based Altek Electronics.

AHMEDABAD, INDIA – Aimtron Electronics has announced an expansion of its domestic operations in India after a public listing earlier this year.

NEW DELHI – Sahasra Electronics Solutions saw its shares open at INR537.70 ($6.40) in its initial public offering on India's NSE SME exchange, marking a 90% premium on the issue price of INR283 ($3.37) per share.

ST. PETERSBURG, FL – Jabil has announced the acquisition of Mikros Technologies, a manufacturer of liquid cooling solutions for thermal management.

WASHINGTON – Global semiconductor sales hit $53.1 billion in August, the highest-ever total for the month and a year-over-year increase of 20.6%, the Semiconductor Industry Association announced.

OULU, FINLAND – Scanfil has announced the acquisition of SRXGlobal and its factories in Melbourne, Australia, and Johor Bahru, Malaysia, for €23.3 million ($25.7 million).

MILPITAS, CA – The global semiconductor packaging materials market is expected to start a growth cycle with a 5.6% compound annual growth rate projected through 2028, SEMI, TECHCET and TechSearch International announced in their latest Global Semiconductor Packaging Materials Outlook (GSPMO) report.