TAIPEI -- Pegatron is denying accusations by a non-governmental organization that the ODM/EMS is violating customer and Chinese mandates covering worker overtime.

SAN JOSE, CA — North America-based manufacturers of semiconductor equipment posted $1.79 billion in orders worldwide in July (three-month average basis), up 13.1% year-over-year and 4.7% sequentially, says SEMI.

OSAKA – Foxconn is dissolving a Japanese unit that handled research and development on organic light-emitting diode panels. The unit's engineers have moved to Sakai Display Products.

LYON, FRANCE – Following high-volume adoption of TSMC’s InFO and further development of eWLB technology, a wave of new players and FO WLP technologies may enter the market, says Yole Developpement.

NEW YORK -- A worker's rights group is claiming -- again -- that Pegatron is shirking rules governing wages and overtime in China.

WESTLAKE, OH – Nordson reported fiscal third quarter net sales ended July 31 of $490 million, up 6% year-over-year.

TAIPEI – Two Foxconn workers reportedly died in separate incidents last week. Both worked in the firm’s L03 production building where most of Apple's iPhones and iPads are made, according to reports.

BANNOCKBURN, IL — IPC has announced plans to start development of a standard to cover qualifications and acceptance requirements for press-fit pin technology intended for the automotive and other industries.

LOUISVILLE, KY – Sypris Electronics reported second quarter revenue of $8.7 million, flat year-over-year, reflecting an increase in product sales and billings under a new engineering services contract, offset by a decrease in electronic manufacturing services due to the completion of a program in 2015.

LAGUNA, PHILIPPINES — Integrated Micro-Electronics Inc. has signed an agreement to acquire a 76% stake in Via Optronics for $53.7 million.

TUALATIN, OR – LPKF Laser & Electronics reported second quarter sales grew almost 20% year-over-year. EBIT was EUR 700,000 (US$ 790,424).

ALBUQUERQUE, NM – Optomec said its Aerosol Jet Technology can enable 3D polymer and composite structures to be printed at the micron scale with embedded electronics.