DANDERYD, SWEDEN -- Note reported fourth-quarter sales slumped 18% year-over-year to SEK 297.7 million ($44.5 million).
ARLINGTON, VA -- The US Air Force has suspended Hong Dark Electronic Trade Company and its subsidiaries from government programs after finding them responsible for selling tens of thousands of fake parts to key defense contractors.
ORLANDO, FL -- API Technologies reported revenue climbed 8.5% sequentially to $75.1 million for the period ended Nov. 30.
DANDERYD, SWEDEN -- Note reported fourth-quarter sales slumped 18% year-over-year to SEK 297.7 million ($44.5 million).
TAIPEI -- Foxconn Technology reported unconsolidated January sales nosedived 46.3% from last year to NT$3.5 billion ($118.1 million).
BILLINGSTAD, NORWAY – Kitron's revenue was NOK 442.9 million ($77.1 million) in the fourth quarter, down 2.7% year-over-year.
SAN JOSE – OnCore Manufacturing Services today said it intends to enter into a medical product design alliance with Proven Process Medical Devices.
The partnership would provide turnkey design-to-production solutions, the contract electronics manufacturer said.
Oncore said it would “significantly expand” its capabilities in the medical device market with the partnership.
No financial terms were disclosed.
BINGHAMTON, NY -- Universal Instruments today said its global market share rose nearly 2% year-over- year in the fourth quarter.
SCHAUMBURG, IL -- Sparton reported fiscal second-quarter net income rose 36% to $1.9 million, boosted by higher demand in all its end-markets.
ST. LOUIS -- Viasystems Group forecast December quarter sales of $269 million, up 10% year-over-year and down 4% sequentially on broad-based strength.
HELSINKI -- Nokia will lay off 8% -- some 4,000 employees -- of its workforce in Finland, Hungary and Mexico as part of its now year-long cost-cutting measures.
MINNEAPOLIS, MN – The SMTA is soliciting applications from full-time graduate-level students pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field, for the $5000 Charles Hutchins Educational Grant.
TEMPE, AZ – Finetech plans to donate a die bonder in a drawing this summer open to qualified US and Canadian universities and colleges.
The multi-application Pico MA bonder with 5 µm placement accuracy is valued at $100,000. The platform is for advanced packaging and assembly applications, such as flip chip, optoelectronics, 3-D, wafer-level integration, micro-optics assembly, sensor packaging, and precise die bonding.
Finetech celebrates its 20th anniversary this year.