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LEWISVILLE, TX -- Top 15 EMS firm Elcoteq has acquired a local company that specializes in after market services. Terms were not disclosed.

SAN JOSE – Analysis of planned capital expenditures at over 200 semiconductor manufacturing facilities shows total semiconductor capex spending will grow 15% to 20% this year, SEMI says. A significant portion of this spending is promising to result in record investments in new and used fab equipment, says the trade group.

SEMI-compiled data from more than 200 facilities, including LED fabs, reveal a 28% increase year-over-year for fab equipment spending in 2011, followed by a 4% drop next year.

Spending on construction projects is expected to decline about 13% in 2011 and 9% in 2012.

Among the major investors, TSMC increased capex from a record $5.9 billion in 2010 to $7.8 billion in 2011. Intel increased capex from $5.2 billion in 2010 to $9 billion in 2011. Globalfoundries doubled capex to $5.4 billion in 2011, and Samsung increased total capex (including R&D) 18%.

In 2011, fab equipment spending for foundries is expected to reach the highest level in history. Foundries are expected to continue to spend at accelerated levels in 2012. Memory companies will spend much less aggressively in 2011 than in 2006 and 2007, with equipment spending approaching 2008 levels. A large segment of the pie is spending on MPU/logic, mainly driven by Intel, whose MPU investments will reach record levels in 2011.

SEMI predicts capacity growth of about 9% for 2011 and 7% for 2012. Foundries will have the strongest increase in capacity this year, followed by MPU/logic and memory. Foundries are also expected to lead capacity growth in 2012.

Based on 45 future fabs that will begin production from 2012 to 2016, annual capacity growth rates in 2013 and 2014 are expected to hover around 7%. Most spending is directed toward upgrading existing facilities.

In 2010, 34 new volume fabs began construction; in 2011, only seven have a high probability of being realized, and four more are likely to start in 2012, the firm says.

The largest segment for new fabs is the LED industry, with wafer sizes of 2" and 4". However, significantly fewer new LED fabs will begin construction in 2011 and 2012. Only five new LED fab projects are likely in 2011.

In 2010, SEMI counted seven 300 mm volume fabs (excluding R&Ds and pilots) beginning construction. However, in 2011, only Intel’s fab is predicted to start in mid-2011. In 2012, three 300 mm fabs will begin construction: one foundry and two integrated device manufacturers, two of which are potential candidates for 450 mm-ready cleanrooms.

SEMI has identified seven facilities (R&Ds, pilots and volume fabs) in the near future that are candidates for 450 mm readiness. The first facilities are expected to come on line in 2013.

The Advanced Technology Investment Company said it will spend $6 billion to $7 billion on a High Tech Center in Abu Dhabi. The center includes a plan for a 300 mm wafer fab, and production is expected to ramp up in 2014 or 2015. Also, Rusnano plans a project to produce telecommunication ICs at a fab in Siberia.

Register now for Virtual PCB, the industry's only live, fully interactive, Web-based conference and trade show for PCB engineers, designers, fabricators, assemblers and managers worldwide, March 8-9. www.virtual-pcb.com

NORTH BILLERICA, MA – BTU International today reported fourth-quarter 2010 net income of $2.2 million, compared to a net loss of $3.9 million in the same quarter of 2009 and breakeven in the preceding quarter.

Net sales for the period were a record-breaking $27.4 million, up 127% year-over-year, and up 44% sequentially.

Net income for 2010 was $2.2 million, compared to a net loss of $14.6 million in 2009. Full-year net sales were $81.6 million, up 81% year-over-year.

“Our alternative energy business contributed 60% of our system sales in the fourth quarter. This marks the first time that our alternative energy – solar and nuclear – business exceeded our electronics assembly business to become the primary contributor of net sales. The growth of our solar business was driven by both our inline diffusion and metallization products,” said Paul J. van der Wansem, BTU chairman and CEO.

The firm expects first-quarter revenues to be in the $24 million to $26 million range because of a softer electronics business.

BTU supplies advanced thermal processing equipment and processes to the alternative energy and electronics manufacturing markets.

LONDON – A new publication by a electronics industry collaborative provides guidance to manufacturers and design engineers on recent RoHS changes.

The free RoHS eBook incorporates new rules invoked last September, and will eventually include a range of additional electronics and electrical products not previously covered by the European environmental legislation. It also outlines dates when medical devices and monitoring and control instruments (along with additional exemptions) will fall within scope.

The collaborative known as element14 also offers guidance on EU RoHS, China RoHS, Korea RoHS, REACH, ErP, WEEE, the Battery Directive plus state and provincial environmental laws in the US and Canada.

TEMPE, AZ – Economic activity in the manufacturing sector expanded in February for the 19th consecutive month, says the Institute for Supply Management. The PMI registered 61.4%, up 0.6 points, with new orders at 68%, up a slight 0.2 percentage points. Production was 66.3%, up 2.8 points. Inventories dropped 3.6 points to 48.8%, and customer inventories fell 5.5 points to 40%. Backlogs reached 59%, up 1 percentage point.

BANNOCKBURN, IL – January printed circuit board shipments from North American fabricators increased 4.3%, but orders fell 6.5% year-over-year.

The book-to-bill ratio posted a gain of one-tenth, to 0.97, says IPC. It was the fourth straight month the ratio was below 1.0, the leading indicator for sales growth over the next two to three months.

Rigid PWB shipments were up 3.7%, and orders dropped 7.7% compared to January 2010. The book-to-bill edged up to 0.97.

Flex shipments for the month were up 10.7%, while orders were up 5.3% year-over-year. The flex book-to-bill climbed above parity to 1.01.

IPC said the sales followed normal seasonal patterns, and that the figures are stable.

Rigid PWBs represent an estimated 89% of the current industry in North America, says the firm. Rigid circuit producers reported military sales accounted for 24% of their sales for January, and flex circuit producers reported 46% military sales.

In January, 81% of total shipments reported were domestically produced. Domestic production accounted for 81% of rigid and 86% of flex shipments.

SAN JOSE – North America-based semiconductor equipment manufacturers reported January orders of $1.54 billion, up 30.3% from last year, an industry trade group said.

While the numbers look good versus a year ago, the industry at that time was still coming out of a deep recession. The 90-day average bookings fell 2.9% from the revised December figures, said SEMI.

The book-to-bill ratio was 0.85, meaning that $85 worth of orders were received for every $100 worth of equipment shipped. It was the fourth straight month below 1.0, suggesting slower shipments ahead.

The 90-day average worldwide billings were $1.8 billion, up 2.5% from revised December levels and 88% from January 2010.

“Orders declined slightly although they remain well above January 2010 orders,” said Stanley T. Myers, president and CEO of SEMI. “Industry spending remains solid at the start of the year and we are encouraged by the strength in capital expenditure plans announced over the past month.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based manufacturers. Billings and bookings figures are in millions of US dollars.

ALAMEDA, CA – A new paper presents findings on three small-to-medium-sized electronics manufacturing services firms and common themes for success.

Through interviews with Digicom Electronics, Nistec Group, and PartnerTech over a 15-year span, the paper shows how management has survived economic fluctuations, parts shortages, demanding customers, and an ever-broadening scope of services, while competing with companies leveraging low-wage regions, huge buying power, and economies of scale.

Technology Forecasters’ “Contract Electronic Manufacturers with Staying Power” is available at http://www.techforecasters.com/whitepapers/wp_tfi_lasting_cms.pdf.

TEKIRDAG, TURKEY – Foxconn has launched production here to produce HP desktop PCs.

MILPITAS, CA – This week’s SEMA meeting here will address the evolving China photovoltaics model and its ramifications for the North American and European industries.

Matthew Holzman, president of SEMA, will present a technical assessment of the Chinese photovoltaic industry Mar. 3 at Flextronics, offering comparative data to help attendees understand the key differentiators in capital cost models, technology, manufacturing efficiency and quality practices.

RSVP to Jasbir Bath at jasbir.bath@solar-ema.org.

For more information about SEMA, visit www.solar-ema.org.

KEMPELE, FINLAND -- PKC Group, a top 50 EMS company, has signed an agreement to purchase Segu's wire-harness companies in Germany, Poland and Ukraine.