BRONSCHHOFEN, SWITZERLAND -- A new white paper from Cicor explains ultra high-density interconnect printed circuit boards.

Further miniaturization of electronics devices of many kinds and the higher level of integration require a different approach toward manufacturing PCBs, the company says. Electronic components and packages get smaller almost every year. More densely packed boards are needed, a need that us rapidly increasing in many business segments.

Miniaturization is a need in all dimensions, not just pattern density in x and y, but circuit thickness is also of high importance. Current techniques have either reached their limits or will reach them within the next few years. New manufacturing processes or new combination of processes will be required to fulfill the needs, as well as keeping costs under control. The paper discusses potential approaches to produce these types of ultra high density circuits.

Cicor fabricates and assembles PCBs across factories in North America, Europe and Asia.

• Prev
• Next