BRONSCHHOFEN, SWITZERLAND -- Cicor has launched a new technology platform said to enable high density of integrated functions for printed circuit boards, and at a higher throughput than traditional methods.

The new DenciTec platform involves a semi-additive process using a combination of PCB and thin-film technology. Unlike classic semi-additive processes, however, which suffer from slow production speeds or high costs, Cicor says its novel process is faster to produce yet also less expensive.

In a press release, Cicor said the process involves "optimal use of a unique combination of cutting-edge devices," although other details were left vague.

The PCB fabricator/assembler did report that DenciTec could be capable of conductor widths and spacings down to 25µm with copper thicknesses of 20 +/-5µm on all conductive layers, laser-via diameters of 35µm, annular rings with a diameter of 30µm for innerlayers and 20µm for outerlayers, copper-filled blind vias with the option of via stacking, and via-in-pad. It also reported the potential to produce ultra-thin circuits, such as four-layer flex circuits with a total thickness of less than 120µm.

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