M70 fully automatic SMT placement machine assembly offers flexible Feeding options for bulk components. Optical component centering. Optional fully automatic precision dispenser for solder paste and SMD adhesives. For small to medium volume production. Accepts circuit boards up to 350 x 500mm. Places parts ranging from 0201 to 35 x 35mm and 0.5mm pitch. Has 80 sampling positions for 8mm straps. Placement rate 1,500-1,800 cph. X/Y resolution is 10 microns, and placement accuracy is better than 0.1mm.

Mechatronika, www.mechatronika.com.pl

Moduleclean inline batch cleaning system is for cleaning assembled PCBs, stencils, and other electronics products. Cleans surface mount technology applications such as defluxing of low-residue and Pb-free technology. Options include ultrasonic, spray-in-air, spray-under-immersion, oscillation-under-immersion, and air-under-immersion. Can be designed as a modular system built in various configurations. Features include 100% filtration; rinsing with DI water reclaim; vacuum dryer, and process traceability.

PBT Co., www.pbt.cz

X-Quik x-ray inspects items such as electromechanical devices, sensors, molded parts, mail parcels and biological samples. Footprint is just more than 2 ft.³. Is suited for engineering labs, machine shops and quality control departments. Provides “click to scan” operation. Reportedly no training required. Image formats may be exported via wireless communication to desktop PCs, tablets or mobile phones. Available image analysis tools include data archival, image annotation, automatic contrast optimization and digital zoom. Image output formats include BMP, JPG and DICOM. Has an 80 kV mono-block source and LDA detector.

VJ Electronix, www.vjelectronix.com 

SFX Gang Test Module Kit consists of three basic modules for easy-to-integrate, parallel test or programming of up to 16 or 32 units. Requires one system controller. Can be flexibly adjusted to various environments and different test and programming applications such as flash programming, MCU programming or dynamic tests per Processor Emulation. Consists of three interconnected module types – a TAP transceiver, a multipurpose parallel I/O unit, and a power management unit. For simple system integration, all modules have onboard Mass Interconnect Interfaces from Virginia Panel, and are controlled by a central controller. Supports all modern technologies for Embedded System Access (ESA). In addition to boundary scan, these are Processor Emulation and chip-embedded instruments, for design validation, hardware debugging, production test, programming without probe or nail utilization (non-intrusive). Each site can be individually programmed in several parameters (protocols, voltage, delays etc.).

Goepel, www.goepel.com

SFX Gang Test Module Kit consists of three basic modules for easy-to-integrate, parallel test or programming of up to 16 or 32 units. Requires one system controller. Can be flexibly adjusted to various environments and different test and programming applications such as flash programming, MCU programming or dynamic tests per Processor Emulation. Consists of three interconnected module types – a TAP transceiver, a multipurpose parallel I/O unit, and a power management unit. For simple system integration, all modules have onboard Mass Interconnect Interfaces from Virginia Panel, and are controlled by a central controller. Supports all modern technologies for Embedded System Access (ESA). In addition to boundary scan, these are Processor Emulation and chip-embedded instruments, for design validation, hardware debugging, production test, programming without probe or nail utilization (non-intrusive). Each site can be individually programmed in several parameters (protocols, voltage, delays etc.).

Goepel, www.goepel.com

Circuit Scribe rollerball pen comes filled with specially formulated conductive ink that dries instantly. Draws electronics circuits instantly. Produces lasts 60 to 80 meters of conductive lines. Conductivity is 50-100 milliohms per square per mil.

Electroninks Incorporated, http://www.electroninks.com/

ProtoLaser 3D has a large, height-adjustable working platform and a laser optic, which corresponds to ones used in production systems. Is for series-like 3D rapid prototyping and process optimization. Is based on the ProtoLaser concept, where working chamber is housed vibration-decoupled in a compact body.

LPKF, www.lpkf.com

ProtoLaser 3D has a large, height-adjustable working platform and a laser optic, which corresponds to ones used in production systems. Is for series-like 3D rapid prototyping and process optimization. Is based on the ProtoLaser concept, where working chamber is housed vibration-decoupled in a compact body.

LPKF, www.lpkf.com

Eexpert 10.6 rework system now comes with the Process Shuttle to streamline flux and solder paste dipping or printing, and pre-positions small surface mountable devices for pickup. Installs on Auto-Vision-Placer (AVP) systems. Features include µSMD Tool, which presents small components with an easy-access fixture, improving processing time. Specific sizes are engineered for optimal pre-alignment. Dipping Tool permits solder spheres on the underside of an area-array device to be coated with a controlled, defined volume of flux or solder paste. Different depths are available to yield specific depositions. Printer Tool permits solder paste or flux to be printed directly onto small components such as quad flat no-leads, enabling immediate placement onto a printed circuit board. Printing stencils can be easily changed to minimize process setup. Transport slide holds various shuttle tools, which feed diverse components to the rework process in a controlled manner.

Retrofits to existing Martin systems that have automated vision placement. Does not require software programming.

Martin, a Finetech Co., http://www.martin-smt.de

Eexpert 10.6 rework system now comes with the Process Shuttle to streamline flux and solder paste dipping or printing, and pre-positions small surface mountable devices for pickup. Installs on Auto-Vision-Placer (AVP) systems. Features include µSMD Tool, which presents small components with an easy-access fixture, improving processing time. Specific sizes are engineered for optimal pre-alignment. Dipping Tool permits solder spheres on the underside of an area-array device to be coated with a controlled, defined volume of flux or solder paste. Different depths are available to yield specific depositions. Printer Tool permits solder paste or flux to be printed directly onto small components such as quad flat no-leads, enabling immediate placement onto a printed circuit board. Printing stencils can be easily changed to minimize process setup. Transport slide holds various shuttle tools, which feed diverse components to the rework process in a controlled manner.

Retrofits to existing Martin systems that have automated vision placement. Does not require software programming.

Martin, a Finetech Co., www.martin-smt.de

ACE real-time temperature data logger permits placement of up to six thermocouples at critical locations on a board to obtain topside printed circuit board temperature readings. Inputs process information to soldering machine control software. Automatically correlates actual topside PCB readings with the infrared pyrometer that controls the preheat system and can directly control the preheater, if desired. Thermal data from all seven channels – six PCB thermocouples and the preheat control IR pyrometer – can be plotted and imported into a spreadsheet or other database program for further analysis graphical examination. Is compatible with advanced ACE selective soldering machines.

ACE Production Technologies, www.ace-protech.com

SpectorBOX bottom-up modular AOI is for inspection of wave and selective soldered plated through-hole and SMT components. Inspects PCBs inside solder frames directly from the conveyor system. Can be equipped with nine cameras, including an optional Z-axis moveable head. XY drive gantry with ball screw mechanics delivers high-speed inspection. 100% simultaneous inspection can be accomplished with two platform modules combined for bottom and top sides. Accommodates board sizes up to 550 x 520mm.

MEK Europe, www.mek-europe.com