Selective soldering platform supports through-hole PCB assembly in batch and in-line configurations. The PHOENIX system provides automated flux application, precision solder control and software-driven process management through EmberX, enabling consistent and repeatable soldering results. Designed for integration into production environments, the platform supports reliable operation and streamlined workflows for electronics assembly applications. Systems are backed by established selective soldering expertise and support infrastructure for ongoing production needs.

Agentic AI platform integrates with manufacturing execution systems to automate reporting, support, modelling and code generation in semiconductor and electronics factories. FabOrchestrator layers large language model capabilities onto MES platforms, enabling engineers to query production data in natural language, streamline support ticket handling and accelerate system configuration and implementation. The platform includes tools for data analysis, automated troubleshooting, system modelling guidance and back-end code generation, supporting more efficient use of factory data and reducing engineering workload.

High-power chip resistors with aluminum nitride substrates support thermally constrained electronics applications. The RMAN series uses aluminum nitride to enable higher thermal conductivity than standard alumina, allowing improved heat dissipation, lower operating temperatures and stable electrical performance. Designed for power-dense environments, the resistors support applications including IGBT, SiC and GaN modules, power supplies, EV systems and RF circuits. Devices deliver power ratings up to 2.4W in 1206 and 3.4W in 2512 packages while maintaining controlled hotspot temperatures.

AI-driven probe inspection system automates ICT fixture verification in electronics manufacturing. The system uses high-resolution imaging, synchronized lighting and adaptive AI to analyze probe marks across the PCB, verifying contact accuracy and detecting misalignment, insufficient contact and early probe wear. Supports high-density and fine-pitch designs with approximately 7µm resolution and offers single-sided and dual-sided inspection. Generates detailed inspection reports with probe position data, deviation analysis and visual records to support traceability and process control. Available in automated, benchtop and service-based configurations for production, validation and development environments.

Custom SMT nozzle supports accurate placement of terminal-style connector components on Yamaha I-Pulse platforms. Features an angled 4.66mm x 10mm vacuum design engineered to improve pick-and-place alignment for challenging geometries, including Degson terminals. The nozzle addresses handling and orientation issues commonly associated with terminal components. Designed for use with Yamaha I-Pulse M20 bases, the configuration supports applications requiring precise component positioning across a range of SMT processes. 

Code reading system enables high-speed, high-accuracy barcode and data capture in industrial environments. The VisionXpert Smart Code Reader (XS Series) uses deep learning algorithms and adaptive auto-tuning to optimize decoding across variable conditions. The system supports reliable code acquisition in dynamic production settings, improving throughput and traceability. Designed for integration into automated workflows, it enhances data capture performance across manufacturing and logistics operations.

AI-enabled inspection system provides automated optical inspection capabilities for manufacturing lines. The VisionXpert Smart Camera (XC Series) integrates deep learning-based inspection with AI auto-tuning to streamline setup and deployment across a range of applications. The system functions as an all-in-one inspection platform, enabling rapid configuration and consistent defect detection. Designed for inline integration, it supports quality control processes without requiring complex system modifications.

Autonomous mobile robot (AMR) platform enables automated material transport and workflow optimization in manufacturing and warehouse environments. The system integrates vision technology for real-time barcode reading and material verification, supporting traceability and accuracy across production processes. Designed for flexible deployment, the AMR solution supports continuous material flow and features wide-area sensor coverage for safe navigation alongside operators. Its reprogrammable architecture allows rapid adaptation to changing production requirements without additional infrastructure.

Boundary scan platform expansion enables functional testing of automotive serial bus systems, including CAN-FD and LIN, during production. The Bus Access Cable (BAC) module integrates with the Scanflex Multi Port Bus I/O Module 9305, providing direct access to automotive interfaces through the Scanflex system. The module supports simultaneous vector generation and control sequence distribution via the Scanflex boundary scan controller, enabling synchronized testing across multiple interfaces. Designed for automotive electronics applications, it facilitates validation of communication systems increasingly reliant on combined CAN-FD and LIN architectures.

Chip mounters support high-speed SMT assembly with placement rates up to 95,000 components per hour. The systems reduce board recognition time by approximately 30% and use vision-based alignment and calibration to improve placement accuracy and minimize component loss. They handle a wide range of components and support PCB weights up to 4.5kg. The platforms include updated user interfaces and are designed for integration with smart factory environments and automated material handling systems.

Slot-die coater supports thin-film deposition on rigid substrates and flexible materials for research and development applications. The system integrates a vacuum chuck, syringe pump, and heating for controlled coating and drying in a single unit. It enables film thickness control from nanometer to micrometer scale and supports slot-die, bar, knife, and flexo coating methods. The platform is available in two sizes and can be configured for roll-to-roll processing. It is designed for use in laboratory environments including gloveboxes and fume hoods.

EP6STC-80 is a one-component, non-frozen, silver-filled epoxy designed for bonding, sealing, and coating applications requiring thermal and electrical conductivity. The system provides unlimited working life at room temperature and cures at 80°C. Thermal conductivity is rated at 13–14W/(m·K), with volume resistivity below 0.001ohm-cm. Operates across a temperature range of -60°C to 150°C and bonds to metals, ceramics, composites and plastics. It meets NASA low outgassing requirements and contains no solvents or diluents. The epoxy exhibits a tensile modulus of 1,400,000–1,800,000psi at 25°C and cures in 3–5 hours at 80°C. Formulated as a thixotropic paste with viscosity between 500,000–1,500,000cps, supporting manual and automated dispensing. Packaging options include syringes from 20g to 100g and jars up to 200g.