Yincae UF 158UL underfill is said to fill gaps as small as 10 microns, even in 100x100mm chips.

Cybord Real-Time Interception (RTI) visual AI-powered software is said to prevent defective components from being assembled on printed circuit board assemblies (PCBAs) in real time.

Panasonic Connect NPM-GW modular placement machine features real-time monitoring, predictive maintenance, and enhanced versatility in component handling.

Accu-Assembly AccuCart Smart Rack for Feeders manages feeder management and inventory tracking in surface mount technology (SMT) assembly environments.

MicroCare Engineered Fluids are said to be exact replacements for 3M Novec 7100, 7200, and 7300 fluids.

Celus Design Platform simplifies and accelerates the design process with automated, AI-driven recommendations of millions of components.

Electrovert Aquastorm 160 (AS160) cleaning system comes Intermix nozzles for exceptional rinse efficiency for delicate or complex PCB assemblies.

Essemtec Puma Ultra achieves 30,000cph.

Essemtec Fox Ultra reaches an optimum speed of 31,000cph.

Kyocera AVX 9258-100 Series spring-finger board-to-board compression contacts provide full connector functionality in a miniature, low-profile, single-contact form factor that supports flexible PCB placement. 

Indium's Heat-Spring HSx thermal interface material is designed for large area dies with warpage of 200 microns or more.

Yamaha Robotics has released three new hardware-based performance options for high-speed mounters that enhance productivity, quality control and flexibility for handling special products such as large LED boards.