The OE in a Box Full Process Kit and OE in a Box High Density Kit are designed to help electronics manufacturers generate IPC J-STD-001 objective evidence and qualify assembly processes for electrochemical reliability. Include test cards, taped-and-reeled components, SIR testing services and certificates of compliance upon successful completion. Supports qualification of top- and bottom-side SMT assemblies, multiple soldering methods and conformal coating processes.

EmberX is a software control package for TM Soldering Solutions' PHOENIX selective soldering platforms, providing programming, process control and monitoring capabilities for both manual and inline systems. Designed to simplify selective solder programming while supporting operators, process engineers and production personnel. Features integrated visual programming, onboard PCB image capture, HD video monitoring, customizable data collection and automated process validation tools, including wave height verification, nitrogen quality analysis and closed-loop preheating. Additional capabilities include maintenance tracking, fiducial and skew correction, panelized board support and expanded process parameter editing to reduce setup time and improve production consistency.

The Auto Kitting Station automates the tape reel loading process for feeders used in SMT production, reducing reliance on manual labor during production preparation. Designed for integration with Fuji's NXTR A placement machines, Smart Storage system, AMRs and automated warehouses, the unit automates reel removal, reel ID reading, tape preprocessing and feeder loading.

The CLT-FG is a compact SMT placement machine designed to support high-mix, low-volume production and frequent product changeovers. Featuring a machine width of approximately 1m, the platform combines a small footprint with a versatile placement head capable of handling components ranging from small chips to larger devices. Built on Fuji's existing placement technology platform, the system is designed to deliver stable, high-quality placement while maintaining compatibility with existing production assets. The CLT-FG is intended to provide manufacturers with greater flexibility in installation and operation while addressing evolving production requirements and fluctuating demand.

MasterSil 981-LO is a two-component, addition-cured silicone designed for bonding, sealing, coating and encapsulating applications requiring optical clarity and flexibility. The system meets NASA low-outgassing specifications and is suited for aerospace, satellite, optical and optoelectronic applications. The silicone features a Shore A hardness of 20-30, elongation of 200-300%, and operating temperatures from -65°F to +400°F. It provides electrical insulation properties, including dielectric strength of 450V/mil and volume resistivity greater than 10¹⁴ ohm-cm. The material bonds to metals, glass, plastics, ceramics and many silicone rubbers, and offers a 1:1 mix ratio with a 3-4 hour working life for simplified processing and dispensing.

Vision LUXO benchtop magnifiers provide magnification and task lighting for assembly, inspection, rework and production applications. The systems combine precision optics with Luxo's K-arm positioning mechanism to deliver a clear, distortion-free view while enabling smooth adjustment and stable placement during detailed manufacturing tasks. Designed for day-to-day use in production environments, the magnifiers are manufactured in Poland and backed by a five-year warranty. The product line is intended for electronics manufacturing operations requiring enhanced visual inspection and operator ergonomics.

Alpha OM-377 no-clean solder paste is designed for ultra-fine feature printing in advanced electronics assemblies. The formulation supports component sizes down to 008004 and provides consistent transfer efficiency across fine-pitch designs. It is engineered to improve first-pass yield by reducing head-in-pillow and non-wet open defects while delivering electrochemical reliability for long-term performance. The halogen-free solder paste offers reliable wetting on brass and nickel surfaces and produces low post-reflow residue suitable for dense assemblies. Designed for high-volume manufacturing, Alpha OM-377 supports stable printing and reflow performance in high-density, low-standoff applications used in consumer, wearable and miniaturized electronics.

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Silicone-based thermal interface material supports heat dissipation in optical modules, dense electronics and high-speed data applications. DOWSIL TC-3120 Thermal Gel provides thermal conductivity of approximately 12W/m·K and is designed to minimize oil bleeding and condensed outgassing to help maintain optical-grade cleanliness. Flowable, one-part material supports minimum bondline thicknesses of 200µm, fills large gaps and can be reworked after curing. Designed for 800G and 1.6T optical modules, telecommunications equipment, electronic module assemblies, autonomous vehicles and automotive electronic controllers. Material resists thermal cycling, shock, vibration and slumping in vertically oriented assemblies while supporting module-to-heatsink interfaces with uneven surfaces or tolerance stackups.

TNC Series thick-film NTC thermistors provide temperature sensing and monitoring for automotive, industrial, battery management and medical electronics applications. Available in 0402, 0603 and 0805 case sizes, the series offers resistance values from 50Ω to 500kΩ, B values from 2410K to 4700K, and operating temperatures up to 150°C. Devices use thick-film technology to improve mechanical strength, maintain consistent thickness across resistance values and enhance resistance to cracking compared with multilayer thermistors. Components feature strong solderability, fast thermal response, heat resistance and AEC-Q200 qualification for demanding environments.

Stackpole Electronics introduced the HCC series high-current busbar shunts for battery electric and hybrid vehicle current sensing applications. Designed for battery management systems, DC bus measurement and inverter output current monitoring, the series supports current handling above 1400A with resistance values of 100, 50 and 25µOhm. Features all-welded construction for mechanical durability and linear current measurement output across high-current EV subsystems. Available in multiple package sizes and resistance values, the shunts are intended for scalable EV and hybrid power system designs. Stackpole also offers custom sizes, shapes and resistance values through its vertically integrated manufacturing operations.

Henkel expanded its Technomelt portfolio with the PA 6370 low-pressure molding material for electronic assemblies requiring fine-gap filling and environmental protection. Polyamide-based hot melt formulation supports gap penetration down to 0.5mm with ultra-low melt viscosity from 2700–3000mPa·s at 210°C and 1065–1180mPa·s at 240°C. Material provides adhesion stability across multiple substrates and passed lap shear testing after 1,200hr exposure to 85°C/85% RH conditions. Technomelt PA 6370 meets UL 94 V-0 flame retardancy requirements and offers electrical insulation properties with a coefficient of thermal expansion of 175ppm. Operating temperature range spans -20°C to 140°C. Henkel said the material supports low-pressure molding processes with cycle times as low as 30 sec., targeting faster encapsulation compared to conventional potting approaches.

RVCU series high-voltage chip resistors support voltage divider, sensing and measurement circuits requiring stable high-voltage performance. Features voltage coefficient of resistance values from 25ppm–50ppm, lower than conventional high-voltage chip resistors, for improved precision in voltage divider applications. Available in 1206, 2010 and 2512 package sizes with working voltages from 800V–3000V, tolerances to 0.5% and 100ppm TCR. Includes anti-sulfur construction per ASTM-B-905-5 and IEC-62368 compliance for values from 75kΩ–27MΩ. Intended for LED lighting, medical equipment, communications systems, test and measurement instruments and high-voltage control applications.