SV Microwave's 30° solderless PCB compression mount connectors are able to attain edge launch-like performance anywhere on the board.

Henkel's Loctite AA 3952 and Loctite SI 5057 light cure adhesives are designed to bond TPE substrates and overcome the limitations of traditional assembly methods.

Vishay Intertechnology's TSM3 multi-turn, surface-mount cermet trimmers are designed for space-constrained industrial, consumer and telecom applications in harsh environments.

Thermaltronics' TMT-1000S soldering station features a 50W RF power output delivering soldering performance equivalent to over 100 watts in standard systems.

Kyocera AVX's BP1206 and BP2816 series thin-film band-pass filters are said to deliver highly repeatable and reliable RF performance for high-frequency wireless applications in the telecommunications, military, aerospace, medical and consumer electronics industries.

Master Bond EP53TC two-component epoxy is for bonding, sealing, coating and small potting applications.

Kyocera AVX's 9140-000 series of two-piece Stript crimping contacts accommodates wire size from 22-28AWG and carries high current up to 8A per contact.

Stackpole’s CSNL2512 series of shunt resistors offers a 3W power rating in a compact package.

Hirose's ZK1 Series FPC-to-board connector features a plug side with a terminal-less design that contributes to size and weight reduction by switching from discrete wire to FPC.

Emil Otto's EO-M-023 and EO-M-024 flux concentrates were developed for demanding tinning and soldering processes such as strip tinning and radiator manufacturing.

TRI's TR7600FB SII 3-D AXI system is designed to address diverse product layouts and is optimized for specialized substrates, BGAs, multilayered structures, SiP, IC, CSP, flip-chip and more.

Aven's ProVue MAX magnifying lamps are said to provide exceptional clarity and versatility for delicate electronics and medical device work.