Renishaw's RenAM 500 Ultra laser powder bed fusion (LPBF) 3-D printer incorporates new scanning algorithms that allow the laser to fire while the recoater is moving, saving up to nine seconds per build layer.

Hirose Electric's DF51K wire-to-board connector series now includes a surface mount technology (SMT) version.

AIM Solder's NC259FPA solder paste is a zero halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150µm in diameter.

Master Bond's UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms.

Tagarno's T50 digital microscope is equipped with a 4K/60FPS block camera to provide users with a seamless and lag-free viewing experience.

Nordson Electronics Solutions' Asymtek Select Coat SL-1040 conformal coating system includes system-level advancements to elevate automation, control, precision and preventive maintenance for better yield and uptime.

Kurtz Ersa's Powerflow Ultra wave soldering machine features a new soldering module that can achieve speeds of up to 5mm/s.

Kurtz Ersa's Versaflow One X-Series of selective soldering machines offers the option of two pots per soldering module, and can process up to eight assemblies (max. dimensions 350 x 508mm) and up to four assemblies (max. dimensions 508 x 508mm) simultaneously.

Mek's SpectorBOX X series is a modular full 3-D AOI system for Through-Hole Technology (THT) solder joints and THT components.

Murata Manufacturing's GRM188D72A105KE01 multilayer ceramic capacitor is said to feature the world's largest capacitance of 1µF in a 1608M (1.6 x 0.8mm) size.

Kyocera AVX's HP series of miniature high-pass thin-film filters are designed to provide excellent high-frequency performance in a variety of space constrained microwave and RF applications.

Ikeuchi's humidity control systems effectively mitigate static electricity issues in surface-mount technology processes while also significantly reducing CO2 emissions and energy costs.