Apollo Seiko's EF 3040A selective soldering machine combines features such as live teaching, Gerber data teaching, and a 6.5kg solder pot capacity for ultimate flexibility.

Saki's 3Si/3Di-EX Series of 3-D SPI and AOI systems introduce a modular hardware design that allows seamless optical unit upgrades.

Nordson Electronics Solutions' Asymtek Select Coat SL-1040 ultrasonic cleaning station is designed to keep nozzles and needles clean and prevent clogging in conformal coating systems.

ECD’s M-VP rugged vapor phase reflow soldering barrier is designed for use with any ECD six-channel MOLE thermal profiler.

Hirose's DF53 Series connector is its newest addition to its SignalBee connector platform.

MacDermid Alpha Electronics Solutions Alpha HiTech CF31-4026 reworkable edgebond is for high-reliability applications in automotive electronics and high-performance computing.

SpiCAT SpiSCAP online engineering simulation software is for evaluating and selecting SCC and SCM Series supercapacitors for power challenges in industrial, energy, automotive, transportation, telecommunications, commercial building, and consumer electronics applications.

Yamaha Robotics added three hardware-based performance options for high-speed mounters that enhance productivity, quality control, and flexibility for handling special products such as large LED boards.

Würth Elektronik's Aluminum Electrolyte and Aluminum Hybrid Polymer capacitors are now available in vibration-resistant versions in their SMT variants.

SV Microwave's 30° solderless PCB compression mount connectors are able to attain edge launch-like performance anywhere on the board.

Henkel's Loctite AA 3952 and Loctite SI 5057 light cure adhesives are designed to bond TPE substrates and overcome the limitations of traditional assembly methods.

Vishay Intertechnology's TSM3 multi-turn, surface-mount cermet trimmers are designed for space-constrained industrial, consumer and telecom applications in harsh environments.