Heraeus Electronics’ mAgic® PE360 is a silver sintering material developed for large-area power module attachment applications requiring high thermal and mechanical performance. The material enables uniform bond lines and low voiding. mAgic® PE360 sinters at relatively low pressure and temperature. The material is available in both printing (PE360P) and dispensing (PE361D) formats.

Hirose's 1.0mm coaxial connector designed for high-frequency applications up to 110GHz. The connector complies with IEEE Std 287 and is engineered to support advanced RF and microwave designs. Features a compression-mount center contact that accommodates a range of PCB thicknesses, from under 1mm to several millimeters. With voltage standing wave ratio (VSWR) values of 1.8 maximum from 0–67GHz and 1.9 maximum from 67–110GHz. These characteristics support applications where signal integrity and low insertion loss are critical.

ASMPT Siplace V placement platform has a new machine frame and efficient linear drives and measuring systems with increased resolution.

Mycronic MYPro A41DX and A41SX placement machines handle boards up to 1,000mm x 609mm in size, 12.5mm thick and up to 10kg using new T1000 conveyor.

Mycronic BA 01 small dot ejector for MY700 jet printer accommodates solder paste deposits from 180 to 330µm in diameter with a volume ranging from 1 to 4nl.

Mycronic GenI offers true 3-D metrology inspection and full measurement traceability.

Mirtec TAL 3D Scan inspection module attaches to MV-6 Omni 3-D AOI, performing pre-inspection while main 3-D AOI operates.

ASYS VEGO GenS handler has modular design and up to 20% faster cycle time than previous models.

Cencorp 1500 OF EVO 2 odd-form placement machine features large feeder bench capable of handling up to 24 different components in all sizes.

Juki RS-2 placement machine offers high-speed placement up to 50,000cph, aided by laser sensor closer to the board and reduces travel time from pick-up to placement.

Indium Corp. SiPaste C312HF halogen-free, cleanable solder paste is for fine-feature printing.

Automated Production Equipment (A.P.E.) Intruder is a complete hot air BGA rework station with split vision placement/removal capability.