Master Bond's UV15DC80-1Med is a one-component, no-mix epoxy that offers a dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization.

TopLine's new braided solder columns are designed to serve as a drop-in replacement for solder spheres used in BGA components.

Indium's Durafuse HR solder paste alloy is said to deliver enhanced thermal cycling performance and superior voiding performance without vacuum reflow, especially for high-reliability automotive applications.

Stackpole’s RNWA is a thin film chip resistor with all the benefits of wide terminations and is capable of tolerances to 0.1% and TCR as low as 25ppm.

Dymax's UVCS V3.0 LED conveyor is an enhanced version of the Dymax UVCS conveyor curing systems.

Shenmao's PF918-P250 thermal fatigue-resistant solder paste is designed to meet high-reliability requirements.

ASMPT's Siplace CA2 hybrid placement machine combines semiconductor and SMT production to integrate the production of SiPs (system-in-package modules) directly into the SMT line.

Emil Otto's Zinning Green pastes do not require zinc chloride, are not subject to hazard labelling, and can be used for soft soldering and tinning.

Vishay Intertechnology's Draloric AC05 WSZ and AC05-AT WSZ resistors feature a lead form allowing them to function as surface-mount components.

Polar Instruments' GRS550 flying probe test system is designed for fault diagnosis in prototype construction, new product launches, small series and applications for which a traditional in-circuit test or multipin flying prober is too expensive.

Heraeus Electronics' mAgic PE360 silver sinter paste is said to offer enhanced thermal performance compared to traditional soldering methods.

Murata Manufacturing's L Cancel Transformer can neutralize the equivalent series inductance (ESL) of a capacitor, optimizing its noise-reducing capabilities.