Products
The 120° "Y" workstation increases space efficiency while providing a more open and comfortable work area. This workstation cluster is designed for three or more people who may share a common central area, enabling communication and ready access to common equipment, supplies or reference materials.
Personal space is created for each user while allowing for more application possibilities and easy adaptation to changing tasks and work styles. Modular privacy panels vary the degree of privacy desired.
Based on a double-sided columnar system, these workstations can be sized to suit the application through the selection of module sizes ranging from 36 to 72" and column heights of up to 84".
Stacked dies enable highly integrated systems in a single package. Modern microelectronics demand more functionality at chip level, smaller models, shorter time-to-market, greater reliability of design and lower cost. SOCs (system on chip) have made progress, but will soon come up against economic limits - particularly with embedded technologies for improved performance (such as when at least two different process technologies are to be integrated on the chip). This technology mix could be implemented through different chips in the most suitable technology for the respective functions, if not for the challenges connecting multi-pin chips at board or substrate level leads and complicated routing and interference. A possible solution: stacked dies made of ultra-thin silicon.
The thin, flexible silicon chips used are very demanding, highly fragile and also often warped. Suitable equipment for processing these thin dies must take account of these features.
The 2200 apm+ multi-chip die bonder features high-precision linear motors with dynamic servo-control and automatic compensation for temperature drift. High-res camera systems allow positioning precision at the xy level of ± 7 µm at 3 s and a maximum tilt of ± 0.15 ° at 3 s. Z-axis can be individually controlled for bonding functions and adhesive application. For assembly on warped substrates, an ultra-light tool's low bond force works in the 0 - 6 g ± 50 mg range.
The wafer transport system processes up to 25 different wafers with five ejection tools. Features material-protecting synchronous sequence of motions to pick the chip up from the carrier material with the help of a vacuum. Can handle small chips with edge length starting at 170 µm and, for flip-chip assembly, 500-µm chips. Automatic tool changer holds up to six different tools, including a bond head that can be heated to 350°C.
Minneapolis, MN - Arranged by Dr. Ronald Lasky, Indium Corp of America/Dartmouth College, the SMTA Cost Estimating Guidelines with ProfitPro Software are intended to model real-time cost estimating (RTCE) in the electronics industry.
While RTCE is simple in concept, manual calculations are tedious and cumbersome since they include production variables such as cycle time, hours/shift, shifts/day, days/week, set up time and unscheduled/scheduled downtime. Yield loss and cost of repair must also be considered, as well as inventory turns and interest rates.
Using these variables, ProfitPro, an Excel-based software application, can model RTCE for high-volume low-mix to low-volume high-mix lines. The software also has default values of cost metrics if the user does not know them, and can calculate:
- The amount of profit gained if setup time is reduced.
- The amount of profit gained if cycle time is decreased.
- The amount of profit gained if new equipment or materials increases productivity.
Visit the SMTA Bookstore on smta.org for more information.
A new phase change tape extends the line of Thermacool thermal management products for the computer assembly market. Provides high thermal transfer between microelectronic components on circuit boards and heat sinks, allowing the replacement of thermal grease in rapid microelectronic assembly operations.
Available in many customized die cut formats for a range of applications.
The new line of phase change products include:
- C1055, with very high thermal conductivity; has been specified in many high performance processor applications.
- C1060, which has an integral reinforcement to provide more robust handling.
- C1095X01 thermally conductive polymeric interface material designed to avoid bondline adhesion between heat sink and the microprocessor metal surface for rework.
- C1100 phase change compound with room temperature self-adhering-properties and improved heat transfer that is said to rival the best thermal grease.
DEK 248 semi-automatic printers have a new PC-based user interface, allowing operators to view all machine parameters at a glance. A new keyboard features integrated trackball. Has integrated support for Simplified Chinese, Korean and Japanese. A 3.5-inch floppy disk drive is included.
Supports optional vision capabilities. Vision setup features are fully integrated, real-time image data is displayed on-screen. Vision information of the product is saved automatically with the product file.
The new UI resembles the interface available for DEK's high-end fully automatic platforms, enhancing commonality between machines in the range.
ALPHA OM-325 lead-free solder is said to simplify the transition to µ-fine feature printing in lead-free processes. Reportedly offers excellent print transfer efficiency, self-alignment properties with small components down to 0402 or 01005", joint cosmetics across challenging reflow profiles, low voiding performance and product stability.
"We developed ALPHA OM-325 in our Japanese R&D center in collaboration with leading global adaptors of lead-free technology for use in their high end consumer electronics products," said Valentijn Van Velthoven, global product manager. "Our rigorous product development work for OM-325 can be compared to what Formula One technology means for the automotive industry. We have achieved tomorrow's technology, and made it available today."
Made with Type 4 and 5 powder, the paste delivers excellent µ-fine feature print yield and works well in demanding high-soak reflow profiles.
PELASPAN-PAC Anti-Static provides cushioning for a range of electronic parts and components to protect them from static discharge during shipment. The pink, s-shaped polystyrene material is free-flowing, cutting packaging time. Weighs 5 pounds per cubic foot - 15% lighter than comparable varieties of packing peanuts. Reusable, recyclable and part of a nationwide reuse program to lessen the loose-fill sent to landfills each year.
Available from 20 facilities nationwide.
FLX2010 SMD pick-and-place has 190 feeders, allowing feeder changeover during operation with nearly no downtime. Can place 5,000 components per hour.
Precision drive technology places 0201 or ultra-fine pitch 0.3 mm components, as well as condensators up to 15 mm, large connectors and 50-mm BGAs. Features both laser and vision centering systems for speed and accuracy.
Feeder management system automatically recognizes feeders and pickup height. LEDs show the feeder status. Feeder setup control system based on barcode identification excludes the risk of setup failure.
Machine programming can be prepared offline. CAD data can be imported; the board is graphically displayed before production.
Optional software system features stock management, production planning, simulation and data recording for traceability.
Can be expanded to a two- or three-module production line for more feeder capacity (up to 300 feeders) and production speed (up to 15,000 cph).
Using Laser-Microjet technology, the LS 800F cuts from 1 to 10 holes per second (or 36,000 apertures per hour), reportedly without any heat damage, burrs or oxidation.
Uses a fiber laser source uniquely suited for thin, high precision stencils and masks.
Fiber lasers have high pulse-to-pulse stability, are compact, ensure efficiency, are robust, have low consumption of electrical power and are maintenance-free. They do not necessitate any alignment, cleaning or servicing of optical parts. Does not require any lamp or diode exchanges. Diode lifetime surpasses 100,000 hours.
The fiber lasers emit pulses at a repetition rate between 20 and 50 kHz, with a pulse duration measured in nanoseconds. Said to offer a fine cut, higher cutting speed and a higher accuracy than conventional laser sources. 100um fiber core diameter enables users to apply water jets below 30 um.
Synova S.A. (Ecublens, Switzerland)
RemoteTech remote diagnostics service allows Speedline's support center to remotely diagnose and solve customer equipment and application problems.
Customers can expect improved troubleshooting and problem solving over the Internet and telephone, minimizing field service visits, cutting mean time to repair, lowering maintenance costs and reducing staff technical training.
The secure service allows Speedline to access equipment recipe files and error logs, facilitating software upgrade uploading.
The diagnostic services are available for most of Speedline's products currently in production. The customer's equipment must have an Ethernet card or modem, be connected to the Internet and use Microsoft Windows.
The services will be free of charge during the equipment's warranty period and will be included in the company's Protection Plus service contract. Can be purchased on a per-machine basis.
Indium3.1 water-soluble Pb-free solder paste is formulated for fine-pitch applications. The company claims the long stencil life virtually eliminates solder paste waste.
Said to exhibit excellent wetting under both air and nitrogen reflow atmosphere. Residue is easily cleaned with water.
Features a wide reflow window, slump resistance, low voiding and low foaming.
MX-Series SMT assembly systems are for medium- to high-volume operations. They feature real time vacuum monitoring prompts the operator (without stopping the machine), when a job is loaded and when running. When it detects the vacuum threshold in the heads is low, it also alerts the operator. Each feeder, in addition to storing part number, lot code and feeder pitch, carries its presentation performance forever.
The series consists of two systems, MX-310 and MX-240. Features include:
- Placement accuracy of 33 µm at 4-sigma accuracy for QFPs, BGAs and CSPs.
- A line scan camera inspects large parts and odd-form.
- A coplanarity checker inspects parts for pre-placement lead warpage.
- Improved illumination on all systems allows for more LEDs (both collimated and oblique), resulting in improved recognition of the full component range.
- Light settings invoked for each part, preventing machine stoppages from "false failures" due to non-uniform lighting.
- A flip-chip camera, for processing FC devices.
Also, the MX-310 has a four stage transport system that enables 25% more speed when processing 8" x 12" boards; a head mounted servo driver/motion controller that permits machines to run at higher speeds through faster response times and eliminates 75% of the cabling from the head to the bottom chassis.
The MX-240 has a closed-loop force control head to minimize impact force. These spindle-mounted sensors operate in concert with high-response vacuum control for force control; a high-speed tray presentation, a side-mounted P40TSU (40-tray shuttle unit) that presents tray fed components without limiting feeder space or board size; and can be configured with two units, which allows 170 unique part numbers to be held per machine.
Tyco Electronics will premiere the Mirae MX-Series at Assembly Technology Expo, Sept. 26-30, 2004.
http://automation.tycoelectronics.com
