MAHARASHTRA, INDIA -- The chip-on-flex market is expected to grow at compound annual average of 4.43% over the next five years, reaching $1.8 billion by 2021.

Also known as direct chip attachment, chip-on-flex is sought after for its high bend strength, which makes it useful in processes that require bending and folding. It is also used in electronics equipment that requires repeated movements, such as printers. Other advantages provided by CoF include savings in space, mechanical flexibility, low production cost and increased reliability from heat distribution, says Market Research Future, which issued the study.

The market is majorly driven by growing range of applications in the industrial, military, computer, telecommunication, consumer electronics, and medical electronics industries. The increasing collaboration between printed circuit board companies and funding by government bodies also ensures the prevalence of flexible printed circuit board in consumer electronics, automotive, aerospace, defense, medical and as other applications.

As wearables for medical applications become more common, two-dimensional circuits are being replaced by flexible circuit boards, which will drive growth of flexible PCBs during the forecast period, Market Research Future added.

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