HERNDON, VA – A new iNEMI project will explore PCB design, fabrication and board assembly processes that could affect board warpage.

The PCB Warpage Characterization and Minimization Project will develop guidelines for each of these vectors to help minimize warpage and improve SMT margin and yield. Intel’s Srinivas Aravamudhan is leading the project.

Webinars are scheduled for June 14 (8 am Pacific) and 15 (9 am China time) to discuss the project background, scope and plan, and explain the signup steps to join the project.

To register for the June 14 webinar, visit https://inemi.webex.com/mw3200/mywebex/default.do?service=1&siteurl=inemi&nomenu=true&main_url=%2Fmc3200%2Fe.do%3Fsiteurl%3Dinemi%26AT%3DMI%26EventID%3D556170027%26UID%3D0%26Host%3DQUhTSwAAAAQXF8vDNXjQTO0iY2rF56eoTYqoOyGNgalS6r__8AJTMC4YSxQqd4NbdjaCMiVnHO2YwsaS2jbWeZjZOsig8zQD0%26RG%3D1%26FrameSet%3D2%26RGID%3Dr576621259c0a388a39d9865dac641681.

To register for the June 15 webinar, visit https://inemi.webex.com/mw3200/mywebex/default.do?service=1&siteurl=inemi&nomenu=true&main_url=%2Fmc3200%2Fe.do%3Fsiteurl%3Dinemi%26AT%3DMI%26EventID%3D556169807%26UID%3D0%26Host%3DQUhTSwAAAAT5U6McviZkopSK-pzqlaMiG2dy8ZRAMjGAMMWWRfWrv3ilmOwqHEkh828ESTl_1PJT3BDxjCv8IkaOrt57HA5r0%26RG%3D1%26FrameSet%3D2%26RGID%3Drc0dbc7ec9df907e5018b0508f4ad2a3b

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