AUSTIN, TX – Apple is expected to account for 28% of the total smartphone sensor market as a result of increased sensor adoption, says TechSearch International. Mobile devices, specifically smartphones, represent the greatest volume driver for MEMS and other sensors.

With the trend toward smart factories, industrial applications are also expected to account for increased sensor demand, says the research firm.

New FO-WLP versions are targeting high-performance applications, including networking, data centers, and artificial intelligence. Fan-out on substrate versions, such as ASE’s FanOut Chip-on-Substrate (FOCoS), TSMC’s InFO_oS, and Amkor’s Silicon Wafer Integrated Fan-out Technology (SWIFT) are being considered as a low-cost heterogeneous integration alternative to silicon interposers.

FO-WLP on substrate fills the interconnect gap between lower-density FO-WLP and the highest density silicon interposers.

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