HERNDON, VA – iNEMI has issued a call for participation for its iNEMI PCBA Cleanliness Project and will hold a webinar Apr. 16 and 17.

The objective of this new iNEMI project will be to predict and understand functional performance of cleaning single-row QFN component packages (as a representative of low-clearance, leadless electronic packages) in harsh environments through measurement of electrical and chemical effects under bottom-terminated components.

Current industry standards do not adequately address the cleanliness of residues trapped under bottom-terminated components, says iNEMI. OEMs and EMS providers must develop their own guidelines and requirements to ensure an acceptable level of cleanliness.

iNEMI members GE and Kyzen have led development of the statement of work for this project. This call-for-participation webinar provides an opportunity to discuss the plans outlined in the SOW, as well as the procedure for formally joining the effort.

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