ATLANTA, GA – UP Media Group Inc. seeks abstracts for PCB West 2019, to be held September 9-11, 2019, in Santa Clara, CA. The event includes a three-day technical conference and one-day exhibition to be held at the Santa Clara (CA) Convention Center.

PCB West annually provides a conference and exhibition focused on the design and manufacture of PCBs, HDI, electronics assembly and circuit board test. The September 2018 event attracted nearly 2,000 attendees.

Papers and presentations of the following durations are sought for the technical conference: one-hour lectures and presentations; two-hour workshops; and half-day (3.5 hour) and full-day seminars.  Preference is given to presentations of 2 hours in length or more, and no presentations of less than one hour will be considered.

Suggested paper and presentation topics include:

Design
•    RF and microwave design
•    Signal integrity
•    LED design and assembly
•    High-speed, high-frequency design
•    Flex circuit design
•    Component placement
•    EMI/EMC analysis
•    Thermal analysis and management
•    HDI design
•    PCB design/layout basics
•    Component library creation and management
•    Design for manufacture
•    Packaging design
•    Mixed-signal design
•    Area arrays
•    FPGA design and implementation
•    Design team collaboration

Fabrication
•    PCB fabrication
•    Flexible circuit manufacturing
•    HDI
•    Surface finishes
•    Embedded passives and active devices
•    Industry forecasts, and business and supply chain issues

Assembly
•    Electronics assembly
•    New component packaging
•    Screen and stencil printing
•    Component placement
•    Soldering and materials
•    Test and inspection
•    Environmental legislation (REACH, RoHS2, etc.) and its effects
•    Industry forecasts, and business and supply chain issues

Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology.

Abstracts of 100 to 300 words and speaker biographies should be submitted to UP Media Group at https://pcbwest.com/submit-an-abstract by February 25, 2019.

Anyone may submit an abstract to present a course at PCB West 2019, and presenters may present more than one paper or teach more than one course. A separate abstract must be submitted for each course.

If selected, a detailed presentation outline and final paper or presentation is due August 12, 2019. PRINTED CIRCUIT DESIGN & FAB and CIRCUITS ASSEMBLY magazines are media partners for the event.

For more information about PCB West, visit pcbwest.com or contact Director of Group Shows, Alyson Corey at 678-234-9859; acorey@upmediagroup.com.

About UP Media Group Inc.
UP Media Group Inc. (UPMG) (upmediagroup.com) serves the global PCB community through print, digital and online products, as well as live and virtual events. UPMG publishes PRINTED CIRCUIT DESIGN & FABTM (pcdandf.com) and CIRCUITS ASSEMBLYTM (circuitsassembly.com), as well as the PCB UPdateTM (pcbupdate.com) e-newsletter. UPMG also produces trade shows and conferences, including PCB WestTM (pcbwest.com), the PCB2Day workshops (pcb2day.com), and the PCB Chat (pcbchat.com) podcast series.

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