NEVADA CITY, CA – Advanced IC packaging revenues totaled nearly $24 billion in 2017, says New Venture Research, and by 2022 that share is expected to rise to nearly 42% based on annual revenues of almost $38 billion.

Between 2017 and 2022, the compound annual growth rate for the advanced packaging market will be 9.7%.

More than ever before, IC packaging technology is being challenged by two distinct, yet closely linked product trends, says NVR. On the one hand, consumers demand more powerful electronics products – from computers to tablets to smartphones – that provide more features and greater functionality; on the other hand, they want their products to be smaller and more lightweight and ergonomic. Meeting this demand requires manufacturers to develop advanced IC packages that combine devices with smaller form factors and ever‐greater silicon integration.

Flip chip assembly is enabling manufacturers to improve on everything from assembly cycle times to thermal dissipation and the all‐important package size, according to the research firm.

MCPs (multichip packages) are working their way in increasing numbers into cellular telephones, base stations, PDAs, MP3 players, camcorders, digital video recorders, digital cameras, notebook computers, PCs, Internet routers and switches, and servers and workstations. They are also key products for specialized medical applications.

Compound annual growth rates through 2022 for multichip packaging unit shipments by application are as follows: cellular phones, 12.7%; automotive/aerospace, 11.9%; medical/industrial, 10.8%; servers/workstations, 10.4%; Internet routers/switches/controllers, 9.4%; laptop and notebook computers, 8.6%; wireless base stations, 7.3%; tablets and PDAs, 6.8%; set‐top boxes/DVRs, 6.7%; digital cameras, 5.1%; camcorders, 4.4%; desktop PCs, 3.4%; MP3/MP4 players, ‐0.3%; and other, 9.8%.

Total multichip packaging units are expected to be 18 billion by 2022, a CAGR of 10.1%.

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