AMSTERDAM – The 2019 Electronics in Harsh Environments Conference will take place here April 2-4.
The three-day technical event is focused on building reliable electronics used in power electronics and harsh environments.
Specific topics include building reliable high-density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware.
Challenging areas such as high-temperature soldering, solder material advances, and new standards are presented.
This year’s technical conference will feature speakers from Collins Aerospace, Fiat Chrysler Automobiles, Fraunhofer, Henkel, McLaren Automotive, and Robert Bosch GmbH.
For more information, visit https://www.smta.org/harsh.