SAN DIEGO – Jan. 29, 2019 – CIRCUITS ASSEMBLY and PRINTED CIRCUIT DESIGN AND FAB announced the winners of the 2019 New Product Introduction Awards for electronics assembly equipment, materials, software, and PCB fabrication.

The 12th annual NPI Awards recognizes leading new products during the past 12 months. An independent panel of practicing industry engineers selected the recipients.

The winners are:

Aculon: Coatings/Encapsulants (NanoProof 8.5)
AIM Solder: Cored Wire (RX18 No Clean Wire Solder)
ANDA Automation: Cleaning Equipment (In-Line AP-460 Atmospheric Plasma)
ASYS Group Americas: Process Control Tools (RFID Setup Control)
BPM Microsystems: Software – Production (WhisperTeach+)
BTU International: Soldering – Reflow (Aqua Scrub Flux Management)
Data I/O Corp.: Device Programming (Job Composer)
ESE: Screen/Stencil Printing (ESE US-2000XF Screen Printer)
ESI: Drilling (Geode)
Fuji America: Automation Tools (SmartWing Multi Axis Robotic Solution)
Hanwha Techwin Automation Americas: Component Placement – High-Speed (HM520)
Henkel Corp.: Underfills (Loctite Eccobond UF 1173)
Henkel Corp.: TIMs (Bergquist Gap Pad TGP 7000ULM)
Juki: Component Placement – Multi-Function (RS-1XL)
Juki: Component Storage (Autonomous Material Handling System)
Juki: Labeling Equipment (Incoming Material Station)
Koh Young America: Software – Process Control (Ksmart Process Optimizer)
Koh Young America: Test & Inspection – SPI (KY8030-3)
Kurtz Ersa: Soldering – Selective (Ersa Versaflow 4XL)
Kurtz Ersa: Rework and Repair Tools (Ersa HR 600 XL)
Kyzen: Cleaning Materials (Aquanox A4727)
PVA: Dispensing Equipment (MR2 Metered Rod Dispenser)
Rogers Corp.: Laminates (Magtrex 555 High Impedance Laminates)
Saki Americas: Test & Inspection – AOI (Saki Self-Programming (SSP) Software)
Scienscope: Test & Inspection – AXI (AXC-800 II)
Shenmao America: Flux (SM-862 Liquid Flux)
Thermaltronics USA: Soldering – Alternative (TMT-R9800S Soldering Robot)

The awards were presented during a ceremony at IPC Apex Expo in San Diego.

“Competition was fierce, as some categories had as many as five entries,” said Mike Buetow, editor-in-chief of CIRCUITS ASSEMBLY and PCD&F. “The judges particularly liked the level of automation in the component storage and alternative soldering categories. Special recognition goes to Juki and Ersa, winners of multiple categories.”

About UP Media Group Inc.

UP Media Group Inc. (UPMG) ( serves the global PCB community through print, digital and online products, as well as live and virtual events. UPMG publishes PRINTED CIRCUIT DESIGN & FAB ( and CIRCUITS ASSEMBLY (, as well as the PCB UPdate ( e-newsletter. UPMG produces trade shows and conferences, including PCB West ( and the PCB2Day workshops ( UPMG also produces the PCB Chat podcast (


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