MORRISVILLE, NC – iNEMI is offering two free webinars on July 9 to provide survey results of the New Package Technology Qualification Methodology project.

The project is evaluating methods currently used by the electronics manufacturing industry to qualify new packages and materials.

The iNEMI project team conducted two industry surveys to assess current methodologies and define use conditions to identify potential gaps in common industry practices. A summary of their key findings, and recommendations about how these gaps should be addressed, will be covered.

To register for Session 1 – Asia Pacific, visit https://tinyurl.com/y22nfhew.

To register for Session 2 - The Americas/EMEA, visit https://tinyurl.com/y6qpscog.

For more information, visit https://tinyurl.com/y25cx5hw.

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