MORRISVILLE, NC – iNEMI invites participation in a survey that aims to assess the planning and readiness levels of the electronics manufacturing industry for the implementation of low-temperature solders in high-volume board assembly.

This survey focuses on the timeline to implementation, the level of effort required to ensure high-volume manufacturing capabilities and looks to identify any open issues that need to be addressed.

If a company has no plans to assess low-temperature solders, that is also valuable input.

Results from this survey will help inform the industry on the rate of deployment of low-temperature solder to date, as well as the timeline and estimated effort required to enable this technology further into high-volume production.

iNEMI will leverage the results to identify the key gaps requiring further investigation, leading to collaborative efforts/projects to ensure supply chain and high-volume assembly readiness.

A summary of the results will be presented in an iNEMI webinar in the first quarter of 2020.

To take the survey, visit https://tinyurl.com/yxy3p9js.

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