AUSTN, TX -- Continued monolithic integration is expensive and can suffer from the defect density yield loss associated with large die.

As a result, an increasing number of companies are turning to new architectures using chiplets to achieve the economic advantages lost with expensive monolithic scaling.

That's according to a new report from TechSearch International. Advanced Packaging Update (APU) details advantages of chiplets and provides examples in production today as well as a preview of future end-products. The a 45-page report also provides an update on embedded bridge developments and a forecast for high bandwidth memory (HBM). The TechSearch report peeks inside Apple’s latest iPhone with a count of the wafer-level packages (WLPs) and finds a surprising amount of underfill.

Quarterly and annual OSAT financial trends are also examined. The report include full references and an accompanying set of 52 PowerPoint slides.

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