Macromelt MM6208 low-pressure molding material is for high thermal stability and chemical resistance. Has a 95°C relative temperature index rating; reportedly the highest RTI rating in its class. Uses an application pressure of between 20 and 500 psi. Is for certain automotive, consumer and appliance applications.
Henkel, www.henkel.com/electronics
Vision System Alignment provides fiducial location (used to align the PCB to the stencil in X/Y/Theta) and post-print inspection (used to detect over and under print). Uses a high-resolution 1024 x 768 pixel resolution camera system. Fiducial location function features pattern recognition to locate fiducials on the PCB and stencil. Includes multi-stage sub pixeling algorithms. 2-D Post-Print Inspection function reportedly ensures proper solder paste application to the printed circuit board with a field of view of 63 mm2 and an inspection shot rate of < 220 ms. Grayscale-based inspection detects excess solder paste and insufficient solder paste.
Milara, www.milarasmt.com
M.O.L.E. MAP 3 free software moves from separate programs to one that now supports all current ECD instrument platforms. Has nine environments: user selectable combinations of M.O.L.E. and RIDER pairing that separate one profiling data acquisition activity from another. Environments are basic profiling; WaveRider; OvenRider; OvenChecker; MiniMOLE rH; solar metallization and others.
ECD, www.ecd.com
Manual Lead Tinning System (MLTS) is for re-tinning leads of fine-pitch quad flat pack SMDs in-house without bridging. Is reportedly ideal for hi-rel, military, and avionics component refurbishing requirements. Employs a tinning method using a “side wave” solder nozzle that is purged with nitrogen. Side wave process uses natural cascade of the solder to scrub the old plating off, while wicking away excess solder. Is a work station for one person to handle all forms of component lead tinning. Can be configured with one or two solder pots with either the side wave or straight immersion nozzles, and flowing flux station. Solder pots and fluxers are operated through foot switches.
ACE Production Technologies, www.ace-protech.com
Insignum 3000 laser markers mark multi-up boards at high speeds with text, barcodes and DMC codes, all on the surface of the solder mask.
Asys Group, www.asys-group.com
X5 Prof printer contains EKRA technology, such as iROCS (rapidly oscillating cleaning system), Dual iPAG (integrated paste and glue dispensers), and iQUESS (quick exchange squeegee system). Has an 8 sec. cycle time and an EKRA Simplex touch screen interface.
Asys Group, www.asys-group.com
ESA Coach is an evaluation and training kit supporting embedded system access technologies. Demonstration board enables the practical training of ESA technologies such as boundary scan, processor emulation test, and chip embedded instruments by means of respective tutorials; allows for the development and validation of individual IP. Includes a microcontroller with ARM core, an FPGA, various boundary scan circuits, NAND and NOR Flash, DDR2-SDRAM, a color display, and diverse operating elements. Demonstration board provides an extension connector and various fault switches to verify the single test operations’ diagnosis ability. Also contains a demo version of System Cascon Release 4.6, VarioTAP, and ChipVORX models for processor emulation or controlling FPGA embedded instruments.
Goepel electronic, www.goepel.com
OCRMax is a tool for optical character recognition and verification applications. Can use across all In-Sight vision system and VisionPro vision software platforms. Can handle character variations, text skew, proportional fonts and variable string lengths. Reportedly has superior character segmentation capability; takes each character line and splits it into individual regions that contain one character. Can handle distorted, touching and variably spaced characters; can accommodate uneven surfaces and lighting variations.
Cognex, www.cognex.com/OCR
Loctite UF3810 underfill reportedly provides high reliability, while permitting easier reworkability. Is halogen-free, completely reworkable, and has a glass transition temperature (Tg) of 100°C, delivering thermal cycling reliability for wafer-level CSP and PoP devices. Is suited for handheld communication and entertainment applications. Delivers drop and shock protection and improved thermal cycling reliability for fine-pitch (0.5mm pitch and below) area array devices. Cures quickly at 130°C.
Henkel, www.henkel.com/electronics
Modular StripFeeder is for loading tape-and-reel components onto compact modules for prototyping and high-mix/low-volume applications. Features adjustable rails and can be adjusted by unlocking the rails and sliding them to the desired width. Holds the components securely in the tracks to prevent parts from being miss-picked, flipped in the pocket or lost. Can remove rails to accommodate larger components up to 120mm tape width, and larger in some cases. Are compatible with paper and emboss tape simultaneously, and are ideal for low-volume/high-mix applications and prototyping. Are compatible with any style SMT pick-and-place equipment or JEDEC-style tray feeders.
Count On Tools, www.cotinc.com
Triton contactor is for high-end digital applications: servers, computers, mobile smartphones, digital TVs and graphics. Offers enhanced compliance window to accommodate stack height variations, an optimized force to support large BGAs and LGAs, and multisite package test. Has up to 20GHz differential bandwidth.
Multitest, www.multitest.com/Triton
3M Static Management Program is designed to improve product quality and production yields for manufacturers of electronic devices and components. Offers product, software and service solutions. Provides tools and training to support an EOS/ESD control program and help comply with ANSI/ESD S20.20. Enables process controls for electronics assembly, test and repair. Can monitor production environments in real-time. Components include facility EOS/ESD assessment; installation; training; continuous monitoring, and ongoing support. Is reportedly ideal for electronics manufacturing and repair facilities where components and processes are sensitive to threats of EOS and ESD, including aerospace, automation, communications, defense, industrial control and medical industries.
3M, www.3Mstatic.com