Hirose has expanded its DF22 Series of power connectors with the DF22B branch adapter, designed to simplify wiring and reduce cabling and installation time. The adapter enables branch wiring and supports up to 30A per contact at 1000V AC/DC with a four-point contact design and highly conductive materials. The series offers multiple configurations, straight, right-angle, and in-line wire-to-board, with three housing types featuring different guide keys and color variations to prevent mis-mating in systems using multiple connectors. For harsh environments, the DF22 Series straight header variant supports potting up to 10mm. The new DF22B branch adapter is designed for compact, high-current branching applications such as semiconductor equipment, industrial robots, conveyors, mounting machines and service robots.

Henkel has introduced Loctite TCF 14001, a high thermal conductivity silicone liquid TIM designed to meet the thermal control requirements of 800G and 1.6T optical transceivers. A thermal conductivity of 14.5 W/m-K. The two-part silicone formulation features low volatility and minimal outgassing. Its filler technology allows for automated dispensing with stable flow, strong adhesion and tolerance for gap variations. Beyond AI data centers, Loctite TCF 14001 is also suitable for other high-power applications in telecom, automotive, power generation and industrial automation. 

Promation has unveiled the PANDA-460 Laser Marking System. Supports CO₂, YV04 and UV Keyence laser heads within a standard work envelope, enabling high-speed marking on a wide range of substrates. The PANDA-460 leverages Promation’s proprietary software to provide remote access for programming, data transmission, diagnostics and maintenance. Built-in vision alignment, orientation validation, code verification and double-sided PCB marking capabilities. Designed for Smart Factory integration, the PANDA-460 is fully compatible with Promation’s broader automation ecosystem, including robotic soldering, PCB handling, AMRs and inline process equipment.

ASMPT has launched the Siplace Placement Platform, a newly developed SMT solution engineered to deliver up to 30% higher productivity for automotive, IT and network infrastructure sectors. The platform offers floor space performance while maintaining compatibility with existing feeders and SIPLACE software. It fits into ASMPT’s intelligent factory framework to support scalable, high-volume electronics manufacturing.

ASMPT has introduced the DEK Oversized Solder Paste Printer, engineered to meet the demands of advanced applications in AI and high-performance computing. Optimized for oversized circuit boards. This platform is designed to support the next generation of high-density assemblies and integrates with intelligent factory software for automated production environments.

ITW EAE Vitronics Soltec Centurion reflow oven with CoolClean improves process reliability by removing contaminated gases from the cool zone, reducing flux residue, and extending maintenance intervals.

ITW EAE Electrovert EcoWave wave soldering system integrates two patented technologies to improve hole fill, reduce bridging defects and lower dross production.

Data I/O Corporation expands its Unified Programming Platform Strategy. The Unified Programming Platform supports a transition from design and NPI to automated production. With Data I/O’s refreshed manual programmer product lines, customers can create and validate preprogramming jobs early in the design process, then transfer them directly to an automated PSV programming system for volume manufacturing—all on a single, scalable platform. 

BTU International Aurora 125N convection soldering reflow oven combines flexible zone configurations, precise thermal control, and optimized gas flow for uniform heating for high-mix electronics manufacturing. Enhanced accessibility simplifies maintenance, while optional Aqua Scrub flux management system supports extended uptime and sustainable operation.

Europlacer is set to debut a new software platform at Productronica. The platform is designed to place manufacturers at the center of their production ecosystem, transforming raw factory data into actionable insights that enhance operational agility and uptime. By providing real-time visibility and control over the entire production flow, it supports High-Mix electronics environments where flexibility and efficiency are critical.

Kyzen ANALYST offers manufacturers a process control solution designed to ensure precision and reliability in electronics cleaning applications. Using advanced sonic velocity technology, ANALYST² delivers 0.1% resolution concentration readings in real time, unaffected by variables like conductivity, color or transparency. Provides tight control over cleaning bath chemistry, ensuring stable processes and reducing variability. The system is compatible with more than 60 cleaning chemistries, integrates seamlessly with existing production lines, and helps reduce waste, improve yield and maximize throughput. Ideal for high-reliability sectors such as automotive, aerospace, and medical electronics.

Viscom SE is set to debut vAI ProVision, showcasing a major advancement in AI-driven inspection automation. As part of Viscom’s vAI platform, this new software feature uses artificial intelligence to automate and optimize the creation of 3D AOI and 3D AXI inspection programs, cutting time from hours to minutes. By embedding AI directly into the vVision Software environment, vAI ProVision enables nearly autonomous program generation, delivering deep inspection coverage, exceptional image quality, and consistent results.