Indium Corp. SiPaste C312HF halogen-free, cleanable solder paste is for fine-feature printing.

Automated Production Equipment (A.P.E.) Intruder is a complete hot air BGA rework station with split vision placement/removal capability.

Stackpole Electronics has expanded its sensing portfolio with the CSSU2512, a 5-watt current sense resistor. The all-metal device leverages a thermally efficient structure, delivering 5W performance in a standard 2512 footprint. The CSSU2512 achieves thermal behavior comparable to that of typical 3W chips. Offered in 1–10 mΩ values with 1% tolerance and a 50-ppm TCR, the AEC-compliant resistor supports applications requiring durable, low-resistance sensing. Pricing ranges from $0.22–$0.30 in full-package quantities, with volume options available through Stackpole and authorized distributors.

Vision Engineering's ProteQ VISO is a 3D digital stereo microscope that integrates an autostereo display for eyepiece-free viewing. The system uses twin cameras and eye-tracking to generate a three-dimensional image on a flat screen. Provides an upright viewing angle, adjustable display and a 10:1 zoom range. Users can switch between 3D and 2D viewing modes for individual or group evaluation. Digital functions include image capture, playback, video streaming, picture-in-picture, overlays, annotation and on-screen measurement. The system integrates with external software such as Dimension Two and provides access to email, Teams, and shared files directly through the interface. Additional options include low-heat illumination, a detachable display for cleanroom workflows, quick-change lighting modules, lockable detents and optional 360° viewing capability.

Shenmao Technology has released SMF-TA52, a zero-residue transient adhesive developed for assemblies using formic acid reflow. The material is designed to hold solder preforms, dies and wafers in position during heating while remaining compatible with the reduction chemistry inside formic acid reflow ovens. SMF-TA52 decomposes during the thermal cycle and reaches zero residue at peak reflow. The adhesive supports dispensing and jetting applications and works with formic acid reflow, vacuum reflow and silver sintering processes. SMF-TA52 is SVHC-free, halogen-free and no-clean.

Zero Ohm Jumpers and dummy components are now available in multiple body sizes and pitches for training use and PCB design changes. SnPb and lead-free versions are stocked for immediate shipment. The components support bridging, routing and current conduction across board traces and can replace obsolete parts or enable modifications after production begins. The lineup includes the SOT23 Zero Ohm Jumper Package, which allows designers to alter routing without producing a new board layout.

The SQ5000Pro combines AOI, SPI and CMM-grade metrology in a single in-line system designed for advanced electronics production. The platform captures dimensional, positional and volumetric data in seconds. Two new 500-series Multi-Reflection Suppression (MRS) sensors –HR and HS variants – deliver distortion-free imaging on reflective and complex surfaces. Unified architecture is suited for applications including fine-pitch SMT, advanced packaging, 0201 metric components, sockets and connectors and precision geometry measurement. Coordinate measurement software suite enables CMM-level accuracy at production throughput, while the updated AutoProgram tool leverages AI to reduce setup time and identify features and inspection regions.

The i7090 from Keysight integrates in-circuit flash programming, LED and boundary-scan test methods within a single platform for high-volume PCBA lines. Up to 20 parallel test cores permit simultaneous testing of multiple boards, and the 600mm footprint is suited for dense factory layouts. Modular expansion supports shifts in production scale without major line changes.

Mycronic introduces the MYPro A41 series, a new pair of placement systems developed for manufacturers assembling large printed circuit boards. The MYPro A41DX-17 and MYPro A41SX-17 extend the capabilities of the MYPro A40 platform with support for substrates up to 1000×609 mm and thicknesses up to 12.5 mm when used with the T1000 conveyor. The A41DX-17 offers a rated speed of 49 000 components per hour and includes electrical component verification as standard. An MX7 high-speed mount head supports heavy or oversized boards up to 10 kg. Setup and programming follow the same interface as earlier Mycronic models, allowing operators to adopt larger-format production with minimal retraining.

Molex has released the Quad-Row Shield Connector, a board-to-board interface that incorporates an integrated metal EMI shield within a four-row signal structure. Uses an internal shielding element to limit electromagnetic and RF interference without external shielding components. The design supports up to 80 signal pins with two power-pin sets. It retains the company’s quad-row layout while adding EMI control at 2.4–6GHz. The connector is intended for compact devices such as wearables, mobile systems, AR and VR units, and other consumer hardware requiring space-efficient board-to-board connections.

Stackpole Electronics HCSK1216 high current four terminal shunt resistor separates supply current and voltage sensing paths, minimizing power loss and eliminating lead resistance errors.

Essemtec Tarantula Dual Lane dispensing platform supports up to three valve heads, and Jet-on-the-Fly achieves up to 1.1 million dph at maximum frequency, and an average of 350,000 dph for complex boards in high-speed paste jetting or 2 million dph for glue jetting applications.