The Gen 2 TMBS rectifier module series consists of 100V trench MOS barrier Schottky devices designed for industrial power conversion applications. Offered in a fully insulated, industry-standard SOT-227 package, the modules deliver forward voltage drops as low as 0.83V and support high current ratings with negligible reverse recovery charge. The lineup includes dual-diode parallel configurations rated at 100A, 200A and 400A, as well as a 150A single-phase bridge. Devices support operation up to +150°C and are intended for use in high-frequency converters, industrial SMPS, welding equipment, telecom power systems, 48V battery-powered vehicles and large battery blocking applications. 

ElectronicsGPT is an AI agent designed for electronics procurement workflows, providing access to technical specifications, part alternatives, availability data and supply chain information through a conversational interface. Built on Luminovo’s verified supply chain datasets, the tool allows users to query millions of electronic components updated weekly, retrieve datasheets and extract compliance-related technical details. Supports automated task execution and alert setup, including monitoring part availability and supplier risk factors, through background agents that run independently of active user sessions. Available free to use.

The RNAN series is a thin film precision chip resistor line built on an aluminum nitride substrate to support higher power dissipation. Uses a high-thermal-conductivity aluminum nitride base to enable increased power density compared with alumina substrates, allowing thin film nichrome resistors to be applied in higher-power designs. Supports power ratings up to 0.5W in 0603, 1W in 0805, 2W in 1206 and 6W in 2512 while maintaining acceptable hot-spot and terminal temperatures. Designed for applications requiring precision resistance, thermal performance and reliability in space-constrained layouts.

The F40/F40s is a Full HD digital microscope system designed for configurable, high-resolution optical inspection using an upgraded image sensor and a motorized 40:1 zoom lens. Supports Full HD video at 60fps with low latency and advanced signal processing to reduce motion blur and maintain image stability during inspection of moving objects. Features enhanced sensor sensitivity and dynamic range, motorized zoom with fast autofocus, a 7-blade aperture, and a free working distance of 226mm. Provides up to 30:1 optical zoom with 1.3x digital zoom and integrates with Inspectis pro utility and metrology software.

EP54TC is a two-component, electrically insulating epoxy designed for heat sink bonding and thermal management applications requiring high thermal conductivity. Delivers thermal conductivity exceeding 6W/(m·K). Formulated with a 5–30µm specialty filler to support thin bond lines and efficient void filling, achieving thermal resistance of 5–7×10⁻⁶K·m²/W. Exhibits a tensile modulus above 1,000,000psi at room temperature and is serviceable from –73°C to +204°C. Features a recommended cure schedule of 2 hours at 80°C with a 2–4 hour post cure at 90–125°C, a mixed viscosity of 100,000–200,000cps, and a working life of 60–90 minutes. Available in ounce through gallon kit sizes for prototyping and production use.

RMCA automotive-grade thick film chip resistors from Stackpole are surface-mount components qualified to AEC-Q200 for use in automotive electronic applications. The series is designed for stable resistance performance under automotive operating conditions. RMCA resistors are manufactured on dedicated automotive production lines using controlled materials and process parameters.  The RMCA product line includes RMCA-HP and RMCA-UP variants, which provide increased power handling of approximately two to three times compared with standard RMCA devices of the same size. Devices are available in multiple case sizes, resistance values and tolerance options.

The YRH10W hybrid placer is a wide-type placement system designed to support both semiconductor die bonding and surface-mount component placement within one platform. Expands capability to accommodate 12-inch wafers and large-format printed circuit boards up to L510 × W460mm. Combines bare-die handling and SMT placement functions, delivering a bare-chip placement speed of up to 14,000 components per hour when supplied with wafers, along with placement accuracy of ±15µm. Designed for flexible production environments. 

The TR7600FB SII is a 3D automated X-ray inspection system. Optimized for specialized substrates, fine-pitch BGAs, multilayer boards and system-in-package (SiP) devices. Incorporates a newly developed X-ray imaging structure that allows the X-ray tube to operate in close proximity to the board surface without structural interference. This architecture supports detailed inspection of critical components requiring precise internal visibility. Powered by TRI’s AI Ecosystem, combining AI-driven inspection algorithms with metrology-based measurement capabilities. Supports AI Smart Programming.

PF606-P266J is a solder paste developed for high-speed jet dispensing applications in advanced electronics manufacturing. Designed for non-contact solder deposition. The formulation meant to maintain process stability across a broad range of jetting parameters. The solder paste uses a halogen-free flux system that supports strong wetting behavior and low residue levels. PF606-P266J supports ultra-fine solder powders from Type 5 through Type 7. The product is available in multiple alloy options, including SAC305, high-reliability alloys for automotive and industrial electronics and low-temperature alloys.

The VALID SL in-circuit and functional test system is designed for high-channel-count testing in demanding electronics manufacturing environments. Introduces a cable-free architecture with new 128-channel scanner cards, supporting configurations exceeding 4,480 channels for complex test requirements. Offers an expanded test area with both single-stage and dual-stage configurations and supports multi-job operation through Seica’s latest VIVA software interface. Integrates streamlined internal hardware access. Built to support scalable automation and intelligent test strategies for high-volume and high-reliability applications.

The VT171P single-channel and VT172U dual-channel transmissive sensors are surface-mount devices designed for position sensing in industrial, consumer and telecom applications. Housed in a 5.5mm × 4mm × 5.7mm package with a 42% increased dome height compared to previous-generation industrial devices. Supports greater mechanical design flexibility and increased vertical clearance for large code wheels in turn-and-push applications. Both devices integrate an infrared emitter with phototransistor detection and operate at a wavelength of 950nm. Deliver a typical output current of 1.5mA with a 3mm gap width, 0.3mm apertures, and rise and fall times of 14ms and 21ms. The VT172U adds dual-channel detection for direction sensing, while both devices support motion and speed detection for encoders, automation systems, consumer electronics, appliances, health and care devices, switches, relays, antennas, and mobile broadband equipment. 

The InoHD ultra-high-density smart storage system is designed to maximize SMT and electronic component storage while reducing factory floor space requirements. Eliminates traditional storage aisles by combining servo-driven mobile shelving with smart sensing and pick-to-light guidance. Supports storage densities of up to 310 SMT reels per square foot while maintaining guided access and real-time inventory verification. The system enables direct point-of-use material access with built-in verification to reduce picking errors. Accommodates more than 10,500 SMT reels within a 4ft × 8ft footprint, supporting space reduction compared with conventional stockroom layouts. Modular and scalable architecture designed for integration with existing MES and ERP platforms to reduce labor time and unnecessary material handling.