LYON, FRANCE – Fan-out packaging adoption has grown in the past year, with TSMC the leader, according to a new report from System Plus Consulting and partner Yole Développement. Samsung subsidiary Semco is most likely second, say the firms, with PTI as a potential OSAT outsider in FO.

TSMC has extended its lead in the H-D FO market, with gen-2 inFO HVM production and qualification of gen-3 inFO for Apple’s iPhone APE.

“TSMC understands industry technologies and applications are undergoing unprecedented change in a new digital megatrend-driven era,” said Favier Shoo, technology and market analyst at Yole. “Consequently, exciting technological developments exist to address these new demands.”

“We have seen a growth in adoption of FO packaging over the year,” said Stéphane Elisabeth, technology and cost analyst from System Plus Consulting. “It started a long time ago. Samsung has lost Apple’s APE packaging fight to TSMC thrice in a row since 2016. But, with Semco FO packaged APE+PMIC by panel-level manufacturing, the competitive landscape has been modified. Then, today, with PTI a potential leader in FO, an exciting new chapter in fan-out history begins.”

System Plus Consulting offers reverse engineering and cost analysis dedicated to FO packaging. The company proposes an overview of the FO technologies available on the market developed by leading packaging companies: Infineon, Nepes, TSMC, Samsung, and ASE.

Analysts also detail a comparative study of eight selected components from PMICs to processors, including radar MMICs using FO technologies. A new report highlights the technical choices made by leading OEMs and reveals a detailed cost-analysis of each solution.

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