ATLANTA, GA – UP Media Group Inc. today announced more than 45 technical sessions have been selected for PCB West 2020 this fall. Overall, more than 80 abstracts were submitted for the annual conference, which takes place September 8-11 at the Santa Clara, CA, Convention Center.

This year’s conference features a pair of extended talks from Lee Ritchey on power delivery system design and stackup design, plus three full days of classes from Rick Hartley. The conference covers everything from RF/microwave and mixed-signal design, circuit grounding, understanding material choices, flex circuits, signal and power integrity, to fabrication and assembly processes. Talks are aimed at the spectrum of backgrounds, from novice to advanced.

“When it comes to the technical conference, we were clearly more selective than ever this year,” said Mike Buetow, PCB West conference director and editorial director, UPMG. “Engineers and designers have limited knowledge of proper grounding, and we are emphasizing that, plus power distribution, to help overcome noise problems associated with power bus design.”

“For those interested in new component technology, we will have talks on designing and assembling heterogeneous packages, high-density chip-scale and 3-D packages, and more,” Buetow added.

In response to attendee feedback, the technical conference begins each day at 10 a.m. Attendees will also receive certificates indicating the number of hours of training received at PCB West.

On September 9, PCB West will feature 10 free presentations covering the design to assembly spectrum. Highlights include talks on electromagnetic fields, high-speed digital circuits, AI-based smart routers, land pattern design, and thermal management from companies such as Intel, NXP and Analog Devices.

All free talks will take place on “Free Wednesday,” to complement the one-day exhibition that features more than 100 leading companies.

The free keynote address will feature Dr. Brian Toleno, director of new technology at Microsoft, who will speak on Augmented Reality New Device Challenges and Enabling Industry 4.0. The keynote takes place at 11 a.m. on September 11.

PCB West annually provides a conference and exhibition focused on the design and manufacture of PCBs, HDI, electronics assembly and circuit board test. The event annually attracts nearly 2,000 attendees. The event includes a four-day technical conference and one-day exhibition to be held at the Santa Clara (CA) Convention Center.

For more information about PCB West, visit pcbwest.com or contact Director of Group Shows, Alyson Corey at 678-234-9859; acorey@upmediagroup.com.

About UP Media Group Inc.
UP Media Group Inc. (UPMG) (upmediagroup.com) serves the global PCB community through print, digital and online products, as well as live and virtual events. UPMG publishes PRINTED CIRCUIT DESIGN & FABTM (pcdandf.com) and CIRCUITS ASSEMBLYTM (circuitsassembly.com), as well as the PCB UPdateTM (pcbupdate.com) e-newsletter. UPMG also produces trade shows and conferences, including PCB WestTM (pcbwest.com), the PCB2Day workshops (pcb2day.com), and the PCB Chat (pcbchat.com) podcast series.

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