CAVE CREEK, AZ – High-Density Packaging (HDP) User Group is hosting a webinar to provide the latest information on standard requirements and developments in automotive electronics. The webinar will be held June 25.

Jan Vardaman, president and founder of Techsearch International will moderate; Stefan Gutschling of ZVEI will present Mobility Trends and Their Impact on The Automotive Supply Chain; Ventec Laminates’ Alun Morgan will discuss Power PCB requirements for Automotive Applications; Infineon’s Thorsten Meyer will discuss Automotive Packaging Trends – Challenges & Solutions; Art Creidler of UL will talk about the regulatory landscape for vehicle electronics and primary evaluation tools for PCB reliability demands in the new e-mobility market; and TTM’s Raj Kumar will talk about Considerations in Automotive PCB manufacture.

“Automotive Electronics is one of the fastest-growing segments of advanced electronics technology. We have planned an informational session that will cover the latest developments in automotive standards and automotive electronic packaging,” said Marshall Andrews, executive director of HDP User Group.

To register, send contact information (name, company information and email address) to either kima77@hdpug.org, martinc@hdpug.org, or larrym@hdpug.org.

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