BANNOCKBURN, IL – IPC and High Density Package Users Group have signed a memorandum of understanding, enabling a partnership, increased technical collaboration between groups, and a mutual path toward emerging and disruptive high-density interconnect technologies.

“Both IPC and HDP are member-driven organizations,” said Matt Kelly, IPC chief technologist. “Working together, both organizations will focus on next-generation HDI technology projects to benefit the electronics manufacturing industry. HDP is very well established, with more than 25 years of experience in R&D technology development. Resultant, new HDI learning and solutions will help drive IPC standards development activities, as well as training and education programs.”

IPC and HDP have worked together for many years on such electronics industry issues as electrochemical migration, high-density ball grid arrays, and board thickness on solder joint reliability.  Members of HDP have presented papers at IPC Apex Expo on high-frequency loss test methods for laminate materials and smooth copper signal integrity.

“A closer working relationship between IPC and HDP will bring significant advantages to both organizations and, as a result, to the industry,” said Marshall Andrews, executive director of HDP. “Electronics manufacturing technology is moving faster than ever with the introduction of 5G and automotive applications. Close cooperation at all levels of the supply chain will be necessary to address issues and implement the new materials and processes required to keep moving forward. IPC and HDP will help make those changes smooth and reliable.”

Register now for PCB West, the leading conference and exhibition for the printed circuit board industry! Coming this September to the Santa Clara Convention Center. pcbwest.com 

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