KEMPEN, GERMANY – The associations of the German electronics industry recommended a common certification, resulting in a new standard, which could be a breakthrough in the reassessment of soldering profiles.

Following the recommendations of the two associations, ZVEI and FED, Underwriters Laboratories will publish the recommended solder profiles in the next edition of UL 796, the test organization’s printed wiring board standard.

"The solution, which has been developed at a roundtable of both associations, is practice-oriented and constructive," said Rüdiger Dietrich, retired technical director, Peters. "Thanks to the successful cooperation of the two associations, we had a decisive influence on the creation of new specifications for multiple solder limits. The industrial sector worldwide will profit from the German initiative through the establishment within the UL international set of standards."

More than 30 participants evaluated many solder profiles from existing Pb-free and non-Pb-free solder processes. Additionally, companies involved produced various samples that were exposed to several reflow cycles.

Most of the solder profiles are covered by IPC-TM-650 method 2.6.27A and J-STD-020. The proposal submitted to UL by FED and ZVEI to realize the multiple solder limits comprises a solder profile, consisting of both IPC-TM-650 and J-STD-020, that counts on this surface solution and makes a certain flexibility of solder parameters in practical life possible.

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