BANNOCKBURN, IL – IPC today announced the release of a revision to its standard for design and assembly for implementing BTCs.

IPC-7093A, "Design and Assembly Process Implementation for Bottom Termination Components (BTCs)" is a complete overhaul and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues, the trade group said.

IPC-7093A includes a step-by-step process on how to design and incorporate BTCs into any card layout. Comprehensive descriptions on how to implement robust designs and assembly processes and troubleshooting guidance for common anomalies which can occur during BTC assembly are included.

Revision A adds guidance on elements for thermal pad design, thermal via usage, stencil design, assembly recommendations, reliability considerations, known issues/ defects to avoid. 

The standard is written for physical design, process and reliability engineers or managers responsible for design, assembly, inspection, and repair processes.

“BTCs are in integral part of electronic designs today,” said Matt Kelly, chief technologist, IPC, in a press release. “With increased product functionality, device miniaturization, and increased power consumption the need for optimized thermal management has never been higher.”

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